2011 by SYSTEM PLUS CONSULTING, all rights reserved. Samsung Galaxy S II
– Camera Module. 1. 9 rue Alfred Kastler - BP 10748 - 44307 Nantes Cedex 3 - ...
9 rue Alfred Kastler - BP 10748 - 44307 Nantes Cedex 3 - France Phone : +33 (0) 240 180 916 - email :
[email protected] - website : www.systemplus.fr
October 2011 - Version 1 Written by: Romain FRAUX
DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. © 2011 by SYSTEM PLUS CONSULTING, all rights reserved.
Samsung Galaxy S II – Camera Module
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Table of Contents 5. Manufacturing Process Flow…….…………………..….74
Glossary 1. Overview / Introduction……….……………….…........…4 – –
Executive Summary Reverse Costing Methodology
2. Company Profile………………..……………….……....….6 – –
CMOS Image Sensors – Volume Shipments Samsung Profile
3. Samsung Galaxy S II Teardown…………….……....….12 4. Physical Analysis………………………...……….............16 – – – – – – – – – – – – – – –
Synthesis of the Physical Analysis Physical Analysis Methodology Camera Module Views & Dimensions Camera Module X-Ray Camera Module Disassembly CIS Views & Dimensions CIS Markings CIS Pads CIS Microlenses CIS Pixels CIS Technology node Camera Module Cross-section CIS Cross-section Physical Data Summary Short Analyze of Camera Module Version 3
– – – –
6. Cost Analysis………………………….………………..…..80 – – – – – – – – – – – – – – – – – – –
Synthesis of the Cost Analysis Main Steps of Economic Analysis Yields Explanation Yields Hypotheses CIS Front-End : Hypotheses CIS FEOL + BEOL Cost CSI BSI Cost CIS BSI Cost per Process Steps CIS BSI : Equipment Cost per Family CIS BSI : Material Cost per Family CIS Front-End Cost CIS Back-End 0 : Test & Dicing CIS Wafer Cost (Front-End + Back-End 0) CIS Die Cost Camera Module Assembly - Hypotheses Optical Module Cost Auto-Focus Cost PCB/Housing Cost Camera Module Cost
7. Estimated Price Analysis….………………….……..…102 – – –
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved.
Global Overview CIS Process Flow BSI Detailed Process Flow Description of the CIS Wafer Fabrication Unit
Definition of Prices Manufacturer Financial Ratios Camera Module estimated Manufacturer Price
Samsung Galaxy S II – Camera Module
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Samsung Galaxy S II Teardown • Samsung used several sources for the assembly of the Galaxy S II camera modules. We found three camera module versions during our teardowns:
Version 1
Version 2
Version 3
• Versions 1 & 2 are very similar, they used almost the same assembly structure and share the same CMOS Image Sensor (Samsung CIS ref. S5K3H2YX03). •Version 3 use a different assembly structure and a different CMOS Image sensor (probably not made by Samsung). •Only the camera module version 2 is analyzed in this report. © 2011 by SYSTEM PLUS CONSULTING, all rights reserved.
Samsung Galaxy S II – Camera Module
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Physical Analysis Methodology •
Package is analyzed and measured. –
X-ray pictures are used to identify the package construction and the redistribution.
•
Package is opened in order to identify the elements constituting it.
•
Cross-section are realized to get overall package data : dimensions, main characteristics.
•
An analysis of the technologies and of the materials used is performed.
Spring
Lens #1
Spacer #1
Lens #2
Metal housing
Coil
Flex PCB IC #3
Spacer #2
Lens #3 Barrel Spacer #3
Ferrite Lens #4 Flex PCB
Spacer #4
Glass plate with IR Filter CIS
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved.
Samsung Galaxy S II – Camera Module
4-layers rigid-flex PCB 4
Camera Module Disassembly
Ferrite
Module side view
Module side view
Flex PCB
Module side view © 2011 by SYSTEM PLUS CONSULTING, all rights reserved.
Module side view Samsung Galaxy S II – Camera Module
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CIS Microlenses
Microlenses – SEM view
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved.
Samsung Galaxy S II – Camera Module
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Camera Module Cross-Section
Camera module cross-section – Optical view © 2011 by SYSTEM PLUS CONSULTING, all rights reserved.
Samsung Galaxy S II – Camera Module
7
CIS Cross-Section
Thrench cross-section – SEM view © 2011 by SYSTEM PLUS CONSULTING, all rights reserved.
Samsung Galaxy S II – Camera Module
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CIS Process Flow
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved.
Nokia 2330 Camera Module – ST CIS + Heptagon WLO
9
CIS BSI Cost per process steps
CIS BSI Steps Cost (Simulated with MEMS CoSim+ Cost Simulation Tool)
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved.
Nokia 2330 Camera Module – ST CIS + Heptagon WLO
10
CIS Wafer Cost (Front-End + Back-End 0)
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved.
Nokia 2330 Camera Module – ST CIS + Heptagon WLO
11
