Thermal conductivity, w/m.k. Hardness, Shore D. Tensile strength, Mpa. Linear Shrinkage 10g %. Thermal cycle, times. -20
DE109 Technical Data Sheet Jan.2007
DE109 Technical Data Sheet Product Description
Electronic Properties of Cured Materials
DOVER DE109 is the excellent product in IC bonding as one
Arc Resistance, seconds (ASTM D495)
kind of the single-epoxy adhesive. It’s specially used in the
180 25℃
encapsulation by the IC electronic crystal and applicable for
K
D
all kinds of electronic products like calculator, PDA, LCD,
1kHz
4.96
0.008
meter etc. Good fluidity, steady flow, easy to use and low
10kHz
4.91
0.110
pot height are the excellent features of DE108. This product
100kHz
4.84
0.129
can protect the IC effectively because of its cured properties
K= Dielectric constant by ASTM D150
like non-combustible, counter bending, low shrink and low
D=Loss Factor by ASTM D150
hygroscopicity. This encapsulation is an excellent quality
Volume Resistivity
ASTM D257
3.1 x 10
16
product which can pass temperature test, moisture test,
Surface Resistivity ASTM D257
3.3 x 10
16
electrify test and temperature cycle in long time. It’s especially designed for non-Lead techniques which can
Cure Condition Pre-heat temperature ℃
50-80
Gel time @150℃,sec
130
Typical Application
Cure condition@130℃,min
90
IC encapsulate, COB
Cure condition@150℃,min
60
endure high temperature.
Typical Properties of Uncured Material
General Information
Color
Black
For safe handling information on this product, consult the
Thixotropic ratio
1.10
Material Safe Data Sheet (MSDS).
Specific Gravity@25℃
1.65
This product is not recommended for use in pure oxygen
Pot life @25℃
25 days
and/or oxygen rich systems and should not be selected as a
Shelf life @5℃
6 month
sealant for chlorine or other strong oxidizing materials.
Viscosity,@25℃,pa.s
30-50
fineness,μm
＜40
Physical Properties of Cured Material
Storage Product shall be ideally stored in a cool, dry location in unopened containers at 5°C unless otherwise labeled. To prevent contamination of unused product, do not return any
Coefficient of Thermal Expansion, (ASTM D3386),10 /℃
19-35
material to its original container.
Tg, ℃, (ITM65B)
150
Data Range
Heat of Reaction, J/g
300
The data contained herein may be reported as a typical value
Elongation,%
1.70
and/or range. Values are based on actual test data and are
Specific Gravity@25℃
1.65
verified on a periodic basis.
Thermal conductivity, w/m.k
0.33
Hardness, Shore D
≥85
Tensile strength, Mpa
95
Linear Shrinkage 10g %
1.80
-6
Thermal cycle, times -20℃/2hrs～+60℃/2hrs
250
Moisture test, h 200
80℃, 90% Moisture absorption,% 24hrs@25℃ Chloride, ppm
≤0.15 1.0
Note All data accounted herein are for your reference only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user's responsibility to determine suitability for the user's purpose of any production methods mentioned herein and to adopt such precautions as may be devisable for the protection of property and of persons against any hazards that may be involved in the handling thereof.
NOT FOR PRODUCT SPECIFICATIONS THE TECHNICAL INFORMATION CONTAINED HEREIN IS INTENDED AS REFERENCE ONLY
