DE109 Technical Data Sheet

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Thermal conductivity, w/m.k. Hardness, Shore D. Tensile strength, Mpa. Linear Shrinkage 10g %. Thermal cycle, times. -20
DE109 Technical Data Sheet Jan.2007

DE109 Technical Data Sheet Product Description

Electronic Properties of Cured Materials

DOVER DE109 is the excellent product in IC bonding as one

Arc Resistance, seconds (ASTM D495)

kind of the single-epoxy adhesive. It’s specially used in the

180 25℃

encapsulation by the IC electronic crystal and applicable for

K

D

all kinds of electronic products like calculator, PDA, LCD,

1kHz

4.96

0.008

meter etc. Good fluidity, steady flow, easy to use and low

10kHz

4.91

0.110

pot height are the excellent features of DE108. This product

100kHz

4.84

0.129

can protect the IC effectively because of its cured properties

K= Dielectric constant by ASTM D150

like non-combustible, counter bending, low shrink and low

D=Loss Factor by ASTM D150

hygroscopicity. This encapsulation is an excellent quality

Volume Resistivity

ASTM D257

3.1 x 10

16

product which can pass temperature test, moisture test,

Surface Resistivity ASTM D257

3.3 x 10

16

electrify test and temperature cycle in long time. It’s especially designed for non-Lead techniques which can

Cure Condition Pre-heat temperature ℃

50-80

Gel time @150℃,sec

130

Typical Application

Cure condition@130℃,min

90

IC encapsulate, COB

Cure condition@150℃,min

60

endure high temperature.

Typical Properties of Uncured Material

General Information

Color

Black

For safe handling information on this product, consult the

Thixotropic ratio

1.10

Material Safe Data Sheet (MSDS).

Specific Gravity@25℃

1.65

This product is not recommended for use in pure oxygen

Pot life @25℃

25 days

and/or oxygen rich systems and should not be selected as a

Shelf life @5℃

6 month

sealant for chlorine or other strong oxidizing materials.

Viscosity,@25℃,pa.s

30-50

fineness,μm

<40

Physical Properties of Cured Material

Storage Product shall be ideally stored in a cool, dry location in unopened containers at 5°C unless otherwise labeled. To prevent contamination of unused product, do not return any

Coefficient of Thermal Expansion, (ASTM D3386),10 /℃

19-35

material to its original container.

Tg, ℃, (ITM65B)

150

Data Range

Heat of Reaction, J/g

300

The data contained herein may be reported as a typical value

Elongation,%

1.70

and/or range. Values are based on actual test data and are

Specific Gravity@25℃

1.65

verified on a periodic basis.

Thermal conductivity, w/m.k

0.33

Hardness, Shore D

≥85

Tensile strength, Mpa

95

Linear Shrinkage 10g %

1.80

-6

Thermal cycle, times -20℃/2hrs~+60℃/2hrs

250

Moisture test, h 200

80℃, 90% Moisture absorption,% 24hrs@25℃ Chloride, ppm

≤0.15 1.0

Note All data accounted herein are for your reference only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user's responsibility to determine suitability for the user's purpose of any production methods mentioned herein and to adopt such precautions as may be devisable for the protection of property and of persons against any hazards that may be involved in the handling thereof.

NOT FOR PRODUCT SPECIFICATIONS THE TECHNICAL INFORMATION CONTAINED HEREIN IS INTENDED AS REFERENCE ONLY