times are defined from the moment the adhesive reaches cure temperature. In practice, total oven time may be longer to a
DE216 Technical Data Sheet Nov.2008
DE216 Technical Data Sheet reaches cure temperature. In practice, total oven time
Product Description
may be longer to allow for heat up period.
Dover DE216 is a thermosetting single component epoxy. It is one of special glue especially designed for
Typical Properties of Cured Material
surface mount device. It is particularly suited where
Cured for 30 minutes @150℃
very fast cure is required on high speed SMT lines.
Physical Properties:
According to the demand of which social effects of
Density,g/cm3
≥1.3
pollution it is designed for use in Pb-Free soldering
Glass Transition Temperature, Tg,
≥100℃
which require high temperature.
Coefficient of Thermal Expansion, ASTM D696,K-1
Typical Usage
40-190
Electrical Properties:
Put SMT chip printed on circuit board prior to wave
Dielectric Constant / Loss, 25℃, ASTMD 150
soldering. Especially suited where require different
Dielectric Constant
Loss
height dot printed on the same thick board, and high
100Hz
2.69
0.008
speed humidity and high SMT lines.
100kHz
2.62
0.010
Typical Properties of Uncured Materials
Volume Resistivity, ASTM D257, Ω.cm
≥2.0×1015
Chemical Type
Epoxy
Surface Resistivity, ASTM D257，Ω
≥2.0×1015
Appearance
Red paste
Electronic strength, kV/mm
≥30
Specific Gravity@25℃
1.30-1.50
Viscosity,5rpm@25℃,Pa.s
500
Thixo ratio
≥6.0
Cured for 30minutes @150℃
Particle Size,μm
≤80
Shear Strength on grid Blasted Mild Steel,
Performance of Cured Material
CMT6104
Typical Curing Properties Proper cure condition is exposure to heat above 100
MPa
Chip type
℃(typically 90 secs @130℃ or 60 secs @150℃). The
≥8
Area of opening
Push-pull
（mm）
(KG)
rate of curing and the final strength depend on the
0603C
□0.3×1.0
1.93
type of PCB, density of the chip, as well as the curing
0603R
□0.3×1.0
2.07
time under the required temperature.
0805C
□0.5×1.5
1.98
Recommended Curing Temperature Graph
0805R
□0.5×1.5
2.02
1206
□0.5×1.5
2.77
The following graph shows the rate of torque strength developed with time at different temperatures. These
Bond
times are defined from the moment the adhesive
considerably depending on the SMT chip type,
strength
achieved
in
practice
will
vary
adhesive dot size and shape, the cured degree and the type of the solder resist.
Typical Environmental Resistance Test method:
CMT6104
Base material:
GEMS sheared sample
Cure method:
Cured for 30minutes @150℃
Document Number：DE-WI-R-086
Edition：1.0 Page 1 of 2
DE216 Technical Data Sheet Nov.2008
DE216 Technical Data Sheet Hot Strength
Under the condition of 25℃, 55%Rh, product will remain dispensable in the printing plate for 1 day, and will decrease if the higher temperature and humidity.
Storage Product shall be ideally stored in a cool, dry location in unopened containers at a temperature between 2°C to 10°C unless otherwise labeled. Adhesive stored in refrigerator must be come back to room temperature before it is used. To prevent contamination of unused product, do not return any material to its original container.
Aged under temperature indicated
If additional information is required, please contact
Resistance to Hot Solder Dip
Dover Technical Service Center.
In accordance with IPC SM817 (2.4.42.1) standard, DE216 passed the hot solder dip test and it is
General Information
qualified. This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be
Usage Direction
selected as a sealant for chlorine or other strong
DE216 should be stored in refrigerator, and must be
oxidizing materials.
allowed to equilibrate to room temperature before use,
For safe handling information on this product, consult
typically 24hours.During process of screen printing,
the Material Safety Data Sheet (MSDS)
the temperature should ideally be controlled at a value about 25℃ and the humidity should less than 70%.
Note
The quantity of adhesive dispensed will depend on those factors such as adhesive material, printing
The data contained herein are for information only and
speed, jelly mold height, adhesive pressure and
reliable. We cannot assume responsibility for the
temperature.
results obtained by others over whose methods we have no control. It is the user's responsibility to determine suitability for the user's purpose of any
Typical Technique Parameter
production methods mentioned herein and to adopt
Printing Speed
such precaution as may be advisable for the
500-100mm
The distance between grid blasted
protection of property and of persons against any
mild steel and PCB
1mm
hazards that may be involved in the handling and use
Pressure
4-6N/cm
thereof.
These parameters will vary depending on the type of dispensing system. NOT FOR PRODUCT SPECIFICATIONS THE TECHNICAL INFORMATION CONTAINED HEREIN IS INTENDED AS REFERENCE ONLY Document Number：DE-WI-R-086
Edition：1.0 Page 2 of 2
