DENKA Thermally Conductive Sheet is an insulating Thermally Conductive
Sheet ... technologies and the technologies accumulated by DENKA as a maker
of ...
DENKA Thermal Interface Materials Technical Information
2007.1
TABLE OF CONTENTS: Thermally Conductive Sheet .............. section A Thermally Conductive Spacer ............ section B Thermally Conductive Grease ............ section C Phase Change Material ....................... section D Elethermal Adhesive Tape .................. section E
Section A: DENKA Thermally Conductive Sheet Technical Information
2007.1
DENKA Thermally Conductive Sheet is an insulating Thermally Conductive Sheet made from DENKA boron nitride and silicone rubber. This material was created based on DENKA's boron nitride manufacturing technologies and the technologies accumulated by DENKA as a maker of synthetic rubber over the course of many years. The excellent thermal conductivity and electrical insulation characteristics of this material make it an ideal material for the insulating and heat dissipating sheets for semiconductors such as transistors and diodes. This sheet is also reinforced by glass fiber, so it can be used confidently without fears regarding its strength.
■ General overview of DENKA Thermally Conductive Sheet The BFG type is a highly thermally conductive type insulating sheet. It provides outstanding long-term reliability and is utilized in various power supplies and automotive electrical equipment, etc. The BS type maintains the excellent characteristics of the BFG type while providing greater flexibility and strength to make it more difficult to tear during fastening. The M type is a general purpose type insulating sheet. It is utilized widely in various fields where heat dissipation is not so necessary. The LD type , LR type and LF type are insulating sheets with thermal characteristics which are in the middle between those of the BFG and M types.
■ Characteristics of DENKA Thermally Conductive Sheet 1)
Since this material is flexible, it is easy for it to mate the surface of devices without the use of thermally conductive grease. It is difficult for it to crack compared to mica or porcelain, etc. , and can be used stably for long periods of time.
2)
Thermal conductivity is excellent,so thermal resistance is extremely low.This contributes to product size reduction.
3)
Mechanical strength is greatly enhanced by the use of glass fiber.This reduces the risk of the sheet tearing while it is being mounted.
4)
Since thermally conductive grease is not required, the grease application process can be omitted and there is no danger of contamination.
5)
Stable heat dissipation characteristics can be obtained even with low tightening torques.
6)
Its dielectric constant is approximately half of that of mica.
2
Section A: DENKA Thermally Conductive Sheet Technical Information
2007.1
■ Major uses of DENKA Thermally Conductive Sheet • electrically insulating and heat dissipating sheets for semiconductor elements such as power transistors, diodes, thyristors, etc. (switching power supplies, UPSs, audio-visual equipment, computers, communication equipment, switchboards, measuring instruments etc.). • heat dissipating spacers for electronic parts such as thick-film Ics, DIPICs, etc., in substitution of for mica sheets and silicone grease. • electrically insulating and heat dissipating sheets used in conjunction with heat pipes.
■ BFG BFG type is a thermally-conductive and electrically-insulating sheet made of silicone and reinforced with fiberglass. Having excellent thermal conduction and electrical insulation properties, it can be said to be ideal for heat dissipation material used with power semiconductors. Adhesive type is available (BFG-AD). table: general properties of BFG type Item
test method
unit
BFG20
BFG30
BFG45
BFG80
Color
-
-
green
white
white
white
Thickness
-
mm
0.20
0.30
0.45
0.80
Specific gravity
-
g / cm3
1.7
Hardness
-
Shore A
88
Tensile strength
JIS K6301
MPa
25
20
14
9
Tear strength
JIS K6301
KN / m
117
88
59
39
Foldability
-
ø mm
1.2
1.2
3.1
>5
Water absorption (1day)
-
µg / mm2
0.8
1.5
1.6
1.6
Reinforcement layer
-
-
fiberglass
Flammability
UL94
-
V-0 (file no. E49895)
TO-3 Rth thermal resistance
Denka
°C / W
0.18
0.20
0.25
0.36
TO-3 Rth (adhesive type)
Denka
°C / W
0.30
0.32
0.35
0.44
TO-3P Rth thermal resistance
Denka
°C / W
0.37
0.42
0.51
0.77
Thermal conductivity
Denka
W / (m·K)
Dielectric withstand voltage
JEM 1021
KV AC
1.0
3.0
4.0
5.0
Dielectric breakdown voltage
JIS C2110
KV AC
3.0
6.5
9.0
> 10
Volume resistivity
JIS C2123
1015 Ω·cm
1.9
2.4
3.3
4.1
Dielectric constant
@ 1 MHz
-
Appearance
Properties
(*)
4.1
3.6
diameter of the smallest metal column around which the sheet has no crack when entwined around
3
Section A: DENKA Thermally Conductive Sheet Technical Information
2007.1
Dielectric breakdown voltage for a 0.3 mm thick interface [ KV AC ]
■ Electrical and thermal properties selection chart 8 7-
LF
BFG
6-
M BFG-A
BS
5LD
4 0
0.50
0.25
0.75
1.00
1.25
Thermal resistance (Rth ) for a TO3-P 0.3 mm thick interface [ °C / W ]
■ BFG-A BFG-A type is a is a thermally-conductive and electrically-insulating sheet made of silicone; it is a new grade by which the thermal performance was improved more than BFG. The other properties of BFG-A type are almost the same ones of those of BFG type, the main differences are listed in the table below. table: general properties of BFG-A type Item
test method
unit
BFG20A BFG30A BFG45A BFG80A
Color
-
-
Thickness
-
mm
Specific gravity
-
g / cm3
Hardness
-
Shore A
90
90
89
88
Tensile strength
JIS K6301
MPa
9
8
5
4
Tear strength
JIS K6301
KN / m
41
37
26
18
Foldability
-
ø mm
1.0
1.2
1.2
3.1
Water absorption (1day)
-
µg / mm2
0.18
0.6
0.1
0.12
Reinforcement layer
-
-
fiberglass
Flammability
UL94
-
V-0 (file no. E49895)
TO-3 Rth thermal resistance
Denka
°C / W
0.12
0.15
0.19
0.30
TO-3P Rth thermal resistance
Denka
°C / W
0.28
0.29
0.32
0.66
Thermal conductivity
Denka
W / (m·K)
Dielectric withstand voltage
JEM 1021
KV AC
1.0
3.0
4.0
5.0
Dielectric breakdown voltage
JIS C2110
KV AC
3.0
6.0
9.0
> 10
Volume resistivity
JIS C2123
1015 Ω·cm
1.7
7.9
9.2
8.9
Dielectric constant
@ 1 MHz
-
Appearance white 0.20
0.30
0.45
0.80
1.7
Properties
(*)
5.0
2.0
diameter of the smallest metal column around which the sheet has no crack when entwined around
4
Section A: DENKA Thermally Conductive Sheet Technical Information
2007.1
■ Thermal resistance measurement (JIS K6911) TO-3 Heater block Heater
Thermocouple Thermal resistance = (°C / W)
T1 T2 Specimen
T1 - T2 (°C) Heat transfer amount (W)
Cooling water
■ BS BS type is a thermally conductive and electrically insulated sheet made of silicone. Respect to BFG types, it has better foldability, tear strength and mechanical resistance. table: general properties of BS type Item
test method
unit
Color
-
-
Thickness
-
mm
BS20
BS30
BS45
BS80
Appearance green
cm3
0.20
0.3 0
0.45
0.80
1.7
1.6
1.6
1.6
Specific gravity
-
g/
Hardness
-
Shore A
88
89
89
88
Tensile strength
JIS K6301
MPa
25
18
13
9
Tear strength
JIS K6301
KN / m
117
88
59
39
(*)
-
ø mm
/
Water absorption (1day)
-
µg / mm2
0.7
Reinforcement layer
-
-
fiberglass
Flammability
UL94
-
V-0 (file no. E49895)
TO-3 Rth thermal resistance
Denka
°C / W
0.19
0.21
0.26
0.37
TO-3P Rth thermal resistance
Denka
°C / W
0.40
0.45
0.54
0.79
Thermal conductivity
Denka
W / (m·K)
Dielectric withstand voltage
JEM 1021
KV AC
1.0
3.0
4.0
5.0
Dielectric breakdown voltage
JIS C2110
KV AC
3.0
5.1
7.8
> 10
Volume resistivity
JIS C2123
1015
1.8
2.6
2.5
1.8
Dielectric constant
@ 1 MHz
-
Foldability
(**)
/
(**)
(**)
0.1
2.2
3.1
/
1.5
Properties
(*)
Ω·cm
3.9
3.5
diameter of the smallest metal column around which the sheet has no crack when entwined around
(**)
completely foldable
5
Section A: DENKA Thermally Conductive Sheet Technical Information
2007.1
■ Shapes of DENKA Thermally Conductive Sheet DENKA Thermally Conductive Sheet is available as a standard part with a shape that matches the shapes of various transistors (TO-66, TO-3, TO-30, standard TO-220, enlarged TO-220, TO-220 with enlarged screwing hole, TO-3P, TO-126, standard TO-3PL, enlarged TO-3PL, TO-3PII, enlarged TO-3PII), though it is also possible to make sheets in any desired shape. Contact your local sales representative for details.
■ M M type is a general purpose type insulating sheet. Adhesive type is available (M-AD). table: general properties of M type Item
test method
unit
Color
-
-
Thickness
-
mm
M20
M30
M45
M80
Appearance yellow
cm3
0.20
0.3 0
0.45
0.80
1.9
1.9
2.0
2.0
Specific gravity
-
g/
Hardness
-
Shore A
91
91
90
90
Tensile strength
JIS K6301
MPa
28
24
26
20
Tear strength
JIS K6301
KN / m
127
98
107
68
(*)
-
ø mm
0.8
1.2
2.5
1.5
Water absorption (1day)
-
µg / mm2
0.6
1.8
1.2
2.0
Reinforcement layer
-
-
Flammability
UL94
-
TO-3 Rth thermal resistance
Denka
°C / W
0.43
0.64
0.80
1.07
TO-3 Rth (adhesive type)
Denka
°C / W
0.56
0.77
0.91
1.10
TO-3P Rth thermal resistance
Denka
°C / W
0.86
1.27
1.59
2.10
Thermal conductivity
Denka
W / (m·K)
Dielectric withstand voltage
JEM 1021
KV AC
1.0
3.0
4.0
5.0
Dielectric breakdown voltage
JIS C2110
KV AC
2.4
5.5
8.5
> 10
Volume resistivity
JIS C2123
1015 Ω·cm
1.7
1.7
2.8
2.6
Dielectric constant
@ 1 MHz
-
Foldability
fiberglass V-0 (file no. E49895)
Properties
(*)
1.4
4.0
diameter of the smallest metal column around which the sheet has no crack when entwined around
6
Section A: DENKA Thermally Conductive Sheet Technical Information
2007.1
■ Special features of DENKA Thermally Conductive Sheet • for its flexibility, the sheet can be stuck to the mating surface with no use of heat-dissipating grease. Moreover, cracks are difficult to appear in comparison with mica, ceramics and the similar interfaces, giving the final assembly long-term reliability characteristics. • thanks to its excellent thermal conductivity, the thermal resistance is extremely low, thus contributing to product miniaturisation. • some types of Thermally Conductive Sheets are reinforced with fiberglass, in order to remarkably improve the mechanical strength. • with no use of heat-dissipation grease, the sheet can save the process of grease coating, this preventing from contamination. • stabilised thermal dissipation properties can be obtained with a lower clamping force. • the dielectric constant is approximately one half of that of mica interfaces.
■ LD LD type is a thermally-conductive and electrically-insulating sheet made of silicone. It has excellent thermal conduction and electrical insulation properties, so that it can be said to be ideal for heat dissipation materials used with semiconductors such as transistors, diodes, and so on. table: general properties of LD type Item
test method
unit
LD20
Color
-
-
Thickness
-
mm
Specific gravity
-
g / cm3
Hardness
-
Shore A
77
Tensile strength
JIS K6301
MPa
Tear strength
JIS K6301
Foldability (*)
LD30
LD45
LD85
Appearance grey 0.20
0.30
0.45
0.85
77
79
80
3
3
3
3
KN / m
57
67
64
79
-
ø mm
1.2
1.2
1.5
3.1
Water absorption (1day)
-
µg / mm2
0.04
0.08
0.12
0.12
Reinforcement layer
-
-
TO-3 Rth thermal resistance
Denka
°C / W
0.29
0.36
0.48
0.74
TO-3P Rth thermal resistance
Denka
°C / W
0.75
1.02
1.22
1.56
Thermal conductivity
Denka
W / (m·K)
Dielectric withstand voltage
JEM 1021
KV AC
-
-
-
-
Dielectric breakdown voltage
JIS C2110
KV AC
3.0
5.0
8.0
9.0
Volume resistivity
JIS C2123
1013 Ω·cm
1.5
6.0
5.4
7.7
Dielectric constant
@ 1 MHz
-
3.0
3.0
4.0
4.0
Flammability
UL94
-
2.7
not reinforced
Properties
(*)
2.1
V-0 (file no. E49895)
diameter of the smallest metal column around which the sheet has no crack when entwined around
7
Section A: DENKA Thermally Conductive Sheet Technical Information
2007.1
■ LF and LR LF type is a general purpose type insulating sheet with good thermal and electrical characteristics. Adhesive type is available (LF-AD). LR has excellent thermal conduction and electrical insulation properties, so that it can be said to be ideal for heat dissipation material used with semiconductors such as transistors, diodes, and so on. The production format of LR is roll and it is easy to handle. table: general properties of LF and LR types Item
test method
unit
LF30
LF45
LR20
Color
-
-
grey
grey
yellow
Thickness
-
mm
0.30
0.45
0.20
Specific gravity
-
g / cm3
1.8
1.8
-
Hardness
-
Shore A
90
90
-
Appearance
Tensile strength
(X)
, (O)
MPa
18
(X)
16 (X)
18 (O)
Tear strength
(X)
, (OO)
KN / m
78
(X)
69 (X)
52 (OO)
ø mm
1.2
1.5
-
1.2
1.8
-
Foldability (*)
-
mm2
Water absorption (1day)
-
µg /
Reinforcement layer
-
-
TO-3 Rth thermal resistance
Denka
°C / W
0.40
0.50
0.38
TO-3 Rth (adhesive type)
Denka
°C / W
-
-
-
TO-3P Rth thermal resistance
Denka
°C / W
0.80
0.90
-
Thermal conductivity
Denka
W / (m·K)
2.3
2.3
2.3
Dielectric withstand voltage
JEM 1021
KV AC
3.0
4.0
1.0
Dielectric breakdown voltage
JIS C2110
KV AC
7.5
> 10
2.0
1015 Ω·cm
3.4
3.2
2.0
3.8
-
fiberglass
Properties
Volume resistivity
($)
, (&)
Dielectric constant
@ 1 MHz
-
3.8
Flammability
UL94
-
V-0 (file no.E49895)
(O)
JIS K6301 test method
(*)
diameter of the smallest metal column around which the sheet has no crack when entwined around
($)
JIS C2123 test method
(&)
JIS K6251 test method
(OO)
V-0 level
(X)
JIS K6252 test method
JIS K6271 test method
8
Section B: DENKA Thermally Conductive Spacer Technical Information
2007.1
DENKA Thermally Conductive Spacer is electrically insulating and heat dissipating spacer with excellent thermal conductivity and extreme softness, prepared through the full use of technical expertise DENKA has accumulated in the history of Thermally Conductive Sheet production. It effectively dissipates heat from electronic parts. As the performance of the latest electronics products has been raised to ever higher levels, the amount of heat radiated by MPU, SRAM and other components has continued to increase, and although makers have been searching for heat dissipating materials which have high thermal conductivity and flexibility, the thermal conductivity of heat dissipation materials has so far been inadequate and the materials with a high thermal conductivity have not been sufficiently flexible. DENKA Thermally Conductive Spacers meet the needs for both thermal conductivity and flexibility, with the ability to adhere tightly to the electronic parts with a minimal load and conduct the heat efficiently to the heat sink fins and other parts.
■ Development of DENKA Thermally Conductive Spacer 1) Unlike the somewhat hard rubber based sheets that were used previously, flexible heat dissipating parts with a gel base have recently been introduced for use mainly in notebook personal computers and game devices. This Thermally Conductive Spacer conducts heat away from heat generating parts such as the CPU and memory devices to the heat sink or the outer case while adapting the uneven surface of the product. DENKA has developed various grades of Thermally Conductive Spacer with a broad range of characteristics from high thermal conductivity to high compressibility. 2) As a means of improving thermal conductivity, DENKA has utilized its own inorganic filler technology to improve thermal conductivity, and by using various inorganic fillers such as BN powder, the goal of reaching a maximum of 16 W /(m·K) , making the thermal conductivity higher than ever before, has been reached. 3) If this type of spacer is used as a heat dissipating material for BGA, heat dissipation would become possible while reducing the load on the BGA and high connection reliability would be obtained. In the midst of efforts to make equipment smaller in size while increasing performance, it is expected that heat dissipation will become a more and more important subject. DENKA will carry on studies of heat dissipation systems overall while working to utilize its own inorganic filler technologies to the maximum limit, in order to develop products that meet the needs of our customers.
9
Section B: DENKA Thermally Conductive Spacer
thermal conductivity [ W / (m·K) ]
Technical Information
2007.1
16 -
FSB-G
86FSA-D
4FSL-B FSL-BH
2-
FSL-G
FSL-E
FSL-A
0
FSL-BS
FSL-D
10
FSL-F3
20
30
40
compressibility (%) at 9.8·10-2 Mpa = 14.3 psi The FSB series is an outstanding heat dissipating material which has an excellent thermal conductivity of 16 [W / (m·K)] , as well as flexibility and insulation characteristics. The FSA-D is still an excellent heat dissipating material, with a thermal conductivity of 5 [W / (m·K)]. The FSL series is an insulating and heat dissipating material which has good compressibility, thermal conductivity (in the range between 1.1 and 3 W/ m·K), and outstanding handling characteristics,so that it can be said to be ideal for heat dissipation material used in electric devices such as MPU, SRAM, and so on. The very good compression characteristics of either FSL-BS and FSL-F3, make those materials ideal for a thermal match of surfaces with some larger tolerances on roughness and surface planarity,
table: representative values of DENKA FSB-G , FSA-D, FSL-A , FSL-F3 Thermally Conductive Spacers Item
test method
unit
FSB-G
FSA-D
FSL-A
FSL-F3
Inherent surface tack
-
# of sides
0
0
2
2
Thermal conductivity
Denka
W / (m·K)
16
5
1.5
1.1
Breakdown voltage
JIS C2110
KV / mm
-
10
10
10
Volume resistivity
JIS C2123
1013 Ω·cm
-
1
1
1
Dielectric constant
@ 1 MHz
-
4.2
-
4.2
-
Color
-
-
white
grey
blue
grey
Thickness
-
10-1 mm
Properties
Appearance
Specific gravity
-
g/
Hardness
-
Compressibility
@9.8·10-2 MPa
Flammability
UL-94
cm3
3, 5, 10 (, 15, 20, 25, 30, 35, 40, 45, 50 FSL ONLY) 1.7
2.4
2.5
1.7
Asker C
36
43
45
-
%
15
10
10
25
-
V-0 (file no.E49895)
V-0
10
Section B: DENKA Thermally Conductive Spacer Technical Information
2007.1
table: representative values of DENKA FSL-B, FSL-BH, FSL-BS and FSL-D Thermally Conductive Spacers Item
test method
unit
FSL-B
FSL-BH
Inherent surface tack
-
# of sides
Thermal conductivity
Denka
W / (m·K)
Breakdown voltage
JIS C2110
KV / mm
10
Volume resistivity
JIS C2123
1013 Ω·cm
1
Dielectric constant
@ 1 MHz
-
Color
-
-
Thickness
-
10-1 mm
FSL-BS
FSL-D
2.5
2.5
-
5.5
Properties 2 3
3
4.2
-
Appearance
Specific gravity
-
g/
Hardness
-
Compressibility
@9.8·10-2 MPa
Flammability
UL-94
blue
cm3
3, 5, 10, 15, 20, 25, 30 (, 50 FSL-BH ONLY) 2.8
2.8
2.8
2.7
Asker C
25
30
8
30
%
15
10
30
15
-
V-0 (file no. E49895)
■ Compressibility to loading weight of the FSL-B type table: compressibility to each loading weight (%) for the FSL-B type Thermally Conductive Spacer 0.01 MPa
0.1 MPa
0.2 MPa
0.3MPa
0.4 MPa
0.5 MPa
FSL050B
3.4
10.2
15.3
19.1
22.9
26.8
FSL100B
3.6
13.3
19.3
23.3
27.3
31.3
FSL200B
3.9
17.3
24.3
30.3
34.3
38.3
FSL300B
4.5
20.4
28.1
34.0
38.3
42.1
11
Section C: DENKA Thermally Conductive Grease Technical Information
2007.1
■ GFC GFC grades are silicone oil compounds that exhibit high thermal conductivity between devices and heatsinks. Providing excellent thermal conductivity, they are especially designed for high performance semiconductor elements such as MPU, SRAM, etc. table: general properties of GFC grades Item
unit
GFC-F1
GFC-G1
GFC-H4
GFC-H6
GFC-K4
Color
-
light plum
white
grey
grey
grey
Shape
-
Product format
-
Specific gravity
g / cm3
2.3
2.4
2.2
2.2
2.6
Viscosity (X)
Pa·s
300
50
250
35
190
Volume resistivity (XX)
Ω · cm
1013
1013
1010
-
-
Thermal resistance (*)
°C / W
0.06
0.05
0.04
0.04
-
Thermal resistance (**)
°C / W
0.14
0.11
-
-
-
Thermal conductivity
W / (m·K)
5
5
6.5
6.5
8
(X) (*)
grease 1 , 5 , 10 , 30 cc syringes - 2 Kg can
Denka standard test method
(XX)
JIS C2123 test method
modified ASTM D5470 (at 60 psi, 1cm2)
(**)
modified ASTM D5470 (at 20 psi, 1cm2)
■ Thermal resistance measurement (modified ASTM D5470)
Thermal resistance (°C / W)
TJ - TCOOL (°C)
= Heat transfer amount (W) 12
Section C: DENKA Phase Change Materials Technical Information
2007.1
In these days, especially as being represented by the CPUs for notebook personal computers, heat radiation amount from electronic components has been increasing almost proportional to their functional improvement. DENKA phase-change type materials are the products with the ceramic powder manufactured by our firm. The ceramic powder is densely filled and finely dispersed in polymers, then, processed into a shape of sheet for easy handling. As a result of utilizing the excellent heat conduction characteristics of ceramic powder, our phase-change type materials are able to show the good heat radiation and can be used for a variety of electronic components.
■ PCA PCA grades are phase change materials with no silicone that exhibit high thermal property similar to GFC compounds. PCA grades are especially designed for high-performance semi-conductor elements such as MPU, SRAM, etc. It provides excellent thermal conductivity. PCA-Y grades consist of a phase change film on one side of a conformable metal foil carrier (normally, Aluminium). So, since one side is non-sticking, detaching the heat-sink is easy. table: general properties of PCA and PCA-Y grades Item
unit
PCA-A8A
PCA-B6
PCA-E2
Color
-
light blue
grey
grey
Thickness
mm
0.15 , 0.25
0.15
0.15 , 0.25
Specific gravity
g / cm3
2.4
2.8
2.7
2.2
2.7
Volume resistivity
1013 Ω·cm
1
1
1
1
1
Phase change temp.
°C
50
50
45
50
50
Thermal resistance (*)
°C / W
0.14
0.10
0.07
0.34
0.17
Thermal resistance (**)
°C / W
0.09
0.09
0.04
0.20
0.14
Thermal conductivity (X)
W / (m·K)
2.9
6.5
-
2.8
4.9
(*) (**)
thermal resistance: Modified ASTM D5470 (at 60 psi,
1cm2)
(X)
PCA-Y9
PCA-Y11
light purple 0.15 + 0.03Al
thermal conductivity: Modified ASTM D5470 (at 15 mm, 100 µ m)
thermal resistance: Modified ASTM D5470 (at 100 psi, 1cm2)
figure: provision of PCA and PCA-Y grades PCA GRADE Cover film
Base film
PCA-Y GRADE Cover film
Phase Change Material
Aluminium foil
Phase Change Material
13
Section C: DENKA Phase Change Materials Technical Information
2007.1
■ Usage of PCA series’ Phase Change Materials Pressure Fin Heat (about 60°C)
Chip
Phase Change Material
■ Usage of PCA-Y series’ Phase Change Materials
Pressure Metal foil
Fin Heat (about 60°C)
Chip Phase Change Material
Rework is easy
14
Section C: DENKA Elethermal Adhesive Tape Technical Information
2007.1
Elethermal DKN is a thermally conductive sheet made of acrylic-polymer; it is an excellent sticky sheet with thermal conductivity like the double-coated adhesive tape. Elethermal DKN is a silicon free and halogen free materials, and the flame resisting(UL-94) is VTM-0 level. table: general properties of DKN grades Item
unit
DKN-100P
DKN-250P
DKN300
Characteristic
-
Color
-
Thickness
mm
0.10
0.25
0.3 0
0.50
Dielectric breakdown voltage
KV AC
1.5
-
5
7
Hardness
shore A
35
35
60
60
Sticky strength to Aluminum plate
N/10mm
5.5
5.5
0.7
0.7
Thermal conductivity
W / (m·K)
1.0
1.0
1.0
1.3
Flammability
-
-
-
very sticky
DKN500 sticky
white
VTM-0 level
■ Application examples LED
Heat sink
I.M.S. Elethermal Elethermal Metal casing
IC Chip
15
DENKA Thermal Interface Materials Technical Information
2007.1
■ Concept chart of Thermal Interface Materials Grease , Adheshive
Film , Pad
Phase Change
Pressure
Pressure
Heat and Pressure
Distributor:
NOTICE
www.denka.co.jp DENKI KAGAKU KOGYO KABUSHIKI KAISHA Head Office Sanshin Bldg., 1-4-1 Yurakucho, Chiyoda-ku, Tokyo 100-8455, Japan Telephone: (03) 3507-5257 Facsimile: (03) 3507-5078
The information contained in this brochure is presented for the purpose of generally advising potential customers of DENKA about the basic description, properties and characteristics of various DENKA products (hereafter, ”Product Information”). DENKA makes no warranty or representation as to the entire accuracy or completeness of the Product Information in this brochure. Nothing in this brochure will be deemed to create any express or implied warranty or obligation of DENKA with respect to the Product Information or its use, including, but not limited to, any warranty of merchantability, fitness for a particular purpose or infringement of any intellectual property rights. Each user of Product Information and DENKA products assumes its own responsibility to properly determine the manner and suitability of use of Product Information and DENKA Products in its own operations. The user should exercise proper care in considering Material Safety Data Sheet, Product Information and any other technical information provided by DENKA, including descriptions of use conditions, warnings and cautionary instructions. DENKA reserves the right to change Product Information from time to time at its discretion and without notice.