Mar 4, 2015 - Effect of oxygen inclusion on microstructure and thermal stability of copper nitride thin films. Y. Du,a) R. Huang, R. Song, L.B. Ma, C. Liu, C.R. Li, ...
Effect of oxygen inclusion on microstructure and thermal stability of copper nitride thin films Y. Du,a) R. Huang, R. Song, L.B. Ma, C. Liu, C.R. Li, and Z.X. Cao Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Beijing 100080, China (Received 17 November 2006; accepted 21 March 2007)
Copper oxynitride thin films with a minor oxygen content were prepared on silicon wafers at 100 °C by reactive magnetron sputtering using a gas mixture of nitrogen and oxygen. Addition of oxygen immediately improves the compactness of the deposits, which otherwise comprise ragged Cu3N nanocrystallites. With an oxygen content
