IEEE Electrical Insulation Magazine. B. O. O. K. R. E. V. I. E. W. S by. John J. Shea. Handbook of Thick- and ... ductory chapter the book begins with a ... puter-aided design techniques, and pattern .... practical coverage of the mechanical, elec-.
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Handbook of Thick- and Thin-Film Hybrid Microelectronics by T. K. Gupta John Wiley & Sons 111 River Street Hoboken, NJ 07030 Phone: (877) 762-2974 Fax: (800) 597-3299 http://www.wiley.com ISBN: 0-471-27229-9 406 pp. - $99.95, 2003 The subject of hybrid microelectronics pertains to the packaging and fabrication of assemblies of microelectronic devices prepared from thin- and thick-film technologies. The topic includes printed wiring boards, thin films (up to several hundred nanometers), thick films (5 to 50 micrometers), integrated circuits, and multichip modules. Understanding hybrid microelectronics includes aspects of materials science, electrical engineering, and mechanical engineering. After an introductory chapter the book begins with a description of design of various components in thick- and thin-film format, layout rules for hybrid micro-circuits, computer-aided design techniques, and pattern generation. There are chapters on thickfilm materials, components, and deposition techniques; and corresponding chapters on
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thin-film devices. Component assembly is described next, including adhesives, solders, and wire bonding. Adjustment of passive components is described after that, primarily abrasive and laser trimming of resistors. Then we come to a discussion of various types of packages and thermal effects and modeling. The final chapter describes multi-chip modules and components found in microwave hybrid circuits. This book gives thorough coverage to these subjects; the descriptions are up to date, and cover the fundamentals, so the book should be useful for some time to come. Each chapter provides many references to primary literature and other handbooks. —K. F. Schoch, Jr.
Dielectric Properties of Porous Media S.O. Gladkov Springer-Verlag 333 Meadowlands Parkway Secaucus, NJ 07094 Phone (800) Springer Fax (212) 460-1575 www.springer.de/phys/books/ssms/ ISBN# 3-540-00186-7 274 pp. - $89.95 (Hardback), 2003 This is a very interesting theoretical book with some experimental data on the fundamental principles of dielectric breakdown and thermal conductivity in porous dielectrics. The porous materials studied were capacitor papers, cellulose, and fibrous (inhomogeneous) materials saturated in oil. The derived breakdown formulas are based on elastic scattering of forward and reverse traveling electrons present in the breakdown path. This is tied into the thermal capacity of the dielectric to show how the material physical parameters affect breakdown strength. The author provides excellent descriptions of the formulas by tying formula parameters to physical material properties. After each major formula derived, the author details what
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physical structure properties need to be altered to achieve higher breakdown strength. He also validates the equations with graphical comparisons of theory to experimental measurements. The book contains seven chapters and an appendix that has the source code for calculating the thermal conductivity of porous dielectric materials. The first two chapters cover modeling of porous materials based on a fibril structure. It also has information on thermodynamics of systems in equilibrium. The third chapter covers heat capacity and mechanical strength of porous materials. Chapter 4 deals with the physical bases of fast processes (electric and thermal breakdown) in porous materials, including frequency dependence on external ac fields, ignition time dependence on surface temperature, influence of oil viscosity on electric strength, and relaxation theory. Chapter 5 details the theory of heat conduction in porous media and chapters 6 and 7 cover the behavior of porous media in AC and acoustic fields along with conclusions. This book would be a valuable reference for those researchers working in the field of electrolytic capacitors and with porous dielectrics in general. It would also be a good textbook for students studying the fundamentals of dielectric breakdown theory.
Electric Power Substations Engineering J.D. McDonald, editor CRC Press LLC 2000 Corporate Blvd. NW Boca Raton, FL 33431 Phone (800) 272-7737 Fax: (800) 374-3401 http://www.crcpress.com ISBN 0-8493-1703-7 304 pp. $99.95 (Hardcover), 2003 New developments in substation engineering, as well as existing designs and methods, are presented in this book. Con-
IEEE Electrical Insulation Magazine
tributions from various authors make this text a collection of tutorials that cover an overview of the design, construction, and various aspects that must be considered in construction of a new power substation. While not giving specific design details, this book provides a good overview of the many areas that need to be planned for in the construction of a new substation. These included not only the design of the power handling equipment but the many other factors that impact the overall design. The topics covered regarding design and construction include gas and air insulated substations, HV switching equipment, HV power electronics, and automation systems. These chapters give a good description, along with many photographs and schematics, showing the various bus/ switching configurations, equipment considerations (breakers, switches, fuses), and FACTS controllers and layout. Some of the automation topics cover data acquisition systems, status monitoring, and communications protocols. The other important considerations to the planning of a substation, covered in this book are oil containment, community impact, animal deterrents, grounding and lightning, seismic, and fire protection. The final chapters cover communications, building security, computer security, and gas-insulated transmission lines. This would be an excellent book for substation engineers, substation project planners and as a supplemental book for power engineering students.
RF MEMS Theory, Design, and Technology G.M. Rebeiz John Wiley & Sons 111 River Street Hoboken, NJ 07030 Phone: (877) 762-2974 Fax: (800) 597-3299 http://www.wiley.com ISBN 0-471-20169-3 503 pp. - $99.95 (Hardcover), 2003 RF MEMS (micro-electro-mechanical) devices have seen incredible growth over the past ten years due to their tremendous commercial and defense potential. The
need for higher frequency devices, over what solid-state devices could produce, led to the development of RF MEMS technology. Today, many electronic companies are producing RF MEM devices for switches, varactors, inductors, T-lines, filters, resonators, and antennas. Focusing solely on RF MEMS switches, varactors, and inductors, this book provides in-depth, practical coverage of the mechanical, electrical, and fabrication design details of these devices for microwave applications. The author’s introduction provides an excellent review of the current state of this rapidly changing technology. He compares MEMS with various solid state devices, provides case studies, and details the limits and issues in integration, linearity, power handling and packaging. The bulk of the book then covers the mechanical and electrical design. The mechanical aspects that need to be considered are thoroughly covered for both the static and dynamic conditions required in MEMS. Some of the static considerations include spring component design, hold-down voltage, and voltage breakdown. Some of the dynamic considerations cover displacement analysis, gas fundamentals, switching mechanisms, switching energy, and responses to various waveforms. Electromagnetic modeling provides solutions for capacitive shunt and series switches including losses, inductance, resistance, current density, and capacitance calculations. To gain insight from others, there is a section detailing about 24 switch designs made at various companies and universities. Other chapters cover fabrication, circuit design, and very useful design equations for contact physics used to determine power-handling capability. Application examples included are phase shifter designs, varactors and tunable oscillators, inductors, filters, and antennas. The book would be even more useful if it had contained information on materials and material selection. This is an excellent book for graduate students or practicing engineers in the field of RF microwave technology who need to learn about the latest developments in the RF MEMS world.
November/December 2004 — Vol. 20, No. 6
The Physical Properties of Thin Metal Films G.P. Zhigal’skii and B.K. Jones, Editors Taylor & Francis 29 West 35th Street New York, NY 10001 In the UK Phone +44 (0)1264 343071 Fax +44 (0)1264 343005 In the USA (800) 634-7064 Fax (800) 248 4724 http://www.tandf.co.uk ISBN 0-415-28390-6 229 pp. - £54.99 (Hardcover), 2003 Thin metallic films are a key component in various sensors and especially in semiconductor fabrication. Among many factors, the ability to create high reliability and good quality semiconductors relies on the quality of the thin metal films used for connection layers, resistors, and ohmic contacts, and sensors. The bulk metal properties change as the film thickness becomes comparable with, or smaller than, the physical mechanism such as the electron mean free path, or the carrier wavelength, or the wavelength of light. This book describes the complex physical properties of thin metal films along with the necessary theory, experimental examples, and applications to provide the reader with practical information to make high quality thin metal conducting films. The authors begin by describing the factors that determine film resistivity, surface resistivity, temperature coefficient of resistance, stability, intrinsic noise, and ohmic linearity. There are details describing the conduction mechanisms (potential barriers and tunneling) due to the physical shape of metal layer during deposition, forming island structures. The electrical properties on both the classical and quantum levels are described along with the mechanical internal stresses and the kinetics of voids. The variation and the activation energy due to local micro-stresses explain electrical noise, 1/f noise. There are details showing how to reduce stresses in thin-film depositions. Also described is electro-migration, the momentum in current density high enough to move atoms in thin metal films and the effects of
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