Enhancement of interface anchoring and densification of Y2O3 coating by metal substrate manipulation in aerosol deposition process Jinwoo Kim, Je In Lee, Dong Soo Park, and Eun Soo Park Citation: Journal of Applied Physics 117, 014903 (2015); doi: 10.1063/1.4905241 View online: http://dx.doi.org/10.1063/1.4905241 View Table of Contents: http://scitation.aip.org/content/aip/journal/jap/117/1?ver=pdfcov Published by the AIP Publishing Articles you may be interested in Compressive deformation and failure of CrAlN/Si3N4 nanocomposite coatings Appl. Phys. Lett. 104, 081919 (2014); 10.1063/1.4867017 Mechanical response of atomic layer deposition alumina coatings on stiff and compliant substrates J. Vac. Sci. Technol. A 30, 01A160 (2012); 10.1116/1.3670401 Influence of the bias voltage on the structure and mechanical performance of nanoscale multilayer Cr Al Y N ∕ Cr N physical vapor deposition coatings J. Vac. Sci. Technol. A 27, 174 (2009); 10.1116/1.3065675 Stabilization of tetragonal and cubic phases of ZrO 2 in pulsed sputter deposited ZrO 2 / Al 2 O 3 and ZrO 2 / Y 2 O 3 nanolayered thin films J. Appl. Phys. 104, 113532 (2008); 10.1063/1.3040720 Short-ranged structural rearrangement and enhancement of mechanical properties of organosilicate glasses induced by ultraviolet radiation J. Appl. Phys. 99, 053511 (2006); 10.1063/1.2178393
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JOURNAL OF APPLIED PHYSICS 117, 014903 (2015)
Enhancement of interface anchoring and densification of Y2O3 coating by metal substrate manipulation in aerosol deposition process Jinwoo Kim,1 Je In Lee,1 Dong Soo Park,2 and Eun Soo Park1,a) 1
Research Institute of Advanced Materials, Department of Materials Science and Engineering, Seoul National University, 1 Gwanak-ro, Gwanak-gu, Seoul 151-744, South Korea 2 Functional Ceramics Department, Korea Institute of Materials Science, 66 Sangnam-Dong, Changwon, Gyeong-Nam 641-010, South Korea
(Received 16 November 2014; accepted 16 December 2014; published online 5 January 2015) The interface anchoring and densification of Y2O3 coatings prepared by aerosol deposition (AD) process were systematically investigated for various types of metal substrates. At initial anchoring stage in AD process, the kinetic energy of impacted particles is converted to the heat energy, which instantly elevates the interface temperature between coating layer and substrate. Thus, the Sn substrate with low melting temperature (505 K) results in strong impact anchoring by local interface melting during AD process. On the other hand, the continuous collision and fracture of impacted particles lead to solid consolidation and densification of deposited coating layers. Thus, the SUS substrate with high hardness (173 Hv) leads to a highly densified coating layer. Indeed, the bulk metallic glass (BMG) substrates, which have unique low processable temperature (500 Hv), give rise to both excellent interface anchoring and densification of thick Y2O3 layers with a nano-crystalline structure by AD process. These advantages of the BMG substrates can be used more widely by C 2015 forming metallic glass buffer layer on various substrates applied to AD process. V AIP Publishing LLC. [http://dx.doi.org/10.1063/1.4905241]
I. INTRODUCTION
The aerosol deposition (AD) process is a novel coating technique for preparing ceramic thick films at room temperature by direct collision of ceramic powders on substrates.1–3 In this method, ceramic films can be formed on various substrates, such as metal, glass, and ceramics without sintering process at high temperature. An as-deposited coating layer at room temperature can be densified over 95% of the bulk density and maintains equal stoichiometry of raw ceramic powders. The deposition rate of AD process is much higher (5–50 lm/min) than that attained by conventional coating techniques (0.01–0.05 lm/min).2 Thus, the AD process is very attractive for the deposition of ceramic films with thickness over micron scale, and is promising for wide applications, such as microactuators, optical devices, and corrosion resistance materials.2–5 The deposition mechanism of AD process is ascribed to room temperature impact solidification from the impact of fine ceramic particles accelerated by the carrier gas.1,3 During the coating process, submicron powders in aerosol state are accelerated with carrier gas flow, and collide directly on the substrate with high velocity over hundreds m/s. From collisions of the particles and the substrate, the kinetic energy of the accelerated particles is converted to the heat energy, which elevates the temperature of local surface area on the substrate in a few nanoseconds. Then, the fracture and plastic deformation of the primary impacted particles create strong bonding between the particles and the substrate.1 This initial impact anchoring process is important for adhesive interface between a)
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the coating layer and the substrate, which becomes a foundation for forming dense ceramic layer by continuous collision of ceramic particles. On the other hand, the hardness of the substrate can be another basis for forming hard ceramic layer by effectively supporting continuous collision of ceramic particles. Therefore, the properties of the substrate can significantly affect the dense and adhesive layer formation in AD process but the effects of substrates in AD process have not been systematically investigated yet. As a raw ceramic powder material, Y2O3 was used for coating on the metal substrates by AD process in this work. Y2O3 has high erosion resistance against halogen gas plasma, so it can be used as plasma-resistant materials in dry-etching process of semiconductor equipment.6 The thermal (or plasma) spray coating process has been applied generally for fabricating the plasma-resistant Y2O3 coating in semiconductor equipments, but the Y2O3 coating by spray coating process contains a large number of voids and cracks so that plasma-resistance is worse compared to the sintered Y2O3. The Y2O3 thick coating layer without voids and cracks is crucial to ensure the long life of semiconductor equipment components, and the AD process can be a promising solution for fabricating high-quality Y2O3 thick layer.7 In this study, the effects of various metal substrates on the formation of ceramic coating layers by AD process were systematically investigated. First, crystalline metal substrates (Sn, Al, and SUS 316) with different melting temperatures and hardness were selected for comparing the interface bonding between the substrates and ceramic layers and the degree of densification in coating layers. Based on the results of the crystalline metal substrates, we suggest a novel method for
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[This article is copyrighted as indicated in the article. Reuse of AIP content is subject to the terms at: http://scitation.aip.org/termsconditions. Downloaded to ] IP: 128.199.155.83 On: Thu, 24 Sep 2015 21:06:08
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enhancing both interface bonding and densification by exploiting bulk metallic glass (BMG) substrates with unique supercooled liquid region (SCLR) (
