Fig. S1 BCAD - PLOS

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6. Connect silicon tubes. 7. Bonding PDMS device and a coverslip. 8. Load cells. Medium/Cell suspension. Inlet. Outlet. Coverslip. Plasma-activated surface. B.
A

B 1. SU-8 mold on a silicon wafer

5. Punch holes

SU-8 mold

Trench

Silicon wafer

Obs. channels Trench Obs. channels

2. Molding PDMS device PDMS device

Trench

Trench Obs. channels

3. Peel PDMS device off

4. Bonding PDMS support block PDMS support block

C

Support block

Device

6. Connect silicon tubes

Plasma-activated surface

Outlet tube

7. Bonding PDMS device and a coverslip

Plasma-activated surface Coverslip 8. Load cells Medium/Cell suspension Inlet

Outlet

Covalent bonding

Inlet tube 1 mL syringe 24 x 60 mm coverslip

D

10μm

10μm

Fig. S1