Journals Journals
Vol 1 | Issue 4 | November 2016 ISSN: 2397-7264
Call for Papers
High Voltage
FULLY ACCES OPEN S JO APC W URNAL A UNTIL IVED 2018
Special Issue: Dielectric Polymer Materials for High-energy-density Storage Guest-edited by: Prof Zhimin Dang, Tsinghua University
Editors-in-Chief: Professor Masoud Farzaneh, Université du Québec à Chicoutimi, Canada Professor Zhicheng Guan, Tsinghua University, China KH550 modified Ba0.6Sr0.4TiO3/PVDF nanocomposites with dielectric strength Doi 10.1049/hve.2016.0065
Co-published by The Institution of Engineering and Technology and CEPRI | Supported by Tsinghua University
Special Issue:
www.ietdl.org/hve
IET HV Cover Final NOV16.indd 1
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Thermally Conductive but Electrically Insulating Materials for High Voltage Applications Rapid increase of power density of electric equipment and electronic devices brings forward the need for thermally conductive but electrically insulating materials. Polymer materials have been widely used as dielectrics and electrical insulation in power equipment and electric devices because of their easy processing and low cost. However, most of polymer materials have low thermal conductivity (i.e., lower than 0.3 W/mK), which makes the thermal management of high-power-density equipment and devices become a large challenge. The search for high thermal conductivity materials has inspired multiple studies of polymer composites. However, the simultaneous enhancement of thermal conductivity and insulating properties of polymer composites remains a difficult materials engineering challenge. This special issue is organized in order to show the latest results obtained and to highlight the problems and future challenges in developing thermally conductive but electrically insulating materials. The topics to be covered in this special issue include but are not limited to: n n n n n n
New polymer materials with high thermal conductivity New filler for thermal conductivity enhancement of polymers Polymer composites materials with high thermal conductivity Nanotechnology for thermal conductivity enhancement of polymers Interface engineering for thermal conductivity enhancement of polymer materials Modeling and simulations for thermal conductivity of polymer composites
All contributions are invited to submit their papers electronically at the High Voltage Website “Manuscript Central” (https://mc.manuscriptcentral.com/hve). Papers should be submitted the website no later than March 31, 2017. Questions regarding this Special Issue can be addressed to the Guest Editor.
For enquiries regarding this Special Issue please contact the Guest Editor:
Important dates: Submission deadline: Mar 31 2017 Publication Date: Q3 2017
Dr. Xingyi Huang Shanghai Key Laboratory of Electrical Insulation and Thermal Ageing Research Center of Dielectrics and Electrical Insulation Shanghai Jiao Tong University Shanghai, China 200240 T: +86-21-54740787 E:
[email protected]
All papers must be submitted through the journal’s Manuscript Central system:
https://mc.manuscriptcentral.com/hve
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