Laser Micromachining. Centre for Microtechnology and Surface Analysis has
been involved in Laser Micromachining since 2001. Our facility includes.
Laser Micromachining Centre for Microtechnology and Surface Analysis has been involved in Laser Micromachining since 2001. Our facility includes a KrF Excimer laser, an ultra-short pulsed femto second laser and a CO2 laser for material removal. For plastic bonding an NIR diode laser is available. The Danish Technological Institute has extended experience in surface structuring, cutting and hole-drilling of both metals and polymers foils. With the right choice of laser all materials can be machined in various user defined geometries.
Femto second: 2 W @ 775 nm, 150 fs, 6 kHz
Fast turn-around-time employing direct laser machining for e.g. microfluidic structures, gaskets, membranes and stamps will speed up development time.
Focus areas:
Small scale structures down to 1 µm Micrometer sized holes e.g. for leak tests Handlings of micrometer scaled laser diced features Automized laser production setup
Excimer laser: 5 W @ 248 nm, 5 ns, 300 Hz
Services:
Job-shop – fast delivery time Development – one-day test and trials to longer projects Production – feasibility studies and small scale production Open innovation network – experience and knowledge sharing
CO2 laser: 25 W @ 10.6 µm, cw
Diode laser: 50 W @ 808 nm, cw
Examples of Applications Stamps for Hot Embossing and Inject Molding
Filters: Holes drilled in Teflon and PET
Surface structuring: Tool for injections molding
Laser ablated Ni stamp
Hot Embossed PET substrate
Contact: Kasper Vestentoft, M.Sc, Senior Consultant, phone: +45 7220 3365, e-mail:
[email protected]
