Jan 9, 2009 - 360/l03 âMethod of Preventing Damage to Integrated Cl-fCult Chips during. 6,130,009 A. 100000 Smith et a
USO0RE43605E
(19) United States (12) Reissued Patent O’Brien et al. (54)
(10) Patent Number:
US RE43,605 E
(45) Date of Reissued Patent:
LASER SEGMENTED CUTTING,
(58)
MULTI-STEP CUTTING, OR BOTH
*Aug. 28, 2012
Field Of Classi?cation Search ................ .. 264/400,
264/157, 158, 163 See application ?le for complete search history.
(75) Inventors: James N. O’Brien, Bend, OR (US);
Lian-Cheng Zou, Portland, OR (US); Yunlong Sun, Beaverton, OR (US);
(56)
U.S. PATENT DOCUMENTS
Kevin P. Fahey, Portland, OR (US); Michael J. Wolfe, Portland, OR (US); Brian W. Baird, Oregon City, OR (US); Richard S. Harris, Portland, OR (US)
(73) Assignee: Electro Scienti?c Industries, Inc., Portland, OR (US) (*)
Notice:
4,146,673 A *
FOREIGN PATENT DOCUMENTS EM
Reissue of:
6,676,878 Jan. 13, 2004
Appl. No.:
10/165,428
Filed:
Jun. 6, 2002
U.S. Applications: (60) Division of application No. 11/332,815, ?led on Jan. 13, 2006, Which is a continuation-in-part of applica tion No. 09/803,382, ?led on Mar. 9, 2001, noW aban
doned, said application No. 11/332,815 is a continua tion-in-part of application No. 10/017,497, ?led on Dec. 14, 2001, noW Pat. No. 7,157,038.
(60)
Provisional application No. 60/297,218, ?led on Jun.
8, 2001, provisional application No. 60/265,556, ?led on Jan. 31, 2001, provisional application No. 60/233, (51)
(52)
0706309
4/1996
(Continued) OTHER PUBLICATIONS 200510130176.X, which generally corresponds to U.S. Reissue Divisional U.S. Appl. No. 11/332,815.
(Continued)
Related U.S. Patent Documents
Issued:
Headley ...................... .. 428/335
Oct. 23, 2009 Of?ce action in Chinese Patent Application No.
Jan. 9, 2009
(64) Patent No.:
3/1979
(Continued)
This patent is subject to a terminal dis claimer.
(21) Appl.No.: 12/351,562 (22) Filed:
References Cited
Primary Examiner * Jeffrey Wollschlager (74) Attorney, Agent, or Firm * Stoel Rives LLP
(57) ABSTRACT UV laser cutting throughput through silicon and like materi als is improved by dividing a long cut path (112) into short segments (122), from about 10 pm to 1 mm. The laser output (32) is scanned Within a ?rst short segment (122) for a pre determined number of passes before being moved to and scanned Within a second short segment (122) for a predeter
mined number of passes. The bite siZe, segment siZe (126), and segment overlap (136) can be manipulated to minimize the amount and type of trench back?ll. Real-time monitoring is employed to reduce rescanning portions of the cut path
[112] (112) Where the cut is already completed. Polarization
913, ?led on Sep. 20, 2000.
direction of the laser output (32) is also correlated With the cutting direction to further enhance throughput. This tech
Int. Cl.
variety of different lasers and Wavelengths. A multi-step pro
nique can be employed to cut a variety of materials With a
B23K26/04
(2006.01)
0041; 41/91
(2006.01)
cess can optimize the laser processes for each individual
layer
U.S.Cl. ................. ..264/400;264/482;219/121.62;
219/121.67; 219/121.69; 219/121.8; 219/121.81
17 Claims, 22 Drawing Sheets
12
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2
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6’400’534 Bl
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Stillnotavailable °n.'1ine)'
‘ 360/l03
6,255,621 B1 6,288,873 B1
-
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public availability is believed to be Nov. 1, 2001) (This document is
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’
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""""""""""" "
6,414,263 B1
.
“Method of Preventing Damage to Integrated Cl-fCult Chips during
“Creation of an Air Bearin
. 219/121.6
Cutler ......................... .. 700/193
NB910959.
Surfaceb
EXcimer Laser Patternin
of
US RE43,605 E Page 3 Anthony, T.R., “Diodes Formed by Laser Drilling and Diffusion,” J. Appl. Phys., vol. 53 (Dec. 1982), pp. 9154-9164. International Search Report concerning related International Appli cation No. PCT/US02/20826 Jan. 9, 2003.
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US 6,303,409, 10/2001, Karpman et al. (Withdrawn)
Through-Hole and Blind Vias in a Wide range of Circuit Board
* cited by examiner
tion No. PCT/US02/ 00867.
US. Patent
Aug. 28, 2012
Sheet 1 0f 22
US RE43,605 E
FIG. 1 (PRIOR ART) \_8
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FIG. 2A 1.2
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200 300 400 500 660 760 Wafer thickness (mm)
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200
400
600
800
dicing length (m)
1 OOO
US. Patent
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Sheet 2 0f 22
US RE43,605 E
US. Patent
Aug. 28, 2012
Sheet 3 0f 22
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Aug. 28,2012
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US RE43,605 E
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Sheet 12 or 22
US RE43,605 E
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FIG. 24
Aug. 28, 2012
Sheet 13 0f 22
(Prior Art)
US RE43,605 E
US. Patent
Aug. 28,2012
Sheet 14 or 22
FIG. 25 (PRIOR ART) 278
US RE43,605 E
US. Patent
Aug. 28, 2012
Sheet 15 0f 22
US RE43,605 E
US. Patent
Aug. 28, 2012
Sheet 16 0f 22
US RE43,605 E
FIG. 283 372
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FIG.37228b g,‘ 5:373
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FIG. 289 Km
FIG. 28h 376
373 362 or 364
362 O‘ 364
US. Patent
Aug. 28, 2012
Sheet 17 0f 22
US RE43,605 E
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