Samsung's ASIC solutions are enhanced by the company's system-level
knowledge and experience in deep sub-micron design methodologies. For
example ...
Samsung Foundry: ASIC Design Solutions Samsung continually advances its technology innovation, giving customers access to state-of-the-art logic processes that enrich and differentiate their products. Samsung delivers the total solution, including 32/28nm design expertise, an unequalled IP portfolio, high-volume silicon manufacturing, and advanced packaging & testing capabilities. The result is a shortened design cycle, lower risk and first-pass design success for most products.
ASIC System-on-Chip (SoC) Solutions With the market moving to SoC technology, working with Samsung enables customers to simplify and accelerate the creation of leading-edge products. Samsung’s ASIC solutions are enhanced by the company’s system-level knowledge and experience in deep sub-micron design methodologies. For example, through Samsung’s unique embedded memory processes, engineers can incorporate custom-sized DRAM and Flash memory blocks into their SoC designs. With standard cell libraries from the Common Platform technology alliance and ARM, Samsung takes the risk out of getting customers’ products to market by providing high-performance, high-density or low-power expertise for highly integrated ASIC SoCs. Samsung takes the risk out of getting products to market quickly.
What Samsung Offers Rich IP Portfolio, Standard Cell, I/O and Memory Libraries Samsung offers the broadest selection of ARM cores, along with embedded DRAM and Flash and a wide range of advanced mixed-signal IP solutions. We also provide silicon-validated SerDes and USB 2.0 IP cores for various application. State-of-the-Art Fabrication Facilities When it comes to investing in the most advanced production facilities, Samsung is at the forefront of the industry. Completely owned by Samsung, the fabs have the flexibility and back-end capacity to accommodate the production of customer’s ASIC solutions.
Regional Design Centers Samsung’s ASIC Design Centers are focused on delivering superior services. These centers are staffed by highly skilled ASIC design engineers who understand complex implementations. These regional design centers offer complete support of deep sub-micron design methodologies, architectural analysis, cost analysis and evaluation of systemlevel trade offs. Advanced Process Technology Utilizing years of success as a top semiconductor supplier, Samsung has developed the process expertise for high-volume manufacturing while
also using this knowledge to increase the capabilities of customers’ ASIC designs. Packaging & Testing Services Samsung offers a full selection of packaging options that accommodate high-level integration and multiple form factors. Samsung is one of the pioneers in PoP and SiP technologies for various applications. Also available are increasing popular packaging options such as fine-pitch BGA and Flip Chip. In addition, Samsung provides complete testing services in the fabs.
Samsung’s Breadth of ASIC Solutions Advanced Process Technologies • 32/28nm • 45nm • 65nm • 90nm CPU Cores • ARM Cortex A, R & M Families • ARM 7, 9 & 11 families DSP Cores • TeakLite • Teak • Oak
Peripheral Cores • 10/100 MAC Ethernet Controllers • USB 1.1, USB 2.0, USB OTG • IEEE 1394 Link Controllers • PCIe Controllers • IrDA • UART • Synchronous Serial I/F • Real-Time Clocks • Keyboard/Mouse I/F • General-purpose I/F • Smart Card/SIM I/F • Multimedia Card I/F • Asynchronous Static Memory Controllers (SRAM, Flash ROM)
• Universal Memory Controllers (SDRAM, Synch Flash, SRAM) • DMA Controllers • LCD Controllers • Watch-do Timers • Programmable Interrupt Controllers Interface IP • HDMI Tx v1.3 • MiPi • SMIA (CCP2) Multimedia IP • 820/1080i/1080p MFC • Audio Codec • JPEC Codec
Samsung Semiconductor, Inc. 3655 North First St., San Jose, CA 95134-1713 Tel: 408-544-4000 FAX: 408-544-4950 www.usa.samsungsemi.com
Mixed Signal Cores • ADC: 6 to 14 bits, up to 450MHz • DAC: 8 to 16 bits, up to 300MHz • PLL: Up to 2GHz, Frequency Synthesizer, De-skew, Pixel Clock, Dithered, Clock Recovery • CODEC: 16-bit Audio, 14-bit Voice • AFE Embedded Memories • Embedded DRAM • Embedded Flash
The appearance of all products, dates, figures, diagrams and tables are subject to change at any time, without notice. Copyright © 2005. Samsung Semiconductor, Inc. is a registered trademark of Samsung Electronics Co. Ltd. All other names and brands may be claimed as the property of others. Microsoft® and Windows® are registered trademarks of Microsoft Corporation. DS-10-SRAM-002 Printed 2/20
