Solder Joint Temperature and Package Peak Temperature
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Solder Joint Temperature and Package Peak Temperature
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Solder Joint Temperature and Package Peak Temperature Determining Thermal Limits during Soldering
1
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JEDEC/IPC J-STD-020 (http://www.jedec.org) is a Joint Industry Standard of Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. This document demonstrates how to determine the package temperature and thermal mass dependent moisture sensitivity level (MSL) of products to ensure reliable processing of moisture sensitive surface mount components. Comply with these recommendations to maintain package integrity of components during any heat exposure of board soldering and de-soldering. The relevant temperature is measured at the top of the parts and is defined as package peak temperature (PPT). This package temperature is often also named peak reflow temperature (PRT) which — because of reflow in the technical term — can be misleading to take the temperature in the solder joint where the material reflow happens. It is important to note that the PPT is the
reference temperature for the parts’ MSL. The PPT must not be confused with the solder joint reflow temperature, the MSL/PPT Classification Profile is not for component board soldering in production lines. MSL and PPT belong together and are product characteristics reflecting the robustness of semiconductor components for board soldering. They tell how long the parts are allowed to be exposed to a controlled environment before it is necessary to dry-bake them again before any first or subsequent soldering step. Absorption of water has to be kept at a tolerable level so that no popcorn effects compromise parts’ reliable performance later on. Table 1 is a partial list of the J-STD-020C MSL guidelines of processing rules for correct storage and handling prior to soldering. The standard is also important for double-sided reflow such as for top and bottom side board assemblies where it is mandatory to prevent excess moisture take-up of the plastic components during storage before they will see a second exposure to soldering heat. This best practice advice is also applicable for any re-work, service and repair soldering step. Table 1. MSL per J-STD-020C Floor Life
