Test Challenges with sensor fusion

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System on board? OR System in package? https://technology.ihs.com/510132/teardown-apple-watch-sport-38mm-a1553 https://www.chipworks.com/about-.
Test Challenges with sensor fusion & SiP TM Mak

Wearables

What are next for wearables? Rounder?

Smaller?

Contoured? ??

System on board? OR System in package?

https://www.ifixit.com/Teardown/App le+Watch+Teardown/40655

https://technology.ihs.com/510132/teardown-apple-watch-sport-38mm-a1553

https://www.chipworks.com/aboutchipworks/overview/blog/inside-the-apple-watch-technicalteardown-blog

How can we make this smaller?

Sensor fusion: the leading pact on 2D

LSM303DLH 3x accelerometer and 3x magnetometer in compact LGA package

Where is the Packaging Technology Drifting?, Choon Lee, ISMP Korean Forum

Multi-sensing & multi-dimensional mechanical stimulus

Motion sensing: acceleration, vibration, shock, tilt and rotation

Some motions are multidimensional, e.g. rotation and acceleration

SiP -> need to shrink to WLCSP

Pitch: 300um -> 150um Common C4 bump pitch

Test for WLCSP is still wafer probe

Trends in Test Technology for Advanced Packaging, Joe Klein, CTEA Electronics Design, Manufacturing & Test Symposium, SMTA, Feb 5, 2015

Wafer probe is not a system for motion stimulus

http://solidustech.com/

http://www.jem-net.co.jp/en/products/pro_hando_top.html

It is designed to isolate vibration to allow improved contact to the pad/bump !!

Traditional component assy/test flow

2.5D? 3D? What?, Ira Feldman, Silicon Valley workshop 2011

WLCSP cut away pkg test

Can we just test at die/wafer level? And skipping packaged test?

What if the board is a system? Board/System Test

Place solder

system

What do this system test looks like? Parametric? Specification? Full stimulus? Fault coverage? How?

What about final package test? And keep in mind that our system is a package now…

Commercial test system/handler

Evolution of MEMS Test Solutions, Mario Correa, MEMS testing and Reliability 2012

There is progress ….

The Power of [X], Burisan, semicon Taiwan 2012

BUT ……

Stimulus type dictates handler/tester design

e.g. light and mechanical motions are very different

It is more than swapping out a module for another

Multi-stimulus & actuation

http://memunity.org/index.php?id=28

Now all in a package/system….

Is there a paradigm shift?

Wafer level test for MEMS…

Can we make this one single unit?

Then mechanical stimulus is possible….

Testing physical properties in lieu of spec. Fast; wafer/die level; Independent of ASIC Not spec measurement -- need correlation from pkg test to physical test Packaging effect not included

Defect based test?

http://www.meptec.org/Resources/8%20-%20Solidus.pdf

Better than no testing or DC tests

Can the same principle apply to other non-mechanical sensors ?

Is this the equivalence to scan structural test?

Scan test methodology becomes mainstream with rise of ASIC in the early ‘90

Electrically controlled stimulus -- BIST

Built-in-self-test techniques for MEMS, S. Mir, MICROELECTRONICS JOURNAL 37(12):1591-1597 ·NOVEMBER 2006

Will this replace actual mechanical stimulus? Do we have to introduce every inducer associated with every sensor?

Parting words • MEMS sensor fusion is imminent • End product form factor is driving towards wafer level test only, upsetting traditional test paradigm • Some possible alternatives to “packaged functional test” – New probe paradigm – “Structural” test – BIST (built-in stimulus)

Backup

Fine pitch contactor pogo now, ?? future

ITRS pitch limit is down to 300um…

Multi-sensor fusion on 3D

Do not require advanced TSV technology

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