Business Model o 6-â9 months R&D prior to commercializa\on o Rela\onships currently established with module manufacturer ...
Thermoelectric Technology and Manufacturing Clemson University Arash Mehdizadeh Daniel Thompson Jennifer Graff
Thermoelectric Technology o 2 modes of opera@on o Refrigera@on (Pel@er) I ΔT o Power Genera@on (Seebeck) ΔT I
Thermoelectric Technology Physical proper@es involved in TE are correlated! 2
ασ ZT = T κ α = Seebeck Coefficient σ = Electrical Conductivity κ = Thermal Conductivity
• Requires accurate and precise measurements • Hard to op@mize • ZT =
η
Research vs. Commercializa@on Novel Bi2Te3 – based TE
o Bi2Te3 – based TE for close to room temperature climate control o Gap between lab scale research and current commercialized products o Manufacturing infrastructure
AMat Product in Ac@on
AMat Corporate Structure
COO
Research Adviser Dr. Terry Tri+ Expert in measurement and characteriza@on techniques accuracy and prescision of novel materials
CEO
CTO
Industrial Adviser Dr. J. S. Guided concep@on, development and scale-‐to-‐ produc@on of high efficiency materials
Business Model
o 6-‐9 months R&D prior to commercializa@on o Rela@onships currently established with module manufacturer
Compe@@ve Landscape • Future Market Mover/Shakers: TE material developers (through R&D Investment) • AMat’s compe@@ve advantages: • Higher Efficiency (> 20%) • Cost-‐efficiency • Scalable Process
Intellectual Property Landscape Process, Methods and Techniques for Materials Syntheis
• Majority of the issued patents on system, device and module fabrica@on • Self-‐destruc@ve IP bagles avoided by market compe@tors • Cross-‐licensing agreements for start-‐ups • AMat’s freedom to operate
New Materials, Structures or Composi;ons
9.2%
18.3%
72.4%
System, Device, Module or Assembly Fabrica;on
Market Opportunity
o AMat will capture ≈1.0%-‐2.5% of the target market o AMat’s annual produc@on will cover the needs of ≈200K modules
AMat’s Tools for Success -‐ Synthesis SPEX 8000M – High energy Ball Mill
Thermal Technologies Hot Isosta;c Press Fuji Dr. Sinter Spark Plasma Sintering System Labconco Protector Glovebox
Tools for Success – Low Temp Characteriza@on Hitachi 3400-‐SEM Miniflex XRD Custom Resi;vity & Seebeck Custom Thermal Conduc;vity Quantum Design PPMS
Overall Es@ma@on of Funding for Phase 1 and 2 Typical Cost for Start-‐up
Powder Prep
AMat Cost for Start-‐up SPS/Hot Press
SPS/Hot Press $40,000
Structural Characteriza@on $10,000
$50,000
Powder Prep $50,000
$30,000
$10,000
$95,000 Proper@es Measurements
Metalliza@on and Assembly
Structural Characteriza@on
Total
Total $335,000 Module Characteriza@on $15,000
$40,000
$200,000
Module Characteriza@on $15,000
Proper@es Measurements Metalliza@on and Assembly $30,000
$200,000
Revenue Model Phase 1 & 2 High Performance material & Scalable process for cooling app. (ZT>1)
Research & Development
Phase 3 Package I
Package II
$1.1 million Investment 15% Equity to investor $50,000 suggested annual profit in 1st year
$2.5 million Investment 30% Equity to investor $104,080 suggested annual profit in 1st year
Investment breakdown
Material Cost Equipment Cost 1 Hot Press (custom) 2 industrial ball mills 1 large furnace Labor (3 technical employees) Property/U@li@es
Investment breakdown
Material Cost Equipment Cost 2 Industrial Hot Presses 4 Industrial ball mills 2 large furnace Labor (6 technical employees) Property/U@li@es
Winning Summary • Future Market Movers/Shakers: • Technology based TE material developers (through R&D Investment) • AMat’s compe@@ve advantage (wafers) • Higher Efficiency • Novel Materials • Cost Efficiency • AMat’s commercializa@on plan • Successful Business Model • Staged and planned short-‐term R&D start-‐up • Access to state-‐of-‐the-‐art equipment through CAML at Clemson University • Investment packages designed for specific investors
Acknowledgements • Technical Advisers: – Dr. Terry Trig – Dr. J.S.
• College of Engineering and Science – Clemson University • ACC DOE Clean Energy Challenge • DOE-‐EERE • Lockheed Mar@n • Fish & Richardson P.C. • Nixon Peabody L.L.P. • SAIC
Thank you for your @me! Ques@ons?
Extra Slides for ques@ons beyond this point
Low Temperature Thermal Conduc@vity • Use a CAML custom designed steady-‐state thermal conduc@vity measurement system.29 Two samples can be simultaneously mounted on a removable puck. Measurements are conducted in a vacuum of 10-‐3 torr and from 10-‐300K.
Low Temperature Thermal Conduc@vity Steady State Method P vs. ΔT Sweeps @ Constant T
High Temperature Thermal Conduc@vity
Netsch DSC 404C Pegasus
AccuPyc 1330 Pycnometer
Netsch LFA 457 MicroFlash
• The high temperature thermal conduc@vity is calculated using the density of the sample ρ, its heat capacity at constant pressure Cp, and its diffusivity D. • A Differen@al Scanning Calorimeter (DSC) is used to measure the heat capacity of the sample at a constant pressure. A gas pycnometer is used to measure its density, and a Laser Flash is used to measure its thermal diffusivity.
Low Temperature Electrical Transport Proper@es • Use a CAML custom designed Resis@vity and Seebeck coefficient system with a
temperature range of 10K to 300K.30
• Samples are mounted on a 24-‐pin chip, and the system can run two samples simultaneously.
Low Temperature Electrical Transport Proper@es
31
Tools for Success – High Temp Characteriza@on ULVAC ZEM II
Netzsch DSC 404C Netzsch LFA 457C AccuPyc 1330 Pycnometer
