IEEE TRANSACTIONS ON MAGNETICS, VOL. 51, NO. 4, APRIL 2015
0300901
XXV Magnetic Recording Conference 2014 Foreword
O
N BEHALF of the organizing committee of the XXV Magnetic Recording Conference, TMRC 2014, we are pleased to present selected papers from the conference in this issue of the IEEE T RANSACTIONS ON MAGNETICS. The conference convened at the University of California, Berkeley, CA, USA, on August 11–13, 2014. The hard work and hospitality of the hosting institution in making this event so successful is greatly appreciated. The Magnetic Recording Conference (TMRC) is an annual forum with a format of invited presentations and contributed poster papers. TMRC 2014 focused on magnetic recording technologies that will enable storage densities above 1 Tb/in2. Thirty-seven invited papers and 21 contributed posters were presented at the conference. The invited lectures covered the recent progress in several areas of magnetic recording. The poster sessions, as usual, enabled in-depth discussions of the invited and contributed papers. TMRC 2014 addressed paths to higher magnetic recording areal density, with an emphasis on all the variants of energy-assisted recording, bit-patterned media, 2-D recording, head–disk interface, and the recording channels and algorithms these new technologies demand. Non-hard disk drive/novel recording concepts were also covered in the invited presentations. An informal poll (http://cml.me.berkeley.edu/TMRC2014/survey.php) of the participants concerning the introduction of new technologies was held at the end of the conference. Among the various candidate technologies having potential for enabling higher areal density storage, two-dimensional magnetic recording (TDMR) was polled to arrive as a product in 2017. TMRC 2014 was one of the largest TMRCs held in recent years. Of the 258 participants, there were 220 attendees from the U.S., 18 from Japan, 6 from Singapore, as well as attendees from China, the U.K., Hong Kong, India, France, Switzerland, Holland, Korea, and Taiwan. Academia accounted for 22% of the participants, with 78% of the attendees coming from industry. Patrick Quarterman from the University of Minnesota received a student travel grant to attend the TMRC. TMRC 2014 was cohosted by the institutions listed in the following page. We are grateful for the financial support provided by Seagate Technology, LSI Corporation, Marvell Technology Group Ltd., Western Digital Corporation, HGST (a Western Digital Company), Toshiba Corporation, Hoya Corporation, Headway Technologies Corporation (TDK), Ube Material Industries Ltd., Veeco Instruments, JX Nippon Mining and Metals, Hysitron, Heraeus MTD, and Showa Denko Corporation. We acknowledge the members of the Organizing Committee for their dedication and volunteering to TMRC 2014. We are also grateful to all the invited speakers and presenters of contributed posters who endeavoured to present and defend their ideas in extended presentations and discussions. All published papers underwent the sieve of peer review, and we thank wholeheartedly the session chairs and the many reviewers who contributed to this effort. We thank all volunteers and participants for their contributions in making TMRC 2014 a resounding success. The next conference in this series will be held in Minneapolis, MN, USA, in August 2015. We look forward to seeing you there.
S. N. P IRAMANAYAGAM, Publications Co-Chair Nanyang Technological University, Singapore
[email protected]
MICHAEL A LEX, Publications Co-Chair Western Digital, USA
[email protected]
___________________ Digital Object Identifier 10.1109/TMAG.2015.2415275 0018-9464 © 2015 IEEE. Personal use is permitted, but republication/redistribution requires IEEE permission. See http://www.ieee.org/publications_standards/publications/rights/index.html for more information.
