Design of One Chip Communication Stack

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Easy to be implemented by IEC 61850 library. Abstract ... File transfer capabilities ... IEC 61850 processor module : Performs IEC 61850 communication S/W.
Design of One Chip Communication Stack Processor and MMS Communication Stack Library Based on IEC 61850 Eunkyu In Hanyang University, Seoul, Korea [email protected]

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Contents 1. 

What is IEC 61850?

2. 

Network Processor based vs. Legacy IEDs

3. 

Data Structure of IEC61850 in IED

4. 

System Layer in IEC61850

5. 

Structure of Proposed Processor

6. 

Advantages of OneChip SoC and Library

7. 

Development Goal

8. 

Develop Procedure

9. 

IEC 61850 Library

10.  Simulation 11.  Conclusion

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What is IEC 61850 ? "   A set of standards associated with“Power systems management on info rmation exchange” "   Include the application of modern networking to electrical power substati on automation such as §  Requirement – define quality requirements(reliability, maintenance, security,…) §  Configuration – define system configuration §  Protocol – define network protocol requirements §  Testing – define test requirements

"   MMS(Manufacturing Message Specification), GOOSE(Generic Object Oriented Substation Event), SV(Sam pled Value)

"   Run over TCP/IP networks and/or substation LANs §  High speed switched Ethernet (response times with < 4 ms)

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Network Processor based vs. Legacy IEDs

Mapping is required

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Core Functions of IEC 61850 " Standardized mapping instead of numbers or indexes in Legacy IED §  Easy to be implemented by IEC 61850 library

" Abstract Communication Service Interface(ACSI) §  Easy to create messages between application and many devices

" Independent network protocol in a substation §  Possible to be applied to all network protocol

" A configurable language §  Exchange information between IED and client

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Data Structure of IEC 61850 in IED

Data Attribute

Data

Logical Node

Logical Device

Physical Device

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"   Properties of Data Objects §  Common logical node information (e.g. name, health, position…) §  Status Information (e.g. status of functions] §  Settings (for operation functions) §  Measured values (e.g. CT, VT…) §  Controls (e.g. ON / OFF) §  Protection "   Functions of Logical devices. e.g. XCBR: circuit breaker

"   Collections of Physical devices

"   Devices for Protection, Measurement, Con trol

System Layer of IEC61850(1) "   ACSI(Abstract Communication Service Interface) : Interface for the client and server communications §  Abstract data structure for IED

Abstract Common Data Model (Objects, Servic §  Support es) -  Real-time data access and retrieval -  Device Control -  Event reporting and logging -  Communication between Sender (publisher) and receiver Device Data (subscriber)Data -  File transfer capabilitiesModel Types Objects

Naming Conve ntion

M A P P I N G

"   SCSM(Specific Communication Service Mapping) : MMS §  Abstract data is mapped to specific standardized data (MMS, GOOSE, SV)

GOOSE / SV

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System Layer of IEC61850(2) "  GOOSE(Generic Object Oriented Substation Event) : §  Used for sending trip messages to IED §  Multicast Abstract Common Data Model (Objects, Servic §  Time Limit of GOOSE is less than 4ms es) §  Send 3 times §  Layer 1 and 2 of OSI 7 Layers are used "  MMS(Manufacturing Message Specification) :

Device

§  Interface between Users and IEDs for data exchange Model

Data Objects

Data Types

Naming Conve ntion

§  Used for reporting and requesting IED status §  Change operating status of IED

"  SV(Sampled Value) :

§  All of the OSI 7 layers are used

§  Sent to users from merging unit §  Values of current and voltage

M A P P I N G MMS GOOSE / SV

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What is Intelligent Electronic Device (IED)?

"   Functions of IED §  Protection -  Of Over current and earth fault

§  Control -  Local and remote control

§  Monitoring -  Circuit-break condition, trip circuit, gas density, relay temperature -  Event recording

§  Metering -  Of currents, voltages, active power, reactive power

§  Communication -  With a control center and other IEDs

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Architecture of Legacy IED Logic (HMI) processor module

Control Center Digital input

Digital output

Vr 22900 Ir 1230 kW

345 Hz

Vs 22900 Is 1230 kAR

12 PF

V ca

Ic Ia

Vt 22900 It 1230 kWh 1234 V n

0 In

0

Digital Inputs

kA Rh

98

V

Ib

bc

1 2 3 4 5 6 7 8

Digital Outputs 1 2 3 4 5 6 7 8

DPRAM

IEC 61850 Wrapper

DPRAM

PT

D P R A M

Main processor module

CT

D P R A M

IEC 61850 processor module

Communication module PT100Ω

IEC 61850

CT/PT processor module

4-20mA

"

ab

AB C

CB

IED

V

HMI Control

HMI

Digital I/O Control

Measurement Control

The legacy IED consists of 3 H/W boards § 

§  § 

Measurement Control -  CT/PT processor module : Converts analog(CT/PT) to digital -  Main processor module : Manages total operation of IED HMI control -  Logic Processor module : Controls logic and peripherals, and performs function of IED IEC 61850 -  IEC 61850 processor module : Performs IEC 61850 communication S/W -  Communication module : Performs communications with other IEDs

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Structure of Proposed IED "   Architecture of Legacy IED

Logic (HMI) processor module

Digital output

V ca

Vr 22900 Ir 1230 kW 345 Hz Vs 22900 Is 1230 kAR

Ic

12 PF

Ia

Vt 22900 It 1230 kWh 1234 V n

0 In

0 kA Rh

98

V

Ib

bc

Digital Inputs 1 2 3 4 5 6 7 8 Digital Outputs 1 2 3 4 5 6 7 8

DPRAM

V ab

Digital input

V n

Digital output

0 In

0 kA Rh

98

V

Ia Ib

bc

V ab

Digital Inputs 1 2 3 4 5 6 7 8 Digital Outputs 1 2 3 4 5 6 7 8

DPRAM

PT

Communication module

Measurement Control

CT/PT processor module

CB

Main processor module

CT

4-20mA PT100Ω

Measurement Control

D P R A M

Logic (HMI) processor module

D P R A M

IEC 61850 processor module

IEC61850 Network Processor = Logic Processor Module + IEC 61850 Processor Module

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IEC 61850

IEC 61850 processor module

D P R A M

Communication module

Main processor module

D P R A M

IEC 61850

D P R A M

CT

§ 

12 PF

AB C

CT/PT processor module

PT100Ω

ca

Ic

Vt 22900 It 1230 kWh 1234

PT

4-20mA

V

Vr 22900 Ir 1230 kW 345 Hz Vs 22900 Is 1230 kAR

AB C

CB

HMI

Digital I/O Control

HMI Control

HMI

Digital I/O Control Digital input

"   Architecture of Proposed IED

Advantages of OneChip SoC §  The Legacy IEC61850 board is big size and power consumption -> OneChip SoC is smaller, lower power §  Long developing time in legacy IEC61850 board -> OneChip SoC skips the board development §  Convenience of maintenance and repair – just replaced by SoC, not a board §  OneChip SoC is 5 times cheaper than of legacy boards

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Advantages of IEC 61850 Library §  Programming by OOP, easy to revise and analyze IEC 61850 library §  Expandabilities and readabilities §  Convenient GUI

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Development Goal "   IEC 61850 Network Processor § 

OneChip SoC

§ 

IEC 61850 Library

§ 

Logic Editor

IEC 61850 Library

OneChip SoC

Logic Editor

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Develop Procedure of IEC 61850 Network Processor Procedure 1

Procedure 2

Procedure 3

IEC 61850 Library

IEC 61850 Platform

OneChip SoC

IEC61850 Processor

LCD

FPGA

" 

" 

IEC 61850 Library § 

SCL Configurator

§ 

Service

§ 

Communication

Logic Editor

Logic Processor

" 

Memory

Logic editor

IEC 61850 Platform

" 

IEC 61850 OneChip SoC

§ 

IEC 61850 Processor

§ 

Dual Processor

§ 

Logic Processor

§ 

10/100/1000 Ethernet, I/O

§ 

FPGA

§ 

10/100/1000 Ethernet, I/O

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Platform for OneChip SoC IEC61850 Processor

LCD

FPGA

Memory

Logic Processor

SoC

Specification CPU

Two ARM 926EJ-S

FPGA

Xilinx vertex 5

High Speed Memory

DDR2 SDRAM (SO-DIM M)

Communication

2-channel UART

Video

4.3”(480 x 272) TFT-LCD

Audio

AC97 Audio Codec

Download Port

Xilinx Platform Flash

Power Supply

Micro-ATX PC Power Supply

PC-133 64MB SDRAM

2MB Asynchronus SRAM

10/100/1000 Ethernet

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USB 2.0 OTG

Flash ROM 32MB

Specification of OneChip SoC

Specification Design Package

TSMC 0.13 Logic 1P/8M 1.2V Core 3.3V I/O BGA 528, 27X27x2.23mm

CPU

Dual ARM926 / 333MHz

RAM

64MByte

Flash memory

32 Mbyte

Ethernet Other interfaces Architecture of OneChip SoC

I/O

10/100/1000 MAC USB2.0,I2C,SPI,Uart,LCD 24 freely prog. PIO pins(GPIO), 8 x IRQ, 2x external DMA, 3 timer Inputs/outputs 24-bit address bus, 16-bit data bus Color LCD Controller Nand Flash Controller

Operating Voltage

1.2V/3.3V

Heat dissipation

975mWatt

Temp. range IEC61850 Library Implementation Layout of OneChip SoC

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-40 to 85 °C Object-Oriented Programming Full IEC 61850

IEC 61850 Library System Configurat or

SSD

" 4 functions in IEC 61850 library

SCD

ICD

IED Configurat or

SCL Engineering

§  SCL Engineering - 

CID

Initialization

I ni t _S CL MMS S er v er R s p

MMS Cl i ent R eq

MMS COMMR S PS er v

MMS COMMR EQS er v

R EQCont r ol

§  Initialization - 

Service

MMS Mpl MMS Decoder

MMS OPCode

§  Service

A CS ES er v (Pr es ent at i on Pr ot ocol )

A S N1 I S OS P I S OT P

Read LD and LN Values from CID file

MMS Ms gUt i l

COMMS er v

I S OPP

Describe functions(LD, LN) in IED and substation

- 

Create and analyze IEC 61850 MMS message

- 

Encode and decode messages

Communication

(S es s i on Pr ot ocol ) (T r ans por t Pr ot ocol )

Gener al S ock et

§  Communication

Structure of IEC 61850 Library

- 

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OSI 7 Layers mapping

SCL Engineering SSD SSD

ICD ICD

"   All devices in substation are described by SCL engineering. System System Configulator Configurator

SCD SCD

"   SCL(System Configuration Language) §  XML type §  ICD(IED Capability Description)

IED Configulator Configurator

CID1 CID1

Control Center

-  Describe functions of LD and LN in IED

§  SSD(System Specification Description) -  Describe single PWR line and LN in the su bstation

CID2 CID2

Ethernet Switch

Ethernet Switch

IEC 61850 Process Bus

IEC 61850 Station Bus

§  SCD(Substation Configured Description) -  Describe functions of the substation by mer ging ICD and SSD

§  CID(Configured IED Description) -  Describe and configure functions for each I ED

IED

SCL Engineering

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Initialization, Service, Communication "   Initialization Module

"   Communication Layer Module

Functions to initialize data_set and read LN, LD data from CID file.

Init_SCL

COMMServ

Functions to set or free the connection and take responsibility for receiving and sending packets.

ACSEServ

Functions to provide OSI 7 layer environment of messages.

"   Service Module MMSServerRsp

MMSClientReq

MMS Response Packet Creation

MMS Request Packet Creation

MMS Request Packet Analysis

MMS Response Packet Analysis

MMSCOMMRspServ

ISOPP

Functions to negotiate the transfer syntaxes.

ASN 1

Functions to encode or decode response / request message to ASN. 1 format.

ISOSP

Functions to manage session.

ISOTP

Functions to check error.

MMSCOMMReqServ

MMS Response Packet transfer

MMS Request Packet transfer

REQControl

Functions to manage request messages and check whether the response messages are received or not MMSMpl

Functions to make MMS messages for request / response. MMSDecoder

MMSOPCode

MMSMsgUtil

GeneralSocket

Functions to decode MMS messages Functions to map variable on MMS messages. Functions to splits fields of MMS message.

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Functions to manage packets for actual communication.

Simulation "   1) server show s data value "   2) client reads data from the s erver 1) Server

2) client

"   3) client writes data to server "   4) confirm data of server

3) Client

4) Server

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Conclusion "

Developed network processor (OneChip SoC and Library) for I EC 61850 will be core functions in Smart Grid

"

Network processor with high reliability, small size, low power an d short period time of development

"

Library with expandabilities and readabilities by OOP

"

It is easy for users to develop an IED by providing one pass net work processor

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