Oct 3, 2005 ... Driving Leading Edge. Microprocessor Technology. Dr. Hans Deppe. Corporate
Vice President & General Manager. AMD in Dresden. October ...
Driving Leading Edge Microprocessor Technology Dr. Hans Deppe Corporate Vice President & General Manager AMD in Dresden
October 3, 2005
AMD Overview A leading global supplier of innovative semiconductor solutions for the personal and enterprise computing, communications and consumer electronic markets • Founded: 1969
• Products:
• Headquarters: Sunnyvale, California • Employees: ~16,700 worldwide • Sales 2004: $ 5.0 billion
- Microprocessors & Personal Connectivity Solutions - Flash Memory Products
• Revenue increase 2003/2004: 42 % • Sales Mix: 78% international
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AMD worldwide Boston, Massachusetts Sunnyvale, California
Boston Design Center
~ $ 5 billion investment 1996 - 2007
AMD global HQ Spansion global HQ Submicron Development Center
Aizu-Wakamatsu/ Tokyo, Japan Flash Memory Fabs Spansion Japan HQ Japan Engineering Lab
Bangkok, Thailand Dresden, Germany
Longmont, CO
Flash Memory Assembly and Test
Suzhou, China Microprocessor and Flash Memory Assembly and Test
Fab 30 — Fab 36 — Microprocessors Dresden Design Center
Design Center
Austin, Texas Fab 25 — Flash Memory Computation Product Group Personal Connectivity Solutions Group
Singapore Microprocessor Test, Mark and Pack
Banglore, India Engineering Center
Penang/ Kuala Lumpur, Malaysia Microprocessor and Flash Assembly Test and Packaging
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AMD Fab 30 – “Leading Edge” for Microprocessor Technology AMD Fab 30 runs full product range in high volume production Leadership: First to volume copper First to volume SOI First to volume low-k
AMD Opteron™ processor and AMD Athlon™ 64 processor running mature yields 90 nm in volume production
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AMD Fab 36 — AMD’s next flagship Based on the superior manufacturing performance of AMD in Dresden
November 2003: Groundbreaking November 2004: Ready for Equipment
Planned for 65nm, 45nm and 32nm technology generations
March 2005: First wafer started
Technology alliance between AMD & IBM
October 2005: Grand Opening
Planned investment until 2007: $2.5 Billion
2006: Volume shipments to market
AMD Fab 36 AMD Fab 30
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Highly Successful 90nm Technology Transition High yield at start of volume production Builds on 130nm SOI success Increased thermal efficiencies
90nm
130nm
193mm2
115mm2
Significant die-size reductions Addition of strained silicon transistor technology
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90nm
130nm
145mm2
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84mm2
SOI: Dramatically Improved Performance and Power Efficiencies
At equivalent Off current, SOI can provides up to 18% performance improvement over bulk-Si technology
12 Delay/Stage (ps)
Silicon-on-Insulator Advantages:
VDD=1.4V T=25oC
11 10 9
PD/SOI Bulk-Si
8 1
10
100
1000
ID-off (n+2p) (nA/μm)
Vertical Cj component is eliminated thus RC delay can be decreased Higher Reliability due to elimination of latch-up effect and higher radiation hardness
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SOI
Bulk
G
G S
D
S
P-substrate
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D SiO2 BOX
Eliminating Architectural Bottlenecks CPU CPU
8 GB/S
CPU CPU
8 GB/S
I/O I/OHub Hub
PCI-E PCI-E Bridge Bridge PCI-E PCI-E Bridge Bridge PCI-E PCI-E Bridge Bridge
Memory Memory PCI-E PCI-E Controller Controller Bridge Bridge Hub Hub
8 GB/S
PCI-E PCI-E Bridge Bridge
PCI-E PCI-E Bridge Bridge
8 GB/S
I/O I/OHub Hub
Legacy x86 Architecture • • • •
20-year old front-side bus architecture CPUs, Memory, I/O all share a bus Major bottleneck to performance Faster CPUs or more cores ≠ performance
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USB USB PCI PCI
AMD64 Technology with Direct Connect Architecture • Industry-standard AMD64 technology • AMD’s revolutionary Direct Connect Architecture eliminates FSB bottleneck • HyperTransport™ Technology interconnect for high bandwidth and low latency
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Transistor Roadmap Source: AMD and ITRS-Roadmap from the SIA
SOI and Copper Technology
Lg = 32 nm
Lg = 13 nm
Transistor For 90 nm
Lg = 22 nm 22nm-Generation
(2011) 32nm-Generation 45nm-Generation
(2009) 3.01 B Transistors per Chip
(2007) 65nm-Generation
1.5 B Transistors per Chip
(2005) 90nm-Generation
380 M Transistors per Chip
(2003)
180 M Transistors per Chip
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APM: Unique Technology Framework Over 400 AMD patented or patent-pending technologies
Highly automated and synchronized decision making
Equipment Performance Optimization
Yield Management Systems
Product Performance Targeting
APM Framework
Integrated Production Scheduling
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Advanced Process Control
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Five integrated algorithmic analysis systems — much more than just APC Includes proprietary technologies, logic and business processes Fed by fab-wide tool and data integration
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APM is More than Great Technology Seamless blending of the best people and the best technologies is what makes APM so successful
Unique Technology Framework
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APM
Unique Employee Skill Sets
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Ongoing Success in Saxony Dresden: One of Europe’s largest microelectronics clusters Center of operations for AMD microprocessor fabrication Tremendous ongoing success for AMD, The Free State of Saxony, and Germany Over 7,000 jobs directly or indirectly created by AMD since 1996
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Delivering on the Promise: Balance of AMD‘s engagement in Dresden Plan 1995 Direct jobs
Plan 2007
1.430
~3.000
Indirect jobs*
~2.100
~4.500
Jobs created
~3.500
~7.500
1,9
~5,0
Investment in $ billions
* Creation of ~ 1.5 indirect jobs per each direct AMD job Source: DIW, AMD
We have made commitments – we have met our commitments.
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AMD, the AMD Arrow logo and combinations thereof are trademarks of Advanced Micro Devices, Inc. Other product names used in this presentation are for identification purposes only and may be trademarks of their respective companies. ©Copyright 2005 Advanced Micro Devices, Inc. All rights reserved.
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