Atomic Layer Deposition Applications 7 Editors: J. W. Elam
S. De Gendt
Argonne National Laboratory Argonne, Illinois, USA
imec Leuven, Belgium
A. Londergan
S. F. Bent
Qualcomm MEMS Technologies San Jose, California, USA
Stanford University Stanford, California, USA
O. van der Straten
A. Delabie
IBM Research Albany, New York, USA
imec Leuven, Belgium
F. Roozeboom Eindhoven University of Technology and TNO Eindhoven, Netherlands
Sponsoring Divisions: Dielectric Science & Technology Electronics and Photonics
Published by
TM
The Electrochemical Society 65 South Main Street, Building D Pennington, NJ 08534-2839, USA tel 609 737 1902 fax 609 737 2743 www.electrochem.org
Vol. 41, No. 2
Copyright 2011 by The Electrochemical Society. All rights reserved. This book has been registered with Copyright Clearance Center. For further information, please contact the Copyright Clearance Center, Salem, Massachusetts. Published by: The Electrochemical Society 65 South Main Street Pennington, New Jersey 08534-2839, USA Telephone 609.737.1902 Fax 609.737.2743 e-mail:
[email protected] Web: www.electrochem.org ISSN 1938-6737 (online) ISSN 1938-5862 (print) ISSN 2151-2051 (cd-rom) ISBN 978-1-56677-902-9 (Hardcover) ISBN 978-1-60768-256-1 (PDF) Printed in the United States of America.
PREFACE The seventh symposium on Atomic Layer Deposition Applications was held October 10 through 12, 2011 in Boston, Massachusetts, as part of the 220th Meeting of the Electrochemical Society. The focus of this symposium is the continuously expanding realm of Atomic Layer Deposition (ALD) applications. ALD allows the precise deposition of ultrathin, highly conformal coatings over complex, 3D topographies with controlled composition and properties. In its 7th successful year, this symposium has become a forum for sharing cutting edge research in the various technologies where ALD is currently used. Emerging and non-mainstream ALD applications are also of special interest. This issue of the ECS Transactions contains 36 peer reviewed papers presented at the symposium. The papers are organized into Chapters generally following the order and structure of the symposium sessions. Featured ALD topics include ALD for photovoltaics, ALD for batteries and fuel cells, dielectrics for stateof-the-art transistors and capacitors, and the ALD of metals and metal nitrides. A number of papers report on advances in ALD precursor and equipment development, and in particular the continued progress in high throughput ALD equipment. We wish to thank the invited speakers for their outstanding contributions: Ivo Raaijmakers, ASM International, Soo-Hyun Kim, Yeungnam University, Johan Swerts, IMEC, Kornelius Nielsch, University of Hamburg, Fritz Prinz, Stanford University, Titta Aaltonen, University of Oslo, Jane Chang, University of California, Simon Elliott, Tyndall National Institute, Christian Wenger, IHP, Jacques Kools, Encapsulix SAS, Thomas Proslier, Argonne National Laboratory, Byunghoon Yoon, University of Colorado, Gijs Dingemans, Technische Universiteit Eindhoven, Nicolas Tetreault, Ecole Polytechnique Federale de Lausanne The financial support of the symposium sponsors is gratefully acknowledged: Air Liquide, Applied Materials, Cambridge NanoTech, Gelest and Tokyo Electron.
Jeffrey W. Elam Fred Roozeboom Annelies Delabie Oscar van der Straten Stacey F. Bent Stefan De Gendt Ana Londergan
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ECS Transactions, Volume 41, Issue 2 Atomic Layer Deposition Applications 7
Table of Contents Preface
iii
Chapter 1 Microelectronics (Invited) Current and Future Applications of ALD in Micro-Electronics I. J. Raaijmakers
3
(Invited) Low Temperature Atomic Layer Deposition of Ru Thin Films with Enhanced Nucleation Using Various Ru(0) Metallorganic Precursors and Molecular O2 S. Kim
19
ALD Barrier Deposition on Porous Low-k Dielectric Materials for Interconnects S. Van Elshocht, A. Delabie, S. Dewilde, J. Meersschaut, J. Swerts, H. Tielens, P. Verdonck, T. Witters, and E. Vancoille
25
Copper-ALD Seed Layer as an Enabler for Device Scaling J. Mao, E. Eisenbraun, V. Omarjee, A. Korolev, and C. Dussarrat
33
(Invited) Plasma Enhanced Atomic Layer Deposited Ruthenium for MIMCAP Applications J. Swerts, M. Salimullah, M. Popovici, M. Kim, M. Pawlak, A. Delabie, M. Schaekers, K. Tomida, B. Kaczer, K. Opsomer, C. Vrancken, I. Debusschere, L. Altimime, J. Kittl, and S. Van Elshocht
41
(Invited) ALD and AVD Grown Perovskite-type Dielectrics for Metal-Insulator-Metal Applications C. Wenger, M. Lukosius, T. Blomberg, A. Abrutis, P. Baumann, and G. Ruhl
53
Plasma-Assisted Atomic Layer Deposition of SrTiO3: Stoichiometry and Crystallinity Study by Spectroscopic Ellipsometry V. Longo, N. Leick, F. Roozeboom, and W. Kessels
63
Low Equivalent Oxide Thickness TiO2 Based Capacitors for DRAM Application K. Fröhlich, B. Hudec, K. Hušeková, J. Aarik, A. Tarre, A. Kasikov, R. Rammula, and A. Vincze
73
v
Optimizing ALD HfO2 for Advanced Gate Stacks with Interspersed UV and Thermal Treatments- DADA and MDMA Variations, Combinations, and Optimization R. D. Clark, S. Consiglio, G. Nakamura, Y. Trickett, and G. J. Leusink
79
Structural Characteristics of Electrically Scaled ALD HfO2 from Cyclical Deposition and Annealing Scheme S. Consiglio, R. D. Clark, E. Bersch, J. LaRose, I. Wells, K. Tapily, G. J. Leusink, and A. Diebold
89
Chapter 2 Nanotechnology (Invited) Tailor-Made, Magnetic Nanotubes by Template-Directed Atomic Layer Deposition R. Zierold and K. Nielsch
111
ALD Applied to Conformal Coating of Nanoporous -Alumina: Spinel Formation and Luminescence Induced by Europium Doping E. Rauwel, O. Nilsen, A. Galeckas, J. Walmsley, E. Rytter, and H. Fjellvåg
123
Metalcone and Metalcone/Metal Oxide Alloys Grown Using Atomic and Molecular Layer Deposition B. Lee, V. Anderson, and S. George
131
Nanocomposites of ALD Hafnia Nanotubes Surface Functionalized with Gold Nanoparticles T. Abdel-Fattah, D. Gu, and H. Baumgart
139
Chapter 3 Reaction Mechanisms and Modeling Indium Oxide ALD Using Cyclopentadienyl Indium and Mixtures of H2O and O2 J. W. Elam, J. A. Libera, and J. N. Hryn
147
In Situ Gas-Phase Diagnostics for Titanium Nitride Atomic Layer Deposition J. E. Maslar, W. Kimes, and B. Sperling
157
Diffusion-Reaction Model of ALD in Nanostructured Substrates: Analytic Approximations to Dose Times as a Function of the Surface Reaction Probability A. Yanguas-Gil and J. W. Elam
169
(Invited) Reaction Mechanisms in ALD of Ternary Oxides S. D. Elliott and O. Nilsen
175
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Chapter 4 Equipment and Precursors Picosun SUNALE ALD Systems for High Quality Nanocoatings - Bridging the Gap between R&D and Industrial Production M. Toivola, T. Lehto, W. Li, T. Pilvi, and P. J. Soininen
187
(Invited) High Throughput Atomic Layer Deposition for Encapsulation of Large Area Electronics J. Kools
195
ALD for a Sustainable Future - Paving the Way to a Cleaner World from Sub-Nanometer Level M. Toivola and T. Pilvi
203
Development of Novel Silicon Precursors for Low-Temperature CVD/ALD Processes K. Iwanaga, K. Tada, H. Chiba, T. Yamamoto, A. Maniwa, T. Yotsuya, and N. Oshima
211
Atomic Layer Deposition of AlN with Tris(Dimethylamido)Aluminum and NH3 G. Liu, E. Deguns, L. Lecordier, G. Sundaram, and J. Becker
219
Chapter 5 Emerging Applications Deposition and Characterization of Atomic Layer Deposited ZnS Thin Films on p-type GaSb(100) Using Diethylzinc Precursor and Hydrogen Sulfide R. Xu, J. Huang, S. Ghosh, and C. Takoudis
229
(Invited) Atomic Layer Deposition of Superconductors T. Proslier, J. Klug, N. C. Becker, J. W. Elam, and M. Pellin
237
Study of Atomic Layer Deposition of ZnO on a Polar Oxide Substrate by In Situ Quartz Crystal Microbalance K. Pradhan and P. F. Lyman
247
Atomic Layer Deposition of Antimony Telluride Thin Films Using (Me3Si)2Te with SbCl3 as Precursors D. Gu, D. Nminibapiel, H. Baumgart, H. Robinson, and V. Kochergin
255
Enabling High Performance Instruments for Astronomy and Space Exploration with ALD F. Greer, M. Hoenk, B. Jacquot, T. Jones, M. Dickie, S. Monacos, S. Nikzad, E. Hamden, D. Schmonivich, P. Day, and H. Leduc
263
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Chapter 6 Photovoltaics, Batteries, and Fuel Cells (Invited) Molecular Layer Deposition of Flexible, Transparent and Conductive Hybrid Organic-Inorganic Thin Films B. Yoon, B. Lee, and S. George
271
Novel Hybrid Organic/Inorganic Photovoltaic Device Configuration Utilizing ALD Technology and Template Based Nanoelectrode Arrays D. Gu, H. Baumgart, and G. Namkoong
279
Atomic Layer Deposited Oxides for Passivation of Silicon Photoelectrodes for Solar Photoelectrochemical Cells B. Kalanyan and G. Parsons
285
(Invited) Aluminum Oxide and Other ALD Materials for Si Surface Passivation G. Dingemans and W. Kessels
293
(Invited) Atomic Layer Deposition for Novel Dye-Sensitized Solar Cells N. Tétreault, L. Heiniger, M. Stefik, P. L. Labouchère, E. Arsenault, N. K. Nazeeruddin, G. A. Ozin, and M. Grätzel
303
(Invited) Atomic Layer Deposited Yttria Stabilized Zirconia Barrier Layer for Proton Conducting Oxide J. Park, S. Kang, T. M. Gür, and F. Prinz
315
Remote Plasma Atomic Layer Deposition of Thin Films of Electrochemically Active LiCoO2 M. E. Donders, H. C. Knoops, W. Kessels, and P. H. Notten
321
(Invited) ALD of Thin Films for Lithium-Ion Batteries T. Aaltonen, V. Miikkulainen, K. Gandrud, A. Pettersen, O. Nilsen, and H. Fjellvåg
331
Author Index
341
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