TI SimpleLink™ CC3000 Module – Wi-Fi 802.11b/g Network Processor .....
Observe the following module layout recommendations (see also Figure 11): •
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CC3000
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SWRS126 – NOVEMBER 2012
TI SimpleLink™ CC3000 Module – Wi-Fi 802.11b/g Network Processor FEATURES
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• Wireless network processor – IEEE 802.11 b/g – Embedded IPv4 TCP/IP stack • Best-in-class radio performance Wi-Fi™ – TX power: +18.0 dBm at 11 Mbps, CCK – RX sensitivity: –88 dBm, 8% PER, 11 Mbps • Works with low MIPS and low-cost MCUs with compact memory footprint • FCC, IC, and CE certified with a chip antenna • HW design files and design guide available from TI • Integrated crystal and power management • Small form factor: 16.3 mm × 13.5 mm × 2 mm 234
• • •
Operating temperature: –20°C to 70°C Based on TI's seventh generation of proven Wi-Fi solutions Complete platform solution including user and porting guides, API guide, sample applications, and support community
APPLICATIONS • • • • •
Home automation Home security Connected appliances Smart energy M2M communication
DESCRIPTION The TI CC3000 module is a self-contained wireless network processor that simplifies the implementation of Internet connectivity (see Figure 1). TI's SimpleLink™ Wi-Fi solution minimizes the software requirements of the host microcontroller (MCU) and is thus the ideal solution for embedded applications using any low-cost and lowpower MCU. The TI CC3000 module reduces development time, lowers manufacturing costs, saves board space, eases certification, and minimizes the RF expertise required. This complete platform solution includes software drivers, sample applications, API guide, user documentation, and a world-class support community. For more information on TI’s wireless platform solutions for Wi-Fi, go to TI's Wireless Connectivity wiki (www.ti.com/connectivitywiki).
SWRS126-013
Figure 1. Wi-Fi Solution for TI SimpleLink CC3000 Module
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SimpleLink, Smart Config are trademarks of Texas Instruments. Wi-Fi is a trademark of Wi-Fi Alliance. All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
CC3000
Not Recommended For New Designs
SWRS126 – NOVEMBER 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
FEATURES WLAN • • • • •
802.11b/g integrated radio, modem, and MAC supporting WLAN communication as a BSS station with CCK and OFDM rates from 1 to 54 Mbps in the 2.4-GHz ISM band Auto-calibrated radio with a single-ended 50-Ω interface enables easy connection to the antenna without requiring expertise in radio circuit design. Advanced connection manager with seven user-configurable profiles stored in an NVMEM allows automatic fast connection to an access point without user or host intervention. Supports all Wi-Fi security modes for personal networks: WEP, WPA, and WPA2 with on-chip security accelerators Smart Config™ WLAN provisioning tools allow customers to connect a headless device to a WLAN network using a smart phone, tablet, or PC.
Network Stack • Integrated IPv4 TCP/IP stack with BSD socket APIs enables simple internet connectivity with any microcontroller, microprocessor, or ASIC. • Supports four simultaneous TCP or UDP sockets • Built-in network protocols: ARP, ICMP, DHCP client, and DNS client enable easy connection to the local network and to the Internet. Host Interface and Driver • Interfaces over 4-wire serial peripheral interface (SPI) with any microcontroller, or processor at clock speed up to16 MHz • Low footprint driver provided for TI MCUs and easily ported to any processor or ASIC • Simple APIs enable easy integration with any single-threaded or multi-threaded application. System • Works from a single, preregulated power supply or connects directly to a battery • Separated I/O voltage rail allows flexible integration with host processors • Ultra-low leakage shut-down mode with current 3.6V TYP
C5 1uF CAP1005 GND GND GND GND
10
RESERVED_3
R2 0R RES1005
37 38 39 40
GND
GND
WL_RS232_RX
9
SPI_CLK
8
GND
WL_EN1
CC3000MOD
18
WL_RS232_TX
7
17
WL_EN2
6
GND
5
16
TP5
TP4 and TP5 CC3000 Radio Tool Connection 1.8V.
NC
4
SPI_DIN
TP4
3
15
R5 0R RES1005
SDA_EEPROM
SPI_IRQ
0R NC
RESERVED_1
27
SPI_DOUT
NC 0R
Test Mode for Radio Tool Operation
TP2
28
GND
14
Function mode
R4 NL RES1005
GND
36
R5
SDA_CC3000
2
SPI_CS
R4
RF_ANT
GND 1 TP1
Mode
R1 0R RES1005
NL_10pF CAP1005
13
C3
12
2 1 3
J1 NL_U.FL-R-SMT(10) U.FL
C2 10pF CAP1005
GND GND GND GND GND GND
Optional for conductive measurment
WL_SPI_CLK_HOST WL_SPI_DIN_HOST WL_SPI_IRQ_HOST WL_SPI_DOUT_HOST WL_SPI_CS_HOST
Connect to Host SPI Interface. SWRS126-009
Figure 9. CC3000 Module to Host Reference Design NOTE For flexibility, VIO_HOST supports both cases in which the VBAT and VIO voltages of the MCU can be the same or different. Table 9 lists the bill of materials. Table 9. Bill of Materials Part Reference ANT1 C1
C0402, 2.2 pF
Manufacturer PN
ACX
AT8010-E2R9HAA
Walsin
0402N2R2C500LT Hl1005-1C2N2SMT
L2
L0402, 2.2 nH
ACX
C0402, 10 pF
Walsin
0402N100J500LT
C4, C5 (1)
C0402, 1 µF
Murata
GRM155R60J105KE19D
R0402, 0R
Walsin
WR04X000PTL
RF coaxial U.FL, SMD
Hirose
U.FL-R-SMT-1(10)
J1
12
Manufacturer
C2 (1) R1, R2, R5 (1)
(1)
Description 2.4-GHz chip antenna, 8.0 × 1.0 mm
Any component with similar values can be used.
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Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: CC3000
CC3000
Not Recommended For New Designs www.ti.com
SWRS126 – NOVEMBER 2012
DESIGN RECOMMENDATIONS This section describes the layout recommendations for the CC3000 module, RF trace, and antenna.
Antenna The ACX ceramic antenna is mounted on the CC3000 EVM board with a specific layout and matching circuit for the radiation test conducted in FCC, CE and IC certifications. Figure 10 shows the location of the antenna on the EVM board as well as the RF trace routing from the CC3000 module.
No trace and
Via stitching beside RF trace
ground under Antenna on
antenna section
the edge of PCB
Top layer
Bottom layer
Constant
No sharp
impedance for
corner
RF trace SWRS126-015
Figure 10. RF Trace and Antenna Design for PCB Layout
Module Layout Recommendations Observe the following module layout recommendations (see also Figure 11): • Have a solid ground plane and ground vias under the module for stable system and thermal dissipation. • Do not run signal traces underneath the module on a layer where the module is mounted. • Signal traces can be run on a third layer under the solid ground layer and beneath the module mounting layer.
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Product Folder Links: CC3000
13
CC3000
Not Recommended For New Designs
SWRS126 – NOVEMBER 2012
www.ti.com
Signal trace Solid ground plane and vias
run on third layer
No trace under module
Top layer
Bottom layer SWRS126-014
Figure 11. Module Layout
RF Trace and Antenna Layout Recommendations Observe the following recommendations for RF trace and antenna layout (see also Figure 10): • RF traces must have 50-Ω impedance (microstrip transmission line). • RF trace bends must be gradual with a maximum bend of approximately 45 degrees and with trace mitered. RF traces must not have sharp corners. • There must be no traces or ground under the antenna section. • RF traces must have via stitching on the ground plane beside the RF trace on both sides. • RF traces must be as short as possible. The antenna, RF traces, and the module must be on the edge of the PCB product in consideration of the product enclosure material and proximity.
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Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: CC3000
PACKAGE OPTION ADDENDUM
www.ti.com
25-Apr-2017
PACKAGING INFORMATION Orderable Device
Status (1)
Package Type Package Pins Package Drawing Qty
CC3000MOD
NRND
46
CC3000MODR
NRND
46
CC3000MODT
NRND
CC3000YFVR
NRND
84
46 DSBGA
YFV
126
2500
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
TBD
Call TI
Call TI
-20 to 70
TBD
Call TI
Call TI
-20 to 70
TBD
Call TI
Call TI
Green (RoHS & no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
Op Temp (°C)
Device Marking (4/5)
CC3000
(1)
The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Apr-2017
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
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