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a dimensionless reverse-pulse current up to 2.0 define the practical regime during metal plating. This analysis has been applied to copper deposition, for which ...
JOURNAL OF APPLIED ELECTROCHEMISTRY 27 (1997) 299±307

Determination of the practical range of parameters during reverse-pulse current plating S. ROY Department of Chemical and Process Engineering, University of Newcastle upon Tyne, NE1 7RU, Great Britain D. LANDOLT Laboratoire du meÂtallurgie chimie, DeÂpartment des mateÂriaux, Ecole Polytechnique FeÂdeÂrale du Lausanne, CH1015, Lausanne, Switzerland Received 2 February 1996; revised 23 May 1996

A theoretical analysis based on charge balance and steady state and transient mass-transfer considerations has been used to determine the practical range of parameters during reverse-pulse current plating. The analysis shows that small duty cycles

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