Finite Element Simulation and Validation of Chip ... - ScienceDirect

2 downloads 0 Views 2MB Size Report
LQ RUGHU WR SRLQW RXW VRPH GLIIHUHQFHV LQ WHUPV RI FKLS ... HIIHFW RI VLQJOH DQG PXOWL OD\HU 7L$,1 DQG &%1 FRDWLQJV ZDV ...
Procedia Manufacturing Volume 1, 2015, Pages 728–739 43rd Proceedings of the North American Manufacturing Research Institution of SME http://www.sme.org/namrc

)LQLWH(OHPHQW6LPXODWLRQDQG9DOLGDWLRQRI&KLS )RUPDWLRQDQG&XWWLQJ)RUFHVLQ'U\DQG&U\RJHQLF &XWWLQJRI7L±$O±9 

$ 'DYRXGLQHMDG (&KLDSSLQL67LUHOOL0$QQRQLDQG06WUDQR

0HFKDQLFDO(QJLQHHULQJ'HSDUWPHQW3ROLWHFQLFRGL0LODQRYLD/D0DVD0LODQR,WDO\  /DERUDWRULR0863YLD7LURWWL3LDFHQ]D,WDO\

DOLGDYRXGLQHMDG#SROLPLLW

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

2351-9789 © 2015 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/). Peer-review under responsibility of the NAMRI Scientific Committee doi:10.1016/j.promfg.2015.09.037

FE

Simulation and Validation of Chip Formation and Cutting Forces in Dry and Cryogenic Cutting of Ti–6Al–4V Ali Davoudinejad, Elio Chiappini, Stefano Tirelli, Massimiliano Annoni and Matteo Strano

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

Suggest Documents