DSA

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Towards cost-effective and low defectivity DSA flows for line/space ... BCP anneal duration: most critical process step from a cost perspective .... Takehito Seo.
Towards cost-effective and low defectivity DSA flows for line/space patterning Hari Pathangi, Arindam Malik, B.T. Chan, Varun Vaid, Nadia Vandenbroeck, Roel Gronheid

Jin Li, Baskaran Durairaj, JiHoon Kim, SungEun Hong,Yi Cao, Guanyang Lin

DSA line/space test vehicles at imec

15 nm half pitch SMARTTM flow

14 nm half pitch LiNe flow

All DSA materials (mats, brushes and BCPs) used in this work were synthesized by Merck 2

© imec

DSA: a cost perspective 

Modified imec wafer cost model v3.2 used in the analysis 



Compared SAQP vs DSA for front-end line patterning exercise

Main conclusions were    

DSA adoption would reduce the number of process steps significantly The number of lithography steps in both the alternatives are same Hard-mask stack strategy for DSA process is simpler 



Tool time would be less

First promising signs for DSA

3

© imec

But, will BCP anneal duration ruin the advantage? 

BCP anneal duration: most critical process step from a cost perspective 







Current PoR  single wafer anneal in litho track

Low defectivity DSA typically needs long(er) BCP anneal duration Current defectivity PoR anneal = 255 OC for 2.5 hours (hotplate)

Optimal BCP anneal from a cost perspective was demonstrated  