micromachines Article
Scalable, Modular Three-Dimensional Silicon Microelectrode Assembly via Electroless Plating Jörg Scholvin 1 , Anthony Zorzos 1 , Justin Kinney 1 , Jacob Bernstein 1 , Caroline Moore-Kochlacs 1,2 , Nancy Kopell 2 , Clifton Fonstad 1 and Edward S. Boyden 1, * 1
2
*
Massachusetts Institute of Technology, Cambridge, MA 02139, USA;
[email protected] (J.S.);
[email protected] (A.Z.);
[email protected] (J.K.);
[email protected] (J.B.);
[email protected] (C.M.-K.);
[email protected] (C.F.) Department of Mathematics, Boston University, Boston, MA 02215, USA;
[email protected] Correspondence:
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Received: 31 July 2018; Accepted: 24 August 2018; Published: 30 August 2018
Abstract: We devised a scalable, modular strategy for microfabricated 3-D neural probe synthesis. We constructed a 3-D probe out of individual 2-D components (arrays of shanks bearing close-packed electrodes) using mechanical self-locking and self-aligning techniques, followed by electroless nickel plating to establish electrical contact between the individual parts. We detail the fabrication and assembly process and demonstrate different 3-D probe designs bearing thousands of electrode sites. We find typical self-alignment accuracy between shanks of
