Abstract- 3D Sequential Integration (3DSI) with ultra-small 3D contact pitch ... (
3D Sequential Integration: Application-driven technological achievements and guidelines P. Batude1,2, L. Brunet1,2, C. Fenouillet-Beranger1,2, F. Andrieu1,2, J-P. Colinge1,2, D. Lattard1,2, E. Vianello1,2, S. Thuries1,2, O. Billoint1,2, P. Vivet1,2, C. Santos1,2, B. Mathieu1,2, B. Sklenard1,2, C.-M. V. Lu1,2, J. Micout1,2,3, F. Deprat1,2, E. Avelar Mercado1,2, F. Ponthenier1,2, N. Rambal1,2, M.-P. Samson4, M. Cassé1,2, S. Hentz1,2, J. Arcamone1,2, G. Sicard1,2, L. Hutin1,2, L. Pasini1,2,3,4, A. Ayres1,2, O. Rozeau1,2, R. Berthelon1,2,4, F. Nemouchi1,2, P. Rodriguez1,2, J-B. Pin5, D. Larmagnac5, V. Ripoche5, S. Barraud1,2, N . Allouti1,2, S. Barnola1,2, C. Vizioz1,2, J.-M. Hartmann1,2, S. Kerdiles1,2, P. Acosta Alba1,2, S. Beaurepaire1,2, V. Beugin1,2, F. Fournel1,2, P. Besson4, V. Loup1,2, R. Gassilloud1,2, F. Martin1,2, X. Garros1,2, F. Mazen1,2 , B. Previtali1,2 , C.Euvrard-Colnat 1,2, V. Balan1,2 , Mazzocchi1,2, O. Faynot1,2 and M. Vinet1,2 .1CEA- leti, Minatec Campus, Grenoble, France/ 2 Université Grenoble Alpes, France/ 3 IMEP-LAHC, Grenoble, France 4ST Microelectronics, Crolles, France / 5Applied Materials, Bernin, France 3DSI and 3D packaging for different nodes. State-Of-The-Art (SOTA) 3D packaging achieves a maximum density of 105 vias/mm2 while 3DSI demonstration using conservative 65nm design rules already achieves a maximum density of 2×107 via/mm2 [ 1] . 9
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3D via density (#/mm2)
Abstract- 3D Sequential Integration (3DSI) with ultra-small 3D contact pitch (
