Message from the Program Chairs - High ...

Welcome to the twelfth Hot Interconnects, sponsored by the IEEE Computer Society. This year we welcome technical co-sponsorship from the IEEE Communications Society, which reflects the decreasing distinction between the interconnection within a computer system and the larger network. The technical sessions cover this entire range. This year we received 31 papers, each of which received at least three reviews. Eleven were unconditionally accepted, and three more were accepted after shepherding. This year we have decided to recognize outstanding papers, and had a difficult decision. Therefore we have decided on a tie for best paper award: “Efficient Multi-Match Packet Classification with TCAM” by Fang Yu and Randy H. Katz from UC Berkeley, and “A Localized Congestion Control Mechanism for PCI Express Advanced Switching Fabrics” by Venkata Krishnan and David Mayhew of Stargen in Marlborough Mass. We congratulate these authors on their achievement. We would like to thank the technical program committee members for their thorough reviews and participation in the TPC meeting. On the first day, Nick McKeown’s keynote address argues for bufferless networks. Session 1 covers system level interconnects, with papers on PCI Express and lnfiniband interconnects, and the Cray X I memory architecture. Session 2 explores packet classification and lookup with TCAM-based algorithms for multiple matches and cache size reduction, as well as IPv6 table characteristics. Session 3 describes routers and switches, with papers on a loadbalancing, buffer design, and multicast for high-performanceswitches. The day wraps up with an evening panel discussion on future trends in high-performance interconnects for parallel computers. On the second day, Jonathan Turner’s keynote address argues for the co-existence of virtual internetworks. Session 4 consists of two papers on worm detection and defense, and a paper on TCP offload engine performance. This is followed by a panel discussion on the prospects for practical deployment of network processors. Session 5 closes the technical program with papers on optical and wireless interconnections. The third day of the conference consists of tutorials on resilient network infrastructures for global grid computing, Internet infrastructure security, and high-speed networking. Of course, it is the authors that provide the ultimate contribution to Hot Interconnects, and we thank them for their submissions.

James Sterbenz

Dimitrios Stiliadis

University of Massachusetts

Bell Labs, Lucent Technologies, USA

and Lancaster University, UK

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