Sep 28, 2010 - Applications support interoperability data standards specific to the domain or ...... and renovation, up to 14% reduction in project schedules and repair cost .... types of cleanroom layouts; Ballroom and Bay and Chase layouts. ...... and output from the tool suppliers usually in the form of hard copies, pdfs or.
Implementation of Building Information Modeling for Wafer Fab Construction by Shruthi Pindukuri
A Thesis Presented in Partial Fulfillment of the Requirements for the Degree Master of Science
Approved April 2011 by the Graduate Supervisory Committee: Allan Chasey, Chair Avi Wiezel Michael Mamlouk
ARIZONA STATE UNIVERSITY May 2011
ABSTRACT Semiconductor manufacturing facilities are very complex and capital intensive in nature. During the lifecycle of these facilities various disciplines come together, generate and use a tremendous amount of building and process information to support various decisions that enable them to successfully design, build and sustain these advanced facilities. However, a majority of the information generated and processes taking place are neither integrated nor interoperable and result in a high degree of redundancy. The objective of this thesis is to build an interoperable Building Information Model (BIM) for the Base-Build and Tool Installation in a semiconductor manufacturing facility. It examines existing processes and data exchange standards available to facilitate the implementation of BIM and provides a framework for the development of processes and standards that can help in building an intelligent information model for a semiconductor manufacturing facility. To understand the nature of the flow of information between the various stakeholders the flow of information between the facility designer, process tool manufacturer and tool layout designer is examined. An information model for the base build and process tool is built and the industry standards SEMI E6 and SEMI E51 are used as a basis to model the information. It is found that applications used to create information models support interoperable industry standard formats such as the Industry Foundation Classes (IFC) and ISO 15926 in a limited manner. A gap analysis has revealed that i
interoperability standards applicable to the semiconductor manufacturing industry such as the IFC and ISO15926 need to be expanded to support information transfers unique to the industry. Information modeling for a semiconductor manufacturing facility is unique in that it is a process model (Process Tool Information Model) within a building model (Building Information Model), each of them supported more robustly by different interoperability standards. Applications support interoperability data standards specific to the domain or industry they serve but information transfers need to occur between the various domains. To facilitate flow of information between the different domains it is recommended that a mapping of the industry standards be undertaken and translators between them be developed for business use.
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This is for my loving husband.
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ACKNOWLEDGMENTS
I would like to express my deepest gratitude to Dr. Allan Chasey for his patience, guidance and continuous support throughout my graduate studies. I would like to thank Dr. Avi Wiezel and Dr. Michael Mamlouk for their support of my thesis. I would like to thank Mike Alianza and Dan Hodges of Intel for helping me gain industry exposure. I would like to thank the CREATE office for supporting my graduate studies. Lastly, I would like to thank my parents and husband for their patience and support.
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TABLE OF CONTENTS Page LIST OF TABLES...................................................................................................... ix LIST OF FIGURES ..................................................................................................... x
CHAPTER
1. Introduction................................................................................................ 1 1.1 Background ................................................................................... 1 1.2 Problem Statement ........................................................................ 4 1.3 Hypothesis..................................................................................... 5 1.4 Objective ....................................................................................... 5 1.5 Scope ............................................................................................. 6 2. Literature Study ......................................................................................... 7 2.1 Semiconductor Manufacturing Facilities ..................................... 7 2.1.1 Cleanroom Standards ................................................. 7 2.1.2 Wafer Size.................................................................. 8 2.1.3 Line Width ................................................................. 9 2.1.4 Wafers per Month (WPM) ......................................... 9 2.1.5 Characteristics of Semiconductor Manufacturing Facilities .............................................................................. 9
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Chapter
Page 2.2 Semiconductor Manufacturing Facility – Base Build + Tool Install ................................................................................................. 10 2.2.1 Base Build ................................................................ 11 2.2.2 Process Tool Installation .......................................... 14 2.3 Building Information Modeling (BIM) ...................................... 20 2.3.1 Background .............................................................. 20 2.3.2 Challenges of Traditional Approaches..................... 21 2.3.3 Building Information Modeling- Definition ............ 23 2.3.4 Pre-Construction and Post-Construction Benefits to Owner ................................................................................ 24 2.3.5 Design Benefits to Architects and Engineers........... 26 2.3.6 Construction Benefits to Contractors ....................... 28 2.3.7 Building Information Modeling Benefits for Subcontractors and Fabricators ......................................... 31 2.3.8 Parametric Modeling ................................................ 32 2.4 Interoperability............................................................................ 33 2.4.1 Industry Foundation Classes (IFC) .......................... 36 2.4.2 Information Delivery Manual (IDM) ....................... 43 2.4.3 International Framework for Dictionaries (IFD) ..... 45
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Chapter
Page 2.4.4 ISO 15926 - "Industrial automation systems and integration‖ ....................................................................... 49 2.4.5 Other Data Standards – STEP, IGES ....................... 59 2.4.6 SEMI Standards for Semiconductor Manufacturing Facilities ............................................................................ 60 2.4.7 SEMI E51: Guide for Typical Facilities Services and Termination ....................................................................... 64 2.5 Building Information Modeling for Semiconductor Manufacturing Facilities ................................................................... 65 3. METHODOLOGY .................................................................................. 72 3.1 Hypothesis................................................................................... 72 3.2 Methodology ............................................................................... 72 3.2.1 Tool Information Model .......................................... 73 3.2.2 Building Information Model .................................... 78 3.2.3 Tool Layout Design – Tool Information Model + Building Information Model ............................................. 82 4. RESULTS ................................................................................................ 85 4.1 Scenario – 1 Export of the Tool Information Model to Facility Owner/Designer ................................................................................ 85 4.3 Scenario 3 and 4 - Import Tool Information Model and Building Information Model for Tool Layout Design .................................... 89 vii
Chapter
Page 4.4 Scenario 5 and 6 - Export Tool Information Model and Building Information Model to Autodesk Inventor and Revit MEP .............. 90 4.5 Limited Adoption of Industry Standards IFC /ISO 15926 ........ 91 4.6 Alignment in the Adoption of Industry standards IFC /ISO 15926 ................................................................................................. 92 5. FUTURE DIRECTION......................................................................... 101 5.1 IFC for Semiconductor Manufacturing Facilities .................... 102 5.2 ISO 15926 for Semiconductor Manufacturing Facilities ........ 104 5.3 Translator for IFC and ISO 15926 ........................................... 106
REFERENCES ...................................................................................................... 108 APPENDIX A
SEMI DRAFT DOCUMENT 3287 - REVISION TO E6, GUIDE FOR SEMICONDUCTOR EQUIPMENT INSTALLATION DOCUMENTATION ................................................................. 112
B
SEMI E51-0200 GUIDE FOR TYPICAL FACILITIES SERVICES AND TERMINATION MATRIX .............................................. 118
C
SEMI PERMISSION TO PUBLISH PORTIONS OF SEMI E6 0303 AND SEMI E51 0200 ................................................................. 122
D
TOOL LAYOUT DESIGN ............................................................. 124
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LIST OF TABLES Table
Page
1. SEMI E6 Data Sheet Table (SEMI 2003).. ....................................................... 61 2. SEMI E51 – Series 100 - Equipment Identification Data Sheet (SEMI 2003)..61 3. Categories of facility data (SEMI 2000).. ......................................................... 64 4. Site Specific Facilities Service and Termination Matrix .................................. 65 5. Summary of the most common exchange formats in the AEC area ................. 87 6. Mapping IFC and ISO15926 ............................................................................. 94 7. Gap Analysis of SEMI E51 Water Services Data Sheet against the IFC ......... 98 8. Gap Analysis of SEMI E6 Water Services Data Sheet against the ISO 15926 ……………………………………………………………………………………99
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LIST OF FIGURES Figure
Page
1. Classification of Air Cleanliness ........................................................................ 8 2. Components of Semiconductor Manufacturing Facility ................................... 11 3. Tool Installation Design Information Flow ...................................................... 18 4. Tool Startup Sequence and Operational Transfer. ............................................ 20 5. Time versus Ability to Impact Cost .................................................................. 21 6. Indexes of Labor Productivity .......................................................................... 22 7. Contingency/Reliability as a Function of Project Phases. ................................ 25 8. Value Added, Cost of Changes and Current Compensation Distribution for Design Services. .................................................................................................... 27 9. Snapshot of a Contractor and Subcontractor using BIM to Support MEP Coordination ......................................................................................................... 29 10. 4D view of Construction of Vancouver Convention Center showing Foundation and Structural Steel Erection ............................................................. 30 11. Improved Visualization – Moving from paper based methods to digital 3D models ................................................................................................................... 32 12. Interoperability through Standards ................................................................. 35 13. IFC, IFD and IDM components of the data exchange triangle ....................... 37 14. IFC Architecture – IFC 2x3 ............................................................................ 41 15. IDM – Architecture ......................................................................................... 45 16. IFD Library ..................................................................................................... 48 17. buildingSMART Propertylizer Tool ............................................................... 49 x
Figure
Page
18. ISO15926 Components of the Data Exchange Triangle ................................. 50 19. History of ISO 15926 ...................................................................................... 52 20. Parts of ISO 15926 .......................................................................................... 53 21. Example of Template ...................................................................................... 55 22. Reference Data Federation .............................................................................. 59 23. E6XML Schema.............................................................................................. 63 24. Facility Construction Process ......................................................................... 68 25. Semiconductor Tool Design and Installation Process .................................... 71 26. Flow of Information between Tool Manufacturer, Facility Owner/Designer and Tool Layout Designer .................................................................................... 73 27. Tool Information Model ................................................................................. 77 28. Tool Information Model from supplier imported into Revit MEP ................. 79 29. Building Information Model ........................................................................... 80 30. BIM from Semiconductor Manufacturer Exported to IFC and imported to Revit Architecture ................................................................................................. 81 31. Tool Layout Design ........................................................................................ 83 32. Scenario 1 Information transfer between Tool Manufacturer and Facility Owner/Designer .................................................................................................... 85 33. Scenario 2 Information transfer from Facility Owner/Designer to Tool Manufacturer ......................................................................................................... 88 34. Scenario 3 and 4 Information transfer from Tool Manufacturer and Facility Owner/Designer to Tool Layout Designer ............................................................ 89 xi
Figure
Page
35. Scenario 5 and 6 Information transfer from Tool Layout Designer to Tool Manufacturer and Facility Owner/Designer ......................................................... 90 36. Description of Temperature in IFC ................................................................. 94 37. Description of Temperature in ISO 15926...................................................... 95 39. IFC for Semiconductor Manufacturing Facilities ......................................... 104 40. ISO 15926 for Semiconductor Manufacturing Facilities .............................. 106
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1. Introduction 1.1 Background Semiconductor Manufacturing facilities are very complex and capital intensive in nature. Construction of these facilities often involves high levels of uncertainty, strict spending limits, aggressive schedules and fast track construction. During the various stages of the lifecycle of these facilities different disciplines come together, generate and use a tremendous amount of building and process information to support various decisions that enable them to successfully design, build and sustain these advanced facilities. In the highly fragmented construction industry, a majority of the information and processes taking place throughout the life cycle are neither integrated nor interoperable and result in a high degree of redundancy. The National Institute of Standards and Technology‘s (NIST) study ‗Cost Analysis of Inadequate Interoperability in the US Capital Facilities Industry‘ identifies and quantifies the efficiency loses in the U.S capital facilities industry attributable to inadequate interoperability to be US $ 15.8 billion in 2002 (NIBS 2007). FIATECH estimates the potential benefits of integration and automation technology to include; up to 8% reduction in costs for facility creation and renovation, up to 14% reduction in project schedules and repair cost savings ranging from 5-15% (FIATECH 2010).
Increasing awareness of the advantages of integrated project delivery methods has led to the development of various processes and tools by all participants in the 1
facility‘s lifecycle; owners, architects, designers, vendors, builders and operators. One such significant development is Building Information Modeling. According to the U.S. National Institute of Building Sciences (NIBS), ―Building Information Modeling (BIM) is a digital representation of physical and functional characteristics of a facility. A BIM is a shared knowledge resource for information about a facility forming a reliable basis for decisions during its lifecycle; defined as existing from earliest conception to demolition. A basic premise of BIM is collaboration by different stakeholders at different phases of the lifecycle of a facility to insert, extract, update or modify information in the BIM to support and reflect the roles of that stakeholder.‖ (NIBS 2007)
The extended use of 3D intelligent design (models) has led to references to terms such as 4D (adding time to the model) and 5D (adding quantities and cost of materials). Perhaps a simpler way is to think of the 3D model as a ―tool‖ then the applications of its use throughout the planning, design, construction and facility operation processes are unlimited. Based on this, when coordinating construction sequencing by integrating schedule data with the model data and calling it ―4D‖, or doing the same when using the model data to quantify materials and apply cost information and calling it ―5D,‖ seems arbitrary since these are just two of the many applications of how the 3D ―tool‖ can be used to improve all of the processes. Therefore, rather than continuing on with this numbering (6D, 7D, etc.) there is a growing trend to refer to all of the extended applications using the 3D tool as ―XD.‖ (Park 2003) 2
Based on the experience of early adopters, the use of interoperable building information models include; informed design decision-making, rapid iteration of simulations of building performance and construction sequencing, streamlining information flow and reducing time-to-complete in certain supply chains, e.g., steel, substantially reducing field problems and material waste during construction, making feasible the off-site fabrication in controlled environments of larger percentages of the building components and assemblies, increasing their quality and longevity, and reducing on-site construction activities and materials staging, creating a less crowded and safer site (Fallon 2007). Many studies and research projects have proposed other uses of the models such as automated cost estimations and work space planning. In addition, key owners have recognized the potential for capturing the information needed to fine-tune building system performance, establish appropriate maintenance practices and schedules and evaluate the feasibility of proposed expansions or renovations. Thus, the adoption of this approach holds benefits for all stakeholders in the full facility lifecycle and improves outcomes in three major dimensions of performance: cost, schedule and quality (Fallon 2007).
The semiconductor manufacturing industry in its constant quest to minimize the cost of its capital intensive facilities and speedy project delivery to match production to available market window has recognized that the implementation of BIM can help it achieve these goals. Leading semiconductor manufacturers have implemented pilot projects using BIM to understand the efficiency gains and the 3
return on investment. BIM has been implemented in both the Base Build as well as Tool Install portion of the facilities. Limited applications of BIM such as 3D modeling for visualization and clash detection, 4D construction sequencing and 5D quantity take offs have been implemented. The pilot projects showed improved operational efficiencies by reducing the number of RFI‘s and Change orders due to reduced field clashes, reduction in RFI latency time and improved quality of work in place due to increased prefabrication. Return of Investment was achieved in large part by the reduction in rework due to field clashes.
1.2 Problem Statement Current applications of BIM by the semiconductor manufacturing industry are localized implementations such as considering the flow of information specific to the scope of the current implementation (such as clash detection, and estimation), use of proprietary software and data standards. While these localized and specific processes helped understand the implementation of BIM and its Return on Investment in a time when the various stakeholders such as software vendors and standards bodies were developing the necessary infrastructure, they (localized and specific processes) make it difficult to take the implementation of BIM to the next level of expanding the applications of BIM and including all the stakeholders in the project lifecycle. While industry participants are developing business processes to integrate BIM into the current workflow, technologies and information standards need to be developed to facilitate this process. It is 4
important to understand the flow of information between all the stakeholders to for a holistic implementation of BIM and the standards available that can facilitate the exchange of data.
1.3 Hypothesis Is it possible to build an intelligent information model for a semiconductor manufacturing facility that carries the different kinds of information that the various stakeholders in its lifecycle use? Is it possible to transfer this information seamlessly between the various stakeholders through all phases its lifecycle from its development to tool layout design, installation and operation?
1.4 Objective The objective of this thesis is to build an intelligent information model for a semiconductor manufacturing facility that serves the needs of the various stakeholders involved in its lifecycle. It examines the existing processes and data exchange standards available to facilitate the implementation of BIM and provides a framework for the development of processes and standards that can help in building an intelligent information model for a Semiconductor manufacturing facility.
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1.5 Scope The design and construction of a Semiconductor Manufacturing Facility involves many different stakeholders; Tool Manufacturers, Architects, Industrial Designers, Structural Designers, Project Management Consultants, Safety Consultants, Code Compliance Agencies, General Contractors, Mechanical, Electrical, Plumbing, Fire Protection Subcontractors and facility operators. Semiconductor manufacturing facilities involve a large variety and number of toolsets. Understanding and developing business process models and implementing data exchange standards for all the stakeholders and toolsets of a semiconductor manufacturing facility would be a huge task. Due to the vast nature of the area under study, the scope of this thesis will be limited to
Building a generic tool and facility model showing information that is transferred between the tool supplier, tool layout designer (owner/IE) and facility designer (A/E)
Explore and identify standards that can help specify and facilitate the data exchange process between the base build and tool install phases. 1. ISO 15926 – Process industry standards and implementation methods 2. IFC – Industry Foundation Classes 3. SEMI Standards – SEMI E-6 4. SEMI Standards – SEMI E-51
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2. Literature Study
A study of past and current developments and literature pertaining to semiconductor manufacturing facilities, the various aspects of building information modeling and its challenges, the role of interoperability and data standards and building information modeling for wafer fab construction are presented in this section.
2.1 Semiconductor Manufacturing Facilities Semiconductor manufacturing facilities are large complex facilities that house people, process systems and tools that manufacture integrated circuits used in computing (computers, networks, internet), communications (cellphones) and manufacturing applications (digital appliances). Semiconductor manufacturing facilities are described in terms of the following:
2.1.1 Cleanroom Standards The Cleanroom is an integral part of a semiconductor manufacturing facility. It is an environment with a controlled level of contamination, specified in terms of the number of particles per cubic meter at a specified particle size. The ISO 14644-1 standards specify the number of particles 0.1 micron or larger permitted per cubic meter of air. For example, an ISO class 3 cleanroom should have a maximum of 1000 particle >= 0.1 micron per cubic meter of air. 7
Figure 1. Classification of Air Cleanliness (ISO 1999) 2.1.2 Wafer Size Semiconductor manufacturing facilities are also defined by the size of silicon wafer they are tooled to produce. Silicon wafers range in size from 25.4 mm to 300 mm. Current state of the art semiconductor manufacturing facilities produce 300mm size wafers with the next generation considered to be 450mm. By far larger wafer sizes have resulted in increased yield per wafer due to reduced marginal space remaining over total space available. Though the increase in wafer size has reduced the cost per unit of silicon it has also substantially increased the cost of the facility.
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2.1.3 Line Width Line width sometimes refers to the narrowest line that could be resolved by the printing equipment and photoresist (usually the gate electrode and referred to by designers as the gate length). It also refers to the spacing or linewidth between each transistor of a wafer and is used by the industry to describe a process; like a 65 nm, 45 nm or 32 nm process.
2.1.4 Wafers per Month (WPM) WPM refers to the number of wafers produced by a facility in a month. Traditional 300mm fabs have 20,000 to 30,000 wafer starts per month. Manufacturers such as Samsung and Hynix have ramped up their production to 80,000 to 110000 wpm. Flash alliance is building the largest fab till date with over 200,000 wpm capacity.
2.1.5 Characteristics of Semiconductor Manufacturing Facilities Semiconductor manufacturing facilities are large facilities that are capital intensive in nature. A traditional 300 mm fab with 20,000–30,000 wpm (in 300 mm) costs about $3-$4B. Economies of scale are forcing a further increase in volume of output per facility thereby increasing the facility size and costs. Now the semiconductor industry is entering into an era of mass production of over 200,000 wpm (in 300 mm) capacity fabs costing $9-$10B.
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The capital intensive nature of the industry requires the facilities to be designed and constructed faster to quickly yield marketable and reliable products. The time to market window is a crucial factor in the design and manufacturing of semiconductor products. The return on investment on the capital intensive semiconductor manufacturing facilities can be maximized only if they are built in the right time to meet the market window.
2.2 Semiconductor Manufacturing Facility – Base Build + Tool Install Design and Construction of a Semiconductor Manufacturing facility consists of Base build and Tool Install. Base Build portion refers to the building structure, envelope, the cleanroom (Fab) and sub-fab that houses major mechanical, electrical and plumbing systems such as HVAC (Heating, Ventilation and Air Conditioning), electrical, UPW (Ultra-Pure Water) and exhaust systems. The Tool Install portion refers to the various semiconductor manufacturing equipment (process tools) installed in the facility such as Thin Film, Dry Etch, Wet Etch, Diffusion, Lithography and Implant. Another important part of a semiconductor manufacturing facility are the Process Specific Support Systems (PSSS) such as gas and chemicals delivery systems (storage, manifold boxes and piping) that are required for the manufacturing of semiconductors. Figure 2 below shows how the various systems come together and form the Semiconductor Manufacturing Facility.
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Semiconductor Manufacturing Facility
Base Build
PSSS
Tool Install Thin Film
Architectural
Dry Etch
Structural
Wet Etch
HVAC
Diffusion
Electrical
Lithography Ultra-Pure Water Implant
Gas & Chemical System Figure 2. Components of Semiconductor Manufacturing Facility 2.2.1 Base Build
The various components of the base build portion of the Semiconductor manufacturing facility are explained below.
2.2.1.1 Architecture The design and construction of semiconductor manufacturing facilities involves consideration of manufacturing requirements which leads to various solution factors such as cleanroom class, manufacturing requirements, air distribution and fan systems, wafer handling (automation) etc. The Cleanroom is an integral part of a semiconductor manufacturing facility. As explained above it is an 11
environment with a controlled level of contamination, specified in terms of the number of particles per cubic meter at a specified particle size. There are two types of cleanroom layouts; Ballroom and Bay and Chase layouts. The Ballroom layout is an open layout with clean minienvironments which house the semiconductor tools. This type of layout has no walls and allows for flexible tool layout. However, since there is no air segregation it involves a higher operating cost. The Bay Chase layout is the traditional layout with clean bays for processing and less clean chases for equipment and/or return air. The advantages of this layout include segregation of maintenance, lower airflow and ceiling costs. The disadvantage is that it is less flexible (Evans 2006).
2.2.1.2 HVAC System The HVAC system of a semiconductor manufacturing facility is comprised of the Air Systems (Dry side) and the Water/Steam System (Wet side). The air side system consists of cleanroom recirculation air, make-up air, process exhaust and heat exhaust. The cleanroom recirculation air and make up air system ensure maintaining a clean, particulate free and comfortable working environment for the people and process systems. The major components of a process exhaust system include corrosive exhaust, VOC exhaust, pyrophoric exhaust, ammonia and heat. The wet side system consists of chilled water generation and distribution system, glycol chilled water generation and distribution system, steam generation and distribution system and heating water system. Some of the auxiliary HVAC
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Systems include Process Cooling Water (for the production tools) and Hot Deionized or Ultrapure Water (for process improvement) (Acorn 2006).
2.2.1.3 Ultra-Pure Water System (UPW) The UPW system is a critical component of the manufacturing process. Its purpose is to provide pure water for the removal of other chemicals from the wafer surface. UPW contacts the wafer at least 20 times during the manufacture of the devices on the wafer. The UPW process removes particles, dissolved solids (ions), bacteria, organic matter and dissolved gases from the water before use in the manufacturing process. The various steps in the purification process include filtration, chemical treatment, reverse osmosis, degassification, deionization, ultraviolet sterilization and ozonation. The UPW system is usually located in the Central Utilities Building (CUB). The system is sized based on the proposed production equipment list with the tools and diversity factor (Loper 2006).
2.2.1.4 Gas and Chemical Systems Gases and chemicals are the building blocks for manufacturing integrated circuits. The gases and chemicals used in semiconductor manufacturing facilities are broadly classified as bulk gases, specialty gases and bulk chemical systems (solvents/corrosives/oxidizers). Bulk gases refer to Nitrogen, Argon, Oxygen, Helium and Hydrogen. Specialty Gas Systems include Reactants such as C2F6, CHF3, SF6, CF4, Corrosives such as HCL, BF3, WF6, BCL3, NH3, Oxidizers 13
such as NF3, CL2 and Pyrophorics such as Silane. Gas and Chemical systems are designed based on the highest minimum pressure required by any tool, the purity required, supply method (gas, liquid, cylinders, tube trailers, plant), demand and pressure, diversity factor (Tool Uptime) and Shift related load factor (Jones 2006).
2.2.1.5 Electrical System Electrical systems for a semiconductor manufacturing facility consist of Normal power supply for the facility support equipment and process equipment, emergency power for the ventilation system in the cleanroom area, corrosive and solvent exhaust fans and make-up air units, uninterruptible power system for emergency and exit lighting, building automation system, and critical process equipment requirements such as process cooling water, loop pumps, solvent exhaust controls and life safety systems. The design of electrical systems for a semiconductor manufacturing facility must consider factors such as safety, reliability, simplicity of operation, voltage maintenance, flexibility, cost, loads, demand, system, equipment location, voltage selection and utility service (Treese 2006).
2.2.2 Process Tool Installation Process tool installation is the ultimate goal of the facility design and construction process. It is the process of integration of process equipment into semiconductor 14
fabrication facilities with consideration for safety, contamination, ergonomics, maintenance, schedule and cost. The major process equipment in a semiconductor manufacturing facility support the Thin Film, Dry Etch, Wet Etch, Diffusion, Lithography and Implant processes. All areas and disciplines involved in the construction of semiconductor manufacturing facilities such as; fab layout and design, fab structure, chilled water and process cooling water, acid, solvent and general exhaust, high purity water, bulk and specialty gases, electrical systems, automated material handling systems and fab management and control systems are impacted by tool installation .
Crucial to the understanding of tool installation is the process of semiconductor manufacturing. Semiconductor device fabrication involves several steps such as deposition, removal, patterning and modification of electrical properties. Deposition is a process that coats or transfers a material onto the wafer. Etching is the process that removes material from the wafer; chemical-mechanical planarization being the removal process that removes material between the levels. Lithography is a patterning process that alters the shape of existing materials. During this process the wafer is coated with a material known as photo-resist. Select portions of the photo-resist are exposed to short wavelength light produced by a machine known as the stepper. After etching the remaining photoresist is removed by a process called plasma ashing. Ion implantation is a process of modification of electrical properties for doping transistors and drains. The doping
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processes are followed by Rapid Thermal Annealing which serves to activate implanted dopants (Gregg 2006).
The tool install process begins with the design and procurement of the process equipment and ends with the turnover and qualifications process. The major steps involved in the process of tool installation are, tool install design, procurement, delivery, rigging, installation, testing and acceptance and qualification of process equipment. The tool install process and the stakeholders involved depends on the size, scope, cost, schedule and project delivery method. The various stakeholders in a tool install project may include the tool manufacturer, the owner‘s industrial/process engineers, Architect/MEP Designers, Construction Manager/General contractor, trade subcontractors and the owner‘s operations and maintenance team. The major steps involved in the tool install process are Tool Installation Design, Installation and Hook up and System Commissioning and Start up.
2.2.2.1 Tool Installation Design New chips with different composition, better and more efficient process technology and the need to streamline and optimize production often triggers the need for new tools. The tool installation design begins with the owner‘s design team creating a generic master design showing the new tools, its template and the utilities that connect to it. The generic master design is then used by the owner‘s local design team as a basis for developing a location specific design. The 16
location specific design shows the location plan/layout of the equipment in the fab in relation to support equipment if any in the sub fab, references the tool and auxiliary systems to the physical world and the utility source point of connections. The engineering design firm then uses this location specific design to develop the schematic diagrams. Schematics are grouped by electrical, gases, wet process and mechanical. They indicate relative arrangement of utilities and systems and show manifolding and common feeds. The trade subcontractors then develop the detailed design showing 2D/3D routing drawings, coordinated to check for interferences with basebuild systems and conflicts with installation work, bill of materials, fabrication isometrics and weld logs (Wermes 2006). Figure 3 below shows the flow and development of information during the process of tool installation design.
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Figure 3. Tool Installation Design Information Flow 2.2.2.2 Process Tool Installation and Hook-up Process tool installation involves the collection and collation of a large amount of information to successfully integrate the process equipment into a semiconductor production facility. Information gathering, qualification and dissemination is the most crucial part of tool installation. Preparing for the tool installation process involves validating the utility matrix, the facilities data sheets, tool position on layout, tool automation, safety etc. The utility matrix includes details about the equipment, the liquids, exhaust, electrical, gases and process supplies that feed it. Other information pertaining to the tool regarding its footprint, interface with any automation systems, schedule information and clean installation protocol requirements need to be verified. Information pertaining to the facility such as utility, capacity, location, termination, expandability, flexibility and accessibility 18
needs to be validated. The various stages in the hook up of tools are prefabricating drops and stands, demounting wall partitions, positioning the tool, installing electrical, ductwork and exhaust and process piping (Gregg 2006).
2.2.2.3 System Commissioning and Start-up System commissioning and start-up begins by writing start-up procedures and punchlists to fix critical issues to facilitate a soft start-up of the tool during the construction and installation phase. The system is then green tagged and tested for function during a temporary run and critical issues are fixed. The system is then blue tagged and operated along with other equipment being started. During the final shakedown, critical issues are fixed and the tools are handed over to the facility owners/operators. Figure 4 below shows the tool start-up sequence and operational transfer (Canales 2008).
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Construction Complete
Construction/Installation
KEY: Green Tag
Contractor Owned / A-E Supported Contractor Owned / Facilities Operated Facilities Owned / A-E Support
Startup
Pre Start
Facilities Owned & Sustained Fix Critical
Fix Critical
Write Startup Procedures Write Punchlist
Functional Test
Green Tag
Fix Critical
Blue Tag
Operating
Temporary Run
Other System Equipment Cells being Started
Shakedown
Fix Critical
Customer / Facilities Sustaining Complete Punchlists, Transfer O&M’s and Warranties
Figure 4. Tool Startup Sequence and Operational Transfer (Canales 2008). 2.3 Building Information Modeling (BIM) 2.3.1 Background The current project delivery methods are by and large fragmented and paper based, often resulting in errors and omissions and data redundancy. Errors and omissions emanating from paper based methods cause field conflicts that are expensive and time consuming to correct and result in loss of productivity. Crucial analytical information such as structural and energy analysis, cost estimates can make way for iterative improvements early on in the project lifecycle during the design phase. Paper based methods delay the generation of such information, often times so late in the project lifecycle that any changes are 20
expensive to make and value engineering could compromise the original design (Eastman et al. 2008).
Ability to influence costs
Construction cost
100%
Level of Influence on Cost
100%
0%
Start
0%
Project Time
Figure 5. Time versus Ability to Impact Cost 2.3.2 Challenges of Traditional Approaches The CIFE (Centre for Integrated Facility Engineering, Stanford University) study of construction industry labor productivity indicates that productivity of the construction industry relative to all non-farm industries over a forty year period, from 1964 through 2004 has steadily declined (see Figure 6) (Teicholz 2001). Efficiencies achieved in the manufacturing industry through automation, the use of information systems, better supply chain management and improved collaboration tools, have not yet been achieved in the field of construction. Reasons for this include the size of construction firms, inflation adjusted wages of construction workers has stagnated over the past 40 years discouraging the need 21
for labor saving innovations. The adoption of new and improved business practices in both design and construction has been slow and limited to large firms. Often times it remains necessary to revert back to paper or 2D CAD drawings so that all members of the project team are able to communicate with each other.
Figure 6. Indexes of Labor Productivity (Teicholz 2001) The NIST (National Institute for Standards and Technology) study of the additional cost incurred by building owners as a result of inadequate interoperability indicates that insufficient interoperability accounts for an increase in construction costs by $6.12 per sf for new construction and an increase in $0.23 per SF for operations and maintenance (O&M), resulting in a total added cost of $15.8 billion. The study involved both the exchange and management of 22
information, in which individual systems were unable to access and use the information imported from other systems. It was determined that additional costs associated with redundant computer systems, inefficient business process management, manual reentry of data, inefficient RFI (Request for Information) management can be attributed to insufficient interoperability and resulted in increases in project costs. It is estimated that 68% of these additional expenses ($10.6 billion) were incurred by building owners and operators (Eastman et al. 2008). Adoption of Building Information Modeling by all the stakeholders in the project lifecycle can help reduce costs associated with inadequate interoperability of data.
2.3.3 Building Information Modeling- Definition Building information modeling may be defined as a modeling technology and the associated set of processes to produce, communicate and analyze building models. Building models are characterized by
Building components that are represented with intelligent digital representations that can be associated with computable graphic and data attributes and parametric rules.
Components that include data that describe how they behave as needed for analyses and work processes, e.g takeoff, specification and energy analyses. 23
Consistent and non redundant data such that changes to component data are represented in all views of the component.
Coordinated data such that all views of a model are represented in a coordinated way (Eastman et al. 2008).
A Building Information Model may or may not have geometry or information depending on the requirements at that particular stage of the project and the 3D CAD model or information can still be a BIM. Many BIM building projects do not start with a model made by a CAD system but with information about a client‘s requirements. This collection of information is also a BIM and can be later fed into a BIM authoring tool. Building information modeling benefits all the stakeholders throughout the project lifecycle. It adds pre-construction benefits to the owner, design benefits to the architects and engineers, construction and fabrication benefits to the builders and post construction benefits to the owner operators. The detailed benefits at the various stages of the project to the various stakeholders are described as follows. 2.3.4 Pre-Construction and Post-Construction Benefits to Owner Owners and operators of facilities can derive enumerable benefits from initiating, funding and maintaining Building Information Models. Building Information Models help owners increase the value of their buildings by facilitating energy design and analysis earlier on in the project. Building Information Models can help shorten project duration by providing opportunities to coordinate the design 24
and prefabricate building elements. A high level building information model built at the programming stages of a facility‘s lifecycle can provide reliable and accurate cost estimates which the owner can use at a stage where project decisions will have the greatest impact. Owners can be assured of program compliance per the design and code requirements through a building information model. As built information from a Building Information Model can be used to populate the facility management database with information regarding rooms spaces and equipment. Building components can be associated with maintenance timelines and costs to get financial condition assessment information over a period of time. A building information model can also be used to rapidly evaluate the impact of retrofit or maintenance work on the facility (Eastman et al. 2008).
Figure 7. Contingency/Reliability as a Function of Project Phases (Eastman et al. 2008).
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2.3.5 Design Benefits to Architects and Engineers Building information modeling can benefit all stages of the design process from the conceptual and schematic design phase to producing construction documents for review. The schematic design phase shows the design of the programmatic requirements, massing of the building, possible materials and finishes and types of building systems and subsystems. The design development phase develops generic details for the structure, walls, facades and MEP (Mechanical, Electrical and Plumbing) systems. The construction detailing phase shows detailed plans for demolition, site preparation, and detailed specification of building systems, sizing and connection of components. The construction review phase facilitates coordination between details and as built conditions. Building information modeling helps in redistributing the effort from the later stages of design to the earlier stages of design where changes to design have a higher ability to impact cost (see Figure 8) (Eastman et al. 2008).
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1
Ability to impact cost and functional capabilities
2
Cost of design changes
PD: Pre Design SD: Schematic Design DD: Design Development
3
Traditional design process
4
Preferred design process
PR: Procurement CA: Construction Administration OP: Operation
Figure 8. Value Added, Cost of Changes and Current Compensation Distribution for Design Services (Eastman et al. 2008). At the conceptual design phase a building information model provides checks for siting, massing and a visual feel for fitting and locating the programmatic requirements within the building. At the detailed design phase BIM is used for the design and analysis of the building systems. Various design and modeling software can help in analyzing a building‘s structure, temperature, lighting, 27
acoustics and energy consumption. The information contained within a building information model not only aids in analyzing a particular aspect of the design but can facilitate cross discipline design iterations to produce the most efficient design. Building information models can expedite the process of creating construction documents for the construction document phase. Placement and composition rules within a BIM software can help standardize and expedite the production of construction documents. During the final phases of design development the BIM aids in the integration of the design and construction. In a design-build delivery process it can expedite design iterations that help in developing a design favorable for a faster and more efficient construction process (Eastman et al. 2008).
2.3.6 Construction Benefits to Contractors A building information model offers many benefits to developers and contractors during the construction phase. A building information model can be used to reduce design errors by using clash detection. After the design phase and just prior to construction models containing construction details from various subcontractors can be merged to detect any conflicts between the various building systems such as clashes between MEP systems, and structure and MEP. BIM software that helps in clash detection not only facilitates automatic geometry clash detection but also allows semantic and rule based conflict analyses that
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allow for identifying interferences based on proximity and systems (Eastman et al. 2008).
Figure 9. Snapshot of a Contractor and Subcontractor using BIM to Support MEP Coordination (Eastman et al. 2008). A building information model can assist in quantity takeoff and cost estimation. Counts of building components, linear footages of pipes, areas of surfaces and volumes of spaces can be extracted from a model and associated with costs to produce project estimates. A building information model linked to a schedule can simulate the construction process. A time based simulation provides better insight into the construction sequence, detects time based interferences, help in better trade sequencing and improves site logistics by optimizing crane layouts, laydown areas, location of large equipment and office trailers. 29
Figure 10. 4D view of Construction of Vancouver Convention Center showing Foundation and Structural Steel Erection (Eastman et al. 2008). A Building Information Model can also be integrated with cost and schedule control and other management functions. Building components in a BIM can be provided with ‗status‘ as a property which can be then associated with colors to quickly be able to identify areas behind schedule. Objects in a BIM can be used to quickly populate a procurement database. Some applications (like 1st pricing) allow procurement within BIM applications, providing direct quotes to components such as doors and windows based on zip code. An accurate building 30
information model can readily and accurately facilitate offsite fabrication. A BIM can transfer geometrical, dimensional as well as finish information from a subcontractor‘s detailer directly to the fabricator, reducing the need to recreate the information and at the same time reducing errors during data transfer. BIM can also be used for onsite verification, guidance and tracking of construction activities. Laser scanning technologies that report into a BIM tool can help verify locations of building systems for critical pours. Dimensions from a BIM tool can be used to guide machines that excavate and grade earthwork. GPS technologies can be linked to a BIM to verify layout locations. BIM components that reference RFID tags can be used to track delivery and installation of the components offsite (Eastman et al. 2008).
2.3.7 Building Information Modeling Benefits for Subcontractors and Fabricators The benefits of BIM for Subcontractors and fabricators include:
Enhanced marketing and rendering through visual images and automated estimating
Reduced cycle times for detailed design and production
Elimination of all design coordination errors
Rendering through visual images (see Figure 11)
Automated estimating
Reduced cycle time for detailed design and production
Elimination of almost all design coordination errors 31
Lower engineering and detailing costs
Data to drive automated manufacturing technologies
Improved preassembly and pre fabrication.
Figure 11. Improved Visualization – Moving from paper based methods to digital 3D models (Eastman et al. 2008). 2.3.8 Parametric Modeling Crucial to the understanding of BIM are the concepts of Parametric modeling and Interoperability. A parametric model may be defined as
Consisting of geometric definitions and associated data and rules.
Integrating geometry non redundantly
Modifying associated geometries when inserted into a building model through parametric rules.
Defining objects at different levels of aggregation and hierarchy.
Receiving, broadcasting and exporting sets of object attributes (Eastman et al. 2008).
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2.4 Interoperability Interoperability is a property referring to the ability of diverse systems to work together. Various stakeholders in the lifecycle of a building facility, based on the specialty, use different softwares for documentation, design, construction and operations. During the various phases of the lifecycle of a project, different kinds of information are used, generated and handed over from one stakeholder to another, oftentimes using different software applications. During the design phase architects and engineers use various design and analysis softwares such as AutoCAD or Bentley Microstation. During the construction phase project managers use various scheduling, estimation and project management software such as Prolog, Timberline and Primavera Project Planner. Ability to transfer information between these various phases and applications is minimal and oftentimes requires manual reentry.
Software interoperability is seamless data exchange at the software level among diverse applications, each of which may have its own internal data structure (NIBS 2007). Data can be exchanged between two applications either through direct, proprietary links between the two applications or through proprietary file exchange formats that deal with geometry or through public product data model exchange formats or XML-based exchange formats.
Direct links provide an integrated connection between two applications through programming level interfaces that make part or the whole of the building model 33
accessible to the other application accessible for creation, export, modification or deletion.
A proprietary exchange format is developed by a particular company to interface with a particular application. An exchange format is usually implemented as a file in human readable text format. A popular AEC exchange format is the DXF (Data eXchange Format) defined by Autodesk.
The public exchange formats utilize open building standards such as the IFC (Industry Foundation Classes). Some of these public exchange formats apart from geometry also carry object, material properties and the relations between them (Eastman et al. 2008). Some softwares prefer to use the direct link to exchange information between them because the exchange of information is more robust. Based on the functionality the type and kind of information to be exchanged is agreed upon and the transfer mechanism is developed, debugged and maintained by the authors of the application (Eastman et al. 2008).
Open industry standards on the other hand are built and maintained by a consortium of industry people representing the various stakeholders who build, maintain, buy and use the applications. Construction projects involve several designers, contractors and subcontractors who utilize various applications to provide services contracted to them. Mapping the applications data to the open industry data standards allows the application to be interoperable with other 34
applications mapped to the same open industry standard. This kind of interoperability allows several applications to exchange information among each other with a single mapping versus several mappings in a direct link (Eastman et al. 2008).
Overcoming data transferability issues is key to fully interoperable integrated project delivery system. In order for a real free flow of information to occur, three factors need to be in place (see Figure 12):
The format for information exchange – Digital Storage
A specification of which information to exchange and when to exchange the information - Process
A standardized understanding of what the information exchanged actually is – Terminology
Figure 12. Interoperability through Standards (Grant 2008)
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Having these three fundamental items in place allows for a true computerized interoperability between two or more information parties. This approach has been used with success in other industries, most notably the oil and gas industry, to support application and data interoperability.
Several organizations such as the International Alliance for Interoperability (IAI), EPISTLE (European Process Industries STEP Technical Liaison Executive), National Institute for Building Sciences (NIBS), Facility Information Council (FIC) have been creating data standards for various industries and geographical locations. SEMI (Semiconductor Materials and Equipment International) has been developing data standards for the Semiconductor Manufacturing Industry.
2.4.1 Industry Foundation Classes (IFC) The Industry Foundation classes are a neutral data format that describes information used within the building and facility management industry. It facilitates the exchange and sharing of information between the different applications used by the various stakeholders in the lifecycle of the facility (buildingSMART 2011a). The IFC specification is developed and maintained by buildingSMART Alliance (formerly the International Alliance for Interoperability). buildingSMART Alliance is an organization of representatives from AEC firms, Owners, Suppliers and Software providers. It facilitates the development and deployment of open standards for the building industry 36
worldwide via local chapters. Specifications such as the International Framework for Dictionaries (IFD) and Information Delivery Manual (IDM) are being developed parallel to the IFC and complement it. The Information Delivery Manual (IDM) aims to identify the processes within the building industry and the information that is needed and generated from these processes. The IDM details the IFC capabilities that need to be supported for each process in terms of the entities, attributes, property sets and properties required (buildingSMART 2011b). The IFD (International Framework for Dictionaries) is a library with terminology and ontologies assisting in identifying the type of information being exchanged. The IFD supports the IFC by providing a dictionary that describes the objects and specifying what properties, values and units they can have (buildingSMART 2011c). Together the IFC, IDM and IFD provide a comprehensive mechanism for digital storage, specification of terminology and description of the process for interoperability within the building industry (see Figure 13).
Figure 13. IFC, IFD and IDM components of the data exchange triangle (Grant 2008) 37
2.4.1.1 History of IFC Autodesk in 1994 invited a consortium of industry participants to advise the company on C++ classes to facilitate integrated product development. It was called the Industry Alliance for Interoperability. Initially comprised of 12 industry participants this consortium opened its doors to all interested industry participants. In 1997 it was renamed the International Alliance for Interoperability and it reconstituted itself as a non-profit industry led organization with the goal of developing the Industry Foundation Classes (IFC) – a neutral data format for the building industry (Eastman et al. 2008). In 2005 the IAI again reorganized itself as the buildingSMART Alliance and has continually developed and maintained the IFCs.
The development of the IFC is an international effort with chapters in several countries. All chapters can participate in any of the domain committees. Domain committees address each area of expertise such as Architecture, Construction and Codes and Standards. The International Council Executive committee is the overall lead organization in the IAI. The North American Chapter is administered by the National Institute of Building Science in Washington DC. The IFC specification is written using the EXPRESS data definition language. IFC defines multiple file formats such as IFC-SPF, IFC-XML and IFC-ZIP. IFCSPF is the most widely used IFC format. It is a text format defined by ISO 1030321 (STEP). IFC-XML is an XML format defined by ISO 10303-28 (STEP-XML). It is interoperable with XML tools. IFC-ZIP is a compressed format for an IFC38
SPF file. Several versions of the IFCs have been released over the years. The first version IFC 1.0 was released in 1997. The latest version of the IFC - IFC 2x4 was released in September 2010.
2.4.1.2 IFC Architecture The overall structure of the IFC is comprised of 4 main layers; the resource layer, the core layer, the interoperability layer and domain layer (see Figure 14). Each layer consists of several categories or schema. For example the wall entity falls in the Shared Building Elements Schema which is a part of the Interoperability layer (Khemlani 2004).
The resource layer consists of categories of entities representing basic properties such as geometry, material, cost etc. They are generic entities that are used to describe categories in the upper layers (Khemlani 2004).
The core layer consists of entities that represent abstract concepts that can be used to define entities in higher layers. The kernel schema defines core concepts such as actor, group, product, process and relationship which may be used to describe higher level entities in upper layers. The product extension schema defines abstract building components such as space, site, building, building element, annotation etc. The process schema describes tasks, events and procedures. The control schema captures rules controlling time and cost (Khemlani 2004). 39
The Interoperability layer consists of common building elements shared between building construction and facilities management applications. The shared building elements schema has entities such as beam, column, wall etc. The Shared Building Services schema has entities such as flow controller, flow segment, sound properties etc. The shared Facilities Elements Schema has entities such as furniture, occupant and asset (Khemlani 2004).
The Domain Layer is the highest level in the IFC model and contains entities for individual domains such as Architecture, structural elements, HVAC etc. For example boilers and chillers are entities in the HVAC schema. Figure 14 shows the overall structure of the IFC Architecture.
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Building Controls Domain
Plumbing Fire Protection Domain
Structural Elements Domain
Structural Analysis Domain
Domain Layer
HVAC Domain
Electrical Domain
Architecture Domain
Construction Management Domain
Facilities Mgmt Domain
Shared Bldg Services Elements
Shared Component Elements
Shared Managemetn Building Elements
Shared Management Elements
Shared Facilities Elements
Interoperability Layer IFCx2 platform – IFC2x part equal to ISO/PAS 16739
Control Extension
Product Extension
Process Extension
Non-platform part
Core Layer Kernel
Material Property Resource
Presentation Dimension Resource
Actor Resource
Presentation Appearance Resource
DateTime Resource
External Reference Resource
Geometric Constraint Resource
Geometric Model Resource
Geometry Resource
Material Resource
Profile Resource
Property Resource
Quantity Resource
Respresen tation Resource
Topology Resource
Utility Resource
Presentation Definition Resource
Presentation Organization Respource
Presentation REsource
Time Series Resource
Constraint Resource
Approval Resource
Measure Resource
Cost Resource
Structural Load Resource
Profile Property Resource
Resource Layer
Figure 14. IFC Architecture – IFC 2x3 (Khemlani 2004) Certain elements in the IFC model make flexible as well as extensible. Property sets are generic sets of properties that may be used to describe one or more entities. Any property that is specific to an entity becomes an attribute of that entity. Properties that can be used to describe various entities are collected as property sets. Several omissions to the property sets can be identified (Eastman et al. 2008). The IFC provides a mechanism called proxies for software makers to 41
create new entities with attributes for entities not described in the IFC model. For example architectural elements present in a particular geographical location (such as perforated screens) can be defined in local IFC implementations in those countries as a proxy (Khemlani 2004).
2.4.1.3 Model View Definition (MVD) The IFC View Definition or Model View Definition (MVD), defines a subset of the IFC schema, that is required to satisfy one or many exchange requirements of the AEC industry. It defines a legal subset of the IFC schema and provides implementation guidance for all IFC concepts used within this subset (classes, attributes, relationships, property sets etc). Exchange requirements can be defined by buildingSMART‘s Information Delivery Manual (ISO/DIS 29481). The MVD represents the software requirement specification for the implementation of an IFC interface to satisfy the exchange requirements. A general exchange requirement is independent of a particular IFC release, the realization within the model view definition is specific to an IFC release. The methodology to create a MVD is published by buildingSMART. The MVD methodology version 2.0 can be found at http://www.iaitech.org/downloads/accompanying documents/formats/MVD_Format_V2_Proposal_080128.pdf. Model View Definitions are either developed by buildingSMART or by other organizations or interest groups. MVDs developed externally need to be submitted to buildingSMART, reviewed and accepted by them before
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implementation. The process to use externally developed MVDs is currently being developed by buildingSMART (buildingSMART 2011d).
2.4.2 Information Delivery Manual (IDM) Building Information Modeling brings together diverse sets of information used and generated by all the stakeholders in a building‘s lifecycle. For the Building Information Model to be fully beneficial the quality of communication between the various participants needs to be improved. It is important to clearly define and agree upon the various processes in the building lifecycle and the information that is used and results from their execution.
The Information Delivery Manual (IDM) aims to identify the processes within the building industry and the information that is needed and generated from these processes. The IDM details the IFC capabilities that need to be supported for each process in terms of the entities, attributes, property sets and properties required. To the BIM user the IDM provides a description of the building construction processes and the information that needs to be provided for the processes to be successful. For solution providers the IDM also details the IFC capabilities that need to be supported for each process in terms of the entities, attributes, property sets and properties required. IDM methods for defining business process and specifying information exchange requirements are independent of any information model. However IDM also has technical solution components that do use specific 43
information models. For building construction, it uses the capabilities of the IFC model and the extended property definitions declared in the IFD dictionary (Wix 2008).
2.4.2.1 IDM Architecture The Information Delivery Manual proposes a methodology for the development of process maps, exchange requirements, functional parts, business rules and verification tests for a business process. Process maps describe the flow of activities for a particular business process. They provide an understanding of the configuration of activities that make the work, the actors involved, the information required, consumed and produced. An exchange requirement is a set of information that needs to be exchanged to support a particular business requirement at a particular stage of a project. It provides a description of the information in Non-Technical terms. A functional part is a unit of information or a single information idea used by solution providers to support an exchange requirement. It is a complete schema in its own right as well as being a subset of the full standard on which it is based. Business rules are constraints that may be applied to a set of data used within a particular process. It is used to vary the result of using a schema without having to change the schema itself; for example localizing an international standard. Verification tests are testing software that verifies the accuracy of the support for exchange requirements.
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IDM is closely associated with Model View Definitions (MVD) in the IFC. IDM is a formal description of the business processes and MVD is how this is implemented in software using the IFC. A detailed description of the methodology and format for the IDM is described in the ISO standard ISO 29481 – 1:2010 Building Information Modeling – Information Delivery Manual – Part 1 Methodology and Format (Wix 2008).
Figure 15. IDM – Architecture (Wix 2008) 2.4.3 International Framework for Dictionaries (IFD) The IFD (International Framework for Dictionaries) is a library with terminology and ontologies assisting in identifying the type of information being exchanged. The IFD supports the IFC by providing a dictionary that describes the objects and specifying what properties, values and units they can have (buildingSMART 2011 c). 45
2.4.3.1 History of IFD The need for a standardized global terminology with a structure that would be useful for computers to reliably exchange data prompted the development of the ISO 12006-3. The ISO 12006-3 – Framework for object –Oriented Information Exchange was developed by the ISO Committee TC59/SC13/WG6. Upon publication of the standard STABU LexiCon in Holland and BARBi in Norway developed their object library databases to be compatible with the standard. The organizations combined their effort in 2006 through an agreement to produce a single object library/ontology called the International Framework for Dictionaries (IFD). In 2006 the Construction specifications Institute, construction Specifications Canada, building SMART Norway and the STABU Foundation signed a Letter of intent to share unified object libraries developed under ISO 12006-3 as a structure for a controlled dictionary of construction terminology. This group eventually joined the buildingSMART International organization with the objective to manage and develop an open, international and multilingual IFD library based on the principles of ISO 12003-3 2007.
2.4.3.2 Relationship between the IFC and IFD The IFD is an open library which consists of definitions of concepts. These concepts are given a unique identification number (Globally Unique Id GUID). The IFC would utilize the concepts defined in the IFD to make the information exchanged understandable. When a material is specified by the engineer in French the supplier can understand the material in Chinese. The GUID of the material 46
specified enables the computer to understand that the material is the same but is presented in different languages. The IFD also has provisions for expressing synonyms, plurals etc. The IFC now uses its own definitions stored in the model and property sets. These definitions will be mapped to the corresponding definitions in IFD (Grant 2008).
2.4.3.2 IFD Library IFD library is being developed in two streams; the content and technology. Content in the IFD is of two types; Concept and Characteristics. A concept is a thing that can be distinguished from other things. A concept may have several labels or one name can be used as a label for several concepts. All concepts are assigned a Globally Unique Id. Characteristics or properties are concepts that are described using a description. Characteristics are concepts that cannot be defined using other concepts. Subjects are concepts being defined and characteristics are concepts that define. Characteristics contain values when instantiated in a relationship (IFD 2008). Concepts are related to other concepts through relationships. Relationships are collected into contexts based on how and where they came from. Concepts can relate to other concepts in multiple contexts. Figure 16 is an example of how a door may be used in multiple contexts.
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inner door
is a type of
door
firedoor
is a type of
fire escape route
door
door leaf
consists of
building project
is a type of
is part of
consists of
escape route
door sill
door frame
door
is part of
doorway
horizontal light-opening for door
door
can be
is part of
relates to
opening in wall
with of escape route
inner door outer door sliding door rotating door
consists of
sliding door leaf sliding door frame
strongarm door
Figure 16. IFD Library (Grant 2008). 2.4.3.3 IFD Technology The IFD is an object oriented database that resides in a server in a guarded data center. Application developers can communicate with the library in a web service based approach irrespective of the technology of the database. The IFD database is also available on a disk. Several tools to input and browse the IFD have been developed. buildingSMART Norway has developed a propertylizer tool. The tool allows users to browse the content of the IFD and provides for adding new concepts and properties into the IFD. A screenshot of the propertylizer tool is shown below (Figure 17) (Grant 2008).
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Figure 17. buildingSMART Propertylizer Tool (Grant 2008) 2.4.4 ISO 15926 - "Industrial automation systems and integration‖ The ISO 15926 is titled: "Industrial automation systems and integration— Integration of life-cycle data for process plants including oil and gas production facilities". ISO 15926 is a standard for data integration, sharing, exchange, and hand-over between computer systems. The ISO 15926 facilitates data exchange between conforming applications by providing a standardized understanding of the data, providing templates for the organization of data and neutral format for data exchange (see Figure 18).
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Figure 18. ISO15926 Components of the Data Exchange Triangle When two organizations want to exchange information through the ISO 15926, they map the data structure of their internal applications to the ISO 15926. The Part 2 – Data Model of the standard specifies the format for the information exchange, Part 4 – Reference Data Library provides a standardized understanding to the terms. The RDL is implemented in a Reference Data System/Work in progress RDS/WIP. The two organizations map their internal applications to ISO 15926 using the classes and definitions in RDS/WIP. When data is exchanged between the two applications they refer to the RDL at the beginning (export) and end of the exchange (import). Since the ISO 15926 is used at the edges of the process of data transfer, it is considered external to the organization, as in both the applications exchanging information need not change their internal structure nor expose it to the business partner. It allows each application to only share the information that they need or want to share (Rachar 2009a).
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2.4.4.1 History of ISO 15926 In 1991 a consortium of companies in the European Union came together for a research project called ProcessBase. The objective of the project was to develop a data model for lifecycle information of facilities in the process industries. This consortium later on came to be known as EPISTLE – European Process Industries STEP Technical Liaison Executive. From a consortium of companies involved with the process industries the EPISTLE evolved into a consortium of national organizations predominantly from the European Union PISTEP (UK), POSC/Caesar (Norway), and USPI-NL (Netherlands).
EPISTLE developed the Annex M of the ISO 10303-221 commonly referred to as the AP 221. Annex M consisted of a list of standard instances of the AP221 data model. These standard instances were to act as a knowledge base for the types of objects. EPISTLE further extended the Annex M as a library of object classes and the relationships called STEPlib. Due to modelling/technical reasons POSC/Caesar proposed another standard ISO 15926 instead of ISO 10303. The core data model developed by EPISTLE was adopted and developed as Part 2 of ISO 15926. POSC/Caesar started making its own library of classes (RDL – Reference Data Library) by adding special classes such as ANSI pipe and pipe fittings. The core classes of the two libraries; STEPlib and EPISTLE were merged to form Part 4 of the ISO 15926. The ISO 15926 is currently being supported by FIATECH (Fully Integrated and Automated Technology) and POSC/Caesar. FIATECH is a North American Organization whose goal is to develop and 51
propagate technology to increase productivity in the capital projects industry. ISO 15926 is managed by the Technical Committee 184, Subcommittee 4 (TC184/SC4) of the International Standards Organization (ISO). The ISO 15926 consists of 11 parts. Parts 1, 2, 3 and 4 have been turned over to the ISO and the remaining parts are in development.
How we Store and Exchange Textual information
How we know and understand things
How we use the internet to find information
How we store and exchange Plant Information
Markup Language
Ontologies
The Semantic Web
Interoperability Projects
STEP
1984 POSC/ CAESAR Project
1999
FIATECH
2000
ISO 15926
ISO 15926-4
Figure 19. History of ISO 15926 (Rachar 2009b). 2.4.4.2 ISO 15926 Parts The ISO 15926 consists of 11 parts. Some of these parts are completed and have been turned over to the ISO and others are under development. 52
Figure 20. Parts of ISO 15926 (Rachar 2009c). Part 1 – Overview and Principles - Part 1 of the ISO 15926 was published by the ISO in 2004. The ISO 15926-1:2003 specifies a representation of information associated with engineering construction and operation of process plants. This representation supports the information requirements of the process industries in all phases of a plant‘s life-cycle and the sharing and integration of information amongst all parties involved in the plant‘s life cycle (ISO 15926 2003).
Part 2 – Data Model. The data model is based on the EPISTLE Core Model. It consists of entities and relationships; the relationships being the constraints. Part 2 was published by the ISO in 2003 (Rachar 2009c).
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Part-3 – Reference data for geometry and topology. This part is used to represent 3D CAD objects and systems. Part 3 is still under development and has not been published by the ISO (Rachar 2009c).
Parts 4, 5, and 6 - Reference Data – Part 4 is like a dictionary or a thesaurus. It provides definition of the entities and their taxonomy through parent child relationships. Part 4 was published by ISO in 2007. Part 5 - Describes procedures for registration and maintenance of reference data. Part -6 - RDS WIP (Rachar 2009c).
Part 7 – Templates "Implementation Methods for the Integration of Distributed Systems Templates Methodology." Templates are smaller implementation models of Part 2. It is like a spreadsheet with rows and columns. The column headers in the spreadsheet are the "roles" of the template. Each row of the spreadsheet is a template instance. Each cell in the row is a value of a role (the column heading). A template definition is the generic spreadsheet itself - it defines the name of the template, and the roles and what types of information are valid in those roles. Figure below shows a model of a template (Rachar 2009c).
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Figure 21. Example of Template (Rachar 2009c) Part 8 – RDF/OWL Implementation Specification. OWL or Web Ontology Language is a method of creating an ontology expressed in RDF syntax. RDF or Resource Description Framework is a way of making statements about things. ISO 15926 Part 8 involves standardization of the implementation of ISO15926 Part 7 templates using RDF and OWL (Rachar 2009c).
Part 9, 10 and 11 – Facade Specification. Part 9 enables applications to communicate with each other over the internet through a façade. Part 9 provides a specification for the standardization of the web service using SPARQL for a façade. A façade provides an outward facing view of things. External applications communicate with a source application by querying its façade. Facades enable an application to selectively share information. Part 10 provides for abstract test methods and Part 11provides for a Gellish Implementation using reference data (Rachar 2009c). 55
2.4.4.3 Deployment of ISO 15926 The ISO 15926 is currently being developed as a collaborative effort by POSC Caesar and FIATECH through a series of smaller projects collectively called IDSADI (POSC Caesar IDS – Intelligent Data Sets and FIATECH ADI – Advanced Deployment of ISO 15926). Significant projects that have helped develop and advance the ISO 15926 are the Proteus, Camelot and Avalon Projects. The Proteus project showed transfer of information between different P&ID systems, P&ID systems and 3D systems and between 3D systems using the ISO15926. The three types of information flows are typical during the handover of the project from EPC to owner. This project demonstrated the lowest level of ISO 15926 compliance; Dictionary level – ―Any XML file schema containing RDS/WIP class names‖ (Rachar 2009d)
The Camelot project implemented the full specification of ISO15926 (Part 2, 4, 7, 8 and 9) and demonstrated transfer of information between various organizations in real time using web services. iRING (ISO 15926 Real time Interoperability Network Grid) – a web based technology suite that helps deploy ISO15926 was developed. Data that needed to be transferred from commercial or proprietary software was converted using the iRing adapter and transmitted to the target location using the iRING web services and imported into the receiving application using the iRING adapter (Rachar 2009d).
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2.4.4.4 The ISO 15926 Real-time Interoperability Network Grid - iRING iRING is a web based implementation of the ISO 15926. It is open sources and is developed using .net and Java. It facilitates interoperability between applications through the ISO 15926. It provides a medium to define and exchange information real time through web based services. Companies can use it to exchange information both internally and externally by mapping their data structures to the ISO 15926 using the iRING (IDS-ADI 2011).
The iRING provides components that facilitate browsing and publishing classes to the Reference Data Library (RDL), templates for modeling relationships, facades that enable exchange of information and a mapping editor that enables mapping legacy data to ISO 15926 (IDS-ADI 2011).
The key components of the iRING that facilitate data transfer are:
RDS/WIP
RDS/WIP browsers and editors
Sandbox(es)
iRING Mapping Editor
The Reference Data System/Work in Progress (RDS/WIP) is used to publish definitions in ISO 15926. It is a library based on OWL/RDF and uses SPARQL for querying the data. It is extensible and is therefore refered to as Work In Progress (WIP) (IDS-ADI 2011). 57
The RDS/WIP Editor enables users to browse the ISO 15926 and add new classes through the sandboxes. The sandbox is a database that enables users to add to the ISO 15926. Data is a sandbox is not permanent and needs to go through several approvals to the moved to the RDS/WIP (IDS-ADI 2011).
The mapping editor facilitates mapping of source schema to the ISO 15926 data in the RDS/WIP. The current iRING version 1.0 provides for mapping legacy data schema to ISO 15926, transforming information into ISO15926 data and proto facades that help in exchanging information between endpoints through the internet (iRING 2011). Reference data repositories (Figure 22); a concept to be implemented in future iRING versions will provide the infrastructure to add classes. The reference data repository will consist of private, community and global sandboxes. Each of these sandboxes is different in terms of access modes and source. A community sandbox can have one or more participants with community managed read-only and read write access. The content in a community sandbox is considered volatile. The volatility is managed by the community. Content can be moved from the community sandbox to the global sandbox through an approval process. Once content reaches the global sandbox it becomes immutable (IDS-ADI 2011).
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Figure 22. Reference Data Federation (IDS-ADI 2011). 2.4.5 Other Data Standards – STEP, IGES STEP which stands for ‗Standard for the Exchange of Product Model Data‘ is an ISO standard ISO10303 for the computer interpretable representation and exchange of product manufacturing information. The goal of STEP is to develop a reliable and universal system of transferring data. The STEP covers geometry, topology, relationships attributes, assemblies, configuration and more to represent the product‘s entire life-cycle.
STEP is built on EXPRESS language that can formally describe the structure of any engineering information. STEP is an international product modeling standard used in the manufacturing and the defense industries, and can extend to any
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industry. IFC adopts the EXPRESS language and the Building Construction Core Model from STEP.
The IGES specification; pioneered by the mechanical CAD/CAM industry is a neutral file format that specifies both geometric and non geometric entities. Geometric entities represent the definition of the physical shape and include points, curves, surfaces and relations which are collections of similarly structured entities. Non geometric drawings typically serve to enrich the model with annotations and dimensioning. 2.4.6 SEMI Standards for Semiconductor Manufacturing Facilities 2.4.6.1 SEMI E6 – Guide for Semiconductor Equipment Installation Documentation Semiconductor Equipment and Materials International (SEMI) developed the SEMI E6 as a guide for all the stakeholders from equipment suppliers and facility designers to equipment installers and facility operators for communicating in a standardized way, the information necessary to prepare the facility and to efficiently install semiconductor equipment. It consists of a series of data sheets that address all information related to the identification, environmental conditions, physical characteristics and utility connections on the equipment. Data sheets for utility connections include electrical power, water, bulk chemicals, drains, gases, vacuum and exhaust. Table 1 below shows the various data sheets in the SEMI E6. 60
Table 1. SEMI E6 Data Sheet Table (SEMI 2003). Republished with permission from Semiconductor Equipment and Materials International, Inc. SEMI © 2011. Data Sheet Number
Data Sheet Title
100
Equipment Identification
200
Environmental Conditions
300
Physical Characteristics
400
Electrical Power
500
Water
600
Bulk Chemicals
700
Drains
800
Gases
900
Vacuum
1000
Exhaust
The SEMI E6 datasheets are defined and organized into tables with various attributes or related information. Table 2 below shows the equipment identification data sheet (Series 100). The SEMI E6 document showing all data sheets with the information that is to be input to complete the data sheet is attached as Appendix A to this document.
Table 2. SEMI E51 – Series 100 - Equipment Identification Data Sheet (SEMI 2003). Republished with permission from Semiconductor Equipment and Materials International, Inc. SEMI © 2011. 61
100 Equipment Identification
1 2 3
A
B
C
D
Equipment Install Data ID
Equipment Install Data Revision
Equipment Install Data Revision Date
text
text
text
SEMI Standard Name and Revision Date text SEMI E6 0303
100 Equipment Identification E 1 2 3
Equipment Name text
F Equipment Model Number text
G
H
I
Generic Process Type
Wafer Size
text
mm
J
Number of Equipment Components #
Equipment Comments Text
100 Equipment Identification
1 2 3
K
L
M
Equipment Supplier Name
Equipment Supplier Street Address
text
text
N
Equipment Supplier City, State, Country, Zip Code text
O Administrative Interface Information Reference text
Equipment Supplier Phone text
100 Equipment Identification P
1 2 3
Optional Order Specific Data Purchasing Company text
Q
R
S
Optional Order Specific Data Purchase Order Number text
Optional Order Specific Data Purchaser‘s Equipment ID text
Optional Order Specific Data Equipment Serial Number text
Information in these datasheets can be communicated among the various stakeholders in paper format or electronic format. While the transfer of equipment information in a standardized paper format is advantageous, it would be more
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beneficial for the transfer to be done electronically as manual transmission and interpretation is time consuming and prone to errors.
2.4.6.2 E6 XML Schema The production equipment information can be communicated electronically, but the problem is that different project participants use different software offered by different software vendors. A research initiative undertaken by CREATE (Construction Research and Education for Advanced Technology Facilities), a research consortium for advanced technology facility design and construction at Arizona State University, developed an E6 Markup Language (E6ML) using XML technologies. An XML schema was used to model the information in SEMI E6 standard. The platform independent nature of XML enhances interoperability between different software applications (Figure 23) (Nagasaravanan 2004).
Tool Vendor A SEMI E6 Data
Tool Vendor B SEMI E6 Data
XML Schema Export Module
Tool Vendor C SEMI E6 Data
XML Schema Import Module
XML Schema Export Module
Fab Designer/Cont ractor Database
E6ML Schema
XML Schema Import Module
XML Schema Export Module
Figure 23. E6XML Schema (Nagasaravanan 2004).
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Fab Owner‘s Database
2.4.7 SEMI E51: Guide for Typical Facilities Services and Termination The objective of SEMI E51, Guide to Typical Facilities Services and Termination Matrix, is to help provide timely and cost effective tool installation with minimum impact on existing customer facilities, systems and services and to ensure that the quality of facilities supplied (e.g., water, gases, chemicals, electricity) is not compromised once hooked up to the tool (SEMI 2000).
The SEMI E51 provides templates for communicating in a standardized way utility facilities that are available at a facility. It provides templates for both ‗typical‘ utility ranges as well as ‗Site Specific‘ conditions. Understanding the typical as well as site specific facilities enables a tool designer to design tools to suite the site conditions and deliver tools in a more facility ready state. Table 3 below shows the categories of services described in the SEMI E51. Table 4 below shows a site specific facilities services matrix for water services.
Table 3. Categories of facility data (SEMI 2000). Republished with permission from Semiconductor Equipment and Materials International, Inc. SEMI © 2011. Service Category Number 100 400
Service Category Description Facility Characteristics Electrical Power
500 600 700 800 900 1000
Water Bulk Chemicals Drains Gases Vacuum Exhaust
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Table 4. Site Specific Facilities Service and Termination Matrix (SEMI 2000). Republished with permission from Semiconductor Equipment and Materials International, Inc. SEMI © 2011.
Water Service
Supp ly Tem p
Supply Pressure (Return Pressure where noted)
Filtrati on (absolu te)
Specificat ion
POC Material
POC Fitting
Note s
Non-Potable Water Ultra Pure Water Deionized Water Hot Ultra Pure Water Fire Protection Process Cooling Water
2.5 Building Information Modeling for Semiconductor Manufacturing Facilities As described above semiconductor manufacturing facilities are very complex and capital intensive in nature. Construction of these facilities often involves high levels of uncertainty, strict spending limits, aggressive schedules and fast track construction. During the various stages of the lifecycle of these facilities different disciplines come together, generate and use a tremendous amount of building and process information to support various decisions that enable them to successfully design, build and sustain these advanced facilities. Design and construction of semiconductor manufacturing facilities essentially consists of two parts; Base Build and Tool Install. The base build portion consists of the design and construction of building structure, shell, the various supply and exhaust systems 65
for HVAC and process requirements such as UPW and electrical systems. The tool installation portion consists of design and installation of process tools within the fab building.
2.5.1 Building Information Modeling for Base Build During the design and construction of the base build portion of the facility different types of information are used and generated in various forms; from excel spreadsheets to complex 3D models for analysis. During the programming phase of the project owners, architects and engineers come together to generate project requirements for space utilization and capacity planning. Information is captured using charettes (small paper cards) and eventually transferred into excel or word documents. The architects and engineers take this information and develop preliminary design showing space utilization and zoning. They use software such as Revit and AutoCAD for developing these initial block models. As the design matures and moves into the schematic design phase these models are further developed and information from vendors and suppliers regarding properties of materials and systems are incorporated into the system. Models for this phase are built using various software such as Revit Architecture, Revit structure and AutoCAD and information from vendors regarding equipment or material is obtained as word, pdf documents or excel spreadsheets. As the design develops and moves into the detailed design phase the building models are further developed and analyzed in design analysis software for structural strength, vibration, performance of HVAC systems and energy analysis. The design is 66
constantly validated against the programmatic and system requirements generated in the programming phase. During the schematic and detailed design phases information is published to the contractors and vendors to verify feasibility, cost and schedules. Information is provided as pdf, word or excel documents. Vendors provide cost and schedule information to designers and contractors again as pdf, word or excel documents. Contractors use the information provided by the designers to develop estimates, bid packages and schedules. Contractors use various software such as Timberline, Primavera and Prolog to accomplish these functions. As the design reaches the construction ready state and the bid packages are awarded and the design is provided to the subcontractors as pdf documents. The subcontractors then use software such as CAD Mech and CAD Pipe to generate shop drawings which are then submitted to the contractor who reviews them and submits them as pdf files to the engineer for approval. Once the shop drawings are approved the subcontractor procures and fabricates the components. This is done either by sending pdf or drawing files directly to the shop for fabrication. As the construction nears completion as built drawings in the form of pdfs or drawing files are submitted to the owner who turns them over to their operations and maintenance staff. These are usually in the form of pdf drawings or word and excel spreadsheet of system information. The figure below shows the flow of information between the various disciplines, processes and stakeholders in the construction of a Semiconductor manufacturing facility.
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Figure 24. Facility Construction Process Several efforts have been made by various semiconductor manufacturers to integrate this disparate process of information creation and transfer between the different stakeholders in the lifecycle of these facilities. Efforts have been in different forms, like setting up ftp sites where people can share project information, setting up real time update of data sheets by various participants and developing partially integrated building information models addressing certain functions such as visualization, interference detection, schedule integration and verification and automatic calculation of quantities.
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2.5.2 Building Information Modeling for Tool Installation The process of tool installation begins with an understanding of the new process requirements; new tools, their composition and requirements. The owners design team gets the information regarding the new tools; the utilities they require, sizes and output from the tool suppliers usually in the form of hard copies, pdfs or spreadsheets. The owner‘s industrial engineers create a generic master tool design package by recreating the production equipment and the utilities that connect to it in CAD software. A soft copy of the generic master design provided to the owner‘s local design team which along with the facility model from the facility designer forms the basis for developing a location specific design for a specific facility project. The location specific design shows the location plan/layout of the equipment in the fab in relation to support equipment if any in the sub fab, references the tool and auxiliary systems to the physical world and the utility source point of connections. Throughout the several iterations of the tool design, information pertaining to the tool in terms of utility requirements at the point of use and facility provision for utilities at the source is communicated between the tool supplier, facility designer and tool layout designer. The tool and facility utility information is manually reentered several times in different applications.
The engineering design firm then uses the location specific design provided to the engineers to develop the schematic diagrams. The Schematics are grouped by electrical, gases, wet process and mechanical. They indicate relative arrangement of utilities and systems and show manifolding and common feeds. 69
The owner or construction management firm provides hard copies or soft copies (pdfs) to the subcontractors to develop the detailed design. The trade subcontractors then develop the detailed design often recreating the tools and the schematics and develop them into detailed 2D/3D routing drawings, coordinate them to check for interferences with basebuild systems.
The tool installation process involves the collection and collation of a large amount of information to successfully integrate the semiconductor manufacturing tools into facilities. Information gathering, qualification and dissemination is the most crucial part of tool installation. Preparing for the tool installation process involves validating the utility matrix (tool utility requirements), the facilities data sheets (facility utility provisions), tool position on layout, tool automation, safety etc. The tools install team again requests this information from the tool suppliers and facility designers, then recreates and adjusts the information to suit its construction management system to validate the data prior to installation. A possible example of a data exchange between tool installation designers and tool installation contractors is shown in the figure below. These include three iterated exchanges: (1) first to provide the tool installation design to the tool installation contractor (ST-1 and ST-2), (2) the contractor analyzes the design and develops a cost model and suggested revisions for improved installation (ST-3 and ST-4), (3) the designer and contractor exchange information, coordinating details with the rest of the building systems, reflecting design intent (ST-5 and ST-6). As can be 70
seen, coverage of all relevant domain exchanges will require hundreds of workflows, each with different intent and data.
Figure 25. Semiconductor Tool Design and Installation Process
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3. METHODOLOGY 3.1 Hypothesis Is it possible to build an intelligent data rich model for both the basebuild and tool installation portions of a semiconductor manufacturing facility that carries the different kinds of information that the various stakeholders in its lifecycle use? Is it possible to transfer this information seamlessly between the basebuild and tool install portions of the model and between the various stakeholders through all phases of its lifecycle?
3.2 Methodology The design and construction of a semiconductor manufacturing facilities involves a number of components ranging from the various basebuild systems to different types of tools and processes. It also involves large number of stakeholders ranging from tool manufacturers, facility and tool designers to contractors and operators. To understand and test the possibility of building an intelligent and interoperable model for the basebuild and tool installation portions of a semiconductor manufacturing facility, a scenario where information is exchanged between the equipment supplier, process tool layout designer and facility owner for the purposes of communicating tool requirements and facility conditions is modeled. A generic block model of a tool containing points of connections of the various utilities and their attributes was modeled (Tool Information Model) (see Figure 27). A model of the facility containing the structure and facility water services 72
were modeled (Building Information Model) (see Figure 29). Both the models; Tool Information Model and Building Information Model were brought together to create the Tool Layout Design. Figure 26 below shows the various models and the flow of information needed between them. Scenario 1 Tool Information Model SEMI E6 Tool Manufacturer (Autodesk Inventor)
Scenario 2
Scenario 3 Scenario 5
Building Information Model SEMI E51 Facility Owner/Designer (Revit MEP) Scenario 4
Tool Layout Design Tool Layout Designer (MicroStation)
Scenario 6
Figure 26. Flow of Information between Tool Manufacturer, Facility Owner/Designer and Tool Layout Designer 3.2.1 Tool Information Model Tool manufacturers and suppliers build and use various types models and software for purposes of design analyses and manufacturing. One of the softwares commonly used by tool manufacturers for tool design is Autodesk Inventor. Tool manufacturers are often reluctant to provide digital models of the tools to tool or facility designers for various reasons like security purposes (Intellectual Property IP) to model sizing issues. Sometimes 3D digital models of the tool are provided in Autodesk Inventor or CAD, however these models do not contain much intelligence beyond geometries.
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The Autodesk Inventor product line offers a flexible set of software for 3D Mechanical Design, product simulation, routed systems and mold design with improved CAD productivity and design communication. The Inventor software package offers an intuitive parametric design environment for developing mechanical parts and assemblies. It provides functionality to simulate and test assembly level motion, deflection and stress to optimize designs. It can help accelerate the design for routed elements such as tubing piping and flexible hose. It helps automate certain aspects of injection molds for plastic parts. It integrates DWG Technology into 3D design thereby facilitating integration with suppliers who rely on DWG technology and integrating parts assembly and schematic drawings. It accepts projects from other applications. It has a suite of translators that help transfer information in industry standards such as IGES and STEP. The AEC exchange tool creates and publishes simplified 3D representations, intelligent connection points and additional information using the Autodesk package files format (.adsk) to facilitate exchange of data with Autodesk REVIT MEP and REVIT Architecture.
For the purposes of studying the building of an interoperable tool model, a generic 3D model of a tool was built in Autodesk Inventor. It consisted of a generic 3D model of a tool and the multiple types of utility connections. Information attributes were attached to each type of utility connection based on the SEMI E6. Utility connectors such as electrical power, water, bulk chemicals, drains, gasses, vacuum and exhaust were located on the tool. 74
Attributes for equipment identification were drawn from Data Sheet 100 of the SEMI E6 and attached to the equipment model. Examples of attributes for equipment identification include equipment name, equipment model number and generic process type.
Attributes for environmental conditions were drawn from Data Sheet 200 of the SEMI E6 and attached to the equipment model. Examples of attributes for environmental conditions include equipment component, cleanroom classification standard and target room temperature.
Attributes for physical characteristics were drawn from Data Sheet 300 of the SEMI E6 and attached to the equipment model. Examples of attributes for physical characteristics include number of cleanroom move-in pieces, biggest move-in piece length and biggest move-in piece width.
Attributes for electrical power were drawn from Data Sheet 400 of the SEMI E6 and attached to the electrical connector. Examples of attributes for electrical power connection include electrical power connection number, utility, type, voltage and frequency.
Attributes for water were drawn from Data Sheet 500 of the SEMI E6 and attached to the pipe connector for water. Examples of attributes for water connection include utility type, purity requirements, minimum pressure and maximum pressure.
Attributes for bulk chemicals were drawn from Data Sheet 600 of the SEMI E6 and attached to the pipe connector for chemicals. Examples of 75
attributes for bulk chemical connection include utility type, purity requirements, minimum pressure and maximum pressure.
Attributes for drains were drawn from Data Sheet 700 of the SEMI E6 and attached to the pipe connector for drains. Examples of attributes for drains include drain connection number, utility type, maximum discharge pressure and maximum flow.
Attributes for gases were drawn from Data Sheet 800 of the SEMI E6 and attached to the pipe connector for drains. Examples of attributes for gases include Gas connection number, utility type, line source and gas state.
Attributes for vacuum were drawn from Data Sheet 900 of the SEMI E6 and attached to the pipe connector for vacuum. Examples of attributes for vacuum include vacuum connection number, utility type and minimum vacuum.
Attributes for exhaust were drawn from Data Sheet 1000 of the SEMI E6 and attached to the duct connector. Examples of attributes for exhaust include exhaust connection number, minimum static pressure and maximum static pressure.
An example of the attributes and a description of the attributes from SEMI E6 is attached as Appendix A to this document.
A 3D block model of the tool was built. The utility connectors were modeled on the tool using the AEC exchange module. The exhaust connector was modeled on 76
the top part of the tool and the remaining connectors were modeled on either side of the tool. The AEC exchange module consisted of 5 connector types; cable tray connector, conduit connector, duct connector, pipe connector and electrical connector. The electrical connector was used to represent the electrical connection and the duct connector was used to represent the exhaust connection. Pipe connector was used to represent water, bulk chemicals, drains, gasses and vacuum. These connectors have some primary intelligence attached to them; such as diameter. Other intelligence such as parameters described above per the SEMI E6 were added as custom user parameters. Figure 27 shows a generic tool block built in Autodesk inventor with the various utility connectors and attached attributes.
Figure 27. Tool Information Model
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3.2.2 Building Information Model Facility owners and designers use various softwares for the design, analysis, construction and operation of facilities. The semiconductor manufacturing industry predominantly uses Building Information Modeling software such as; AutoCAD, Revit Architecture or MEP. Facility owners and designers sometimes provide background models to Tool install designers as a DWG file which is a 3D drawing. They rarely carry information regarding the utilities available at the facility, so the tool supplier can make sure the tools work in that environment or the tool install designer can make sure he is optimally locating tools and efficiently utilizing the resources. This information is usually recreated each time the need arises; be it for the equipment supplier or tool install designer since their requirement might vary slightly. SEMI has published the SEMI E51 to facilitate the transfer of facility information to the tool suppliers in a standardized way.
In order to understand the transfer of information from the semiconductor facility owner to a tool supplier or tool install designer a block model of the shell of a facility with some basic base build systems was built in Revit. Revit Architecture was used to build the shell of the building and Revit MEP was used to build the basebuild system.
3.2.2.1 Revit MEP Revit MEP is a Building Information Modeling software for the design of mechanical, electrical and plumbing systems. The software is produced and 78
marketed by Autodesk. It provides for parametric modeling of Mechanical, Electrical and Plumbing systems. It has features that aid in the analysis of MEP design system for improved efficiency. It facilitates the creation of construction documents and exports models for inter-disciplinary coordination.
The facility shell included a fab and subfab level. The subfab level housed the basebuild boiler system to supply water to the tool located on the fab level. Pipe was run from the subfab to the fab level distribution port and terminated. Information pertaining to the water connection from the SEMI E51 was attached to the termination point. The following image shows a screen shot of the Tool Information Model from supplier imported into Revit MEP and pipe drawn from facility supply equipment to tool.
Figure 28. Tool Information Model from supplier imported into Revit MEP
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Figure 29. Building Information Model
In order to examine the robustness of the IFC in providing a mechanism for the transfer of facility information the IFC Model exported from REVIT MEP was imported into Revit Architecture. This transfer facilitated the transfer of 3D data but resulted in the loss of facility utility information that was added in Revit MEP from the E51. The following image shows BIM from Semiconductor manufacturer exported to IFC and imported to Revit Architecture to examine information flow.
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Figure 30. BIM from Semiconductor Manufacturer Exported to IFC and imported to Revit Architecture
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3.2.3 Tool Layout Design – Tool Information Model + Building Information Model Tool Layout Design involves utilizing detailed information pertaining to the tools as well as the facility to produce tool layouts. Industrial engineers designing tool layouts bring together the tool model provided by the supplier and the building model provided by the facility designer to produce tool layouts. Several tools of the same type or different type depending on the process and the required performance are populated in the facility model. As the design evolves with each iteration tool requirements and facility provisions are adjusted to produce the most efficient tool layout with optimal tool and facility requirements and provisions. Automated transfer of spatial and non spatial information pertaining to the tool and facility between tool supplier, facility designer and tool layout designer through an integrated model ensures data consistency, reduces redundancy and expedites the tool layout design process.
Tool layout designers use several 2D and 3D software for tool layout design. Softwares such as 2D/3D AutoCAD, Bentley MicroStation, AutoPLANT Equipment, Bentley PlantSpace Equipment or Bentley OpenPlant Modeler can be used for tool layout design.
To create a tool layout design the tool model built in Autodesk Inventor and facility model built in Revit Architecture/Revit MEP needed to be imported into MicroStation. Since the common drawing export formats from Autodesk Inventor 82
and Import/Open formats into MicroStation were DWG, DXF , STEP and IGES. The tool model was imported into MicroStation as a DWG file. The common drawing export formats from Revit MEP and Import/Open formats into MicroStation were DWG, DWF, STEP and IGES. The facility model was imported into MicroStation as a DWG file. The tool model imported from Inventor was multiplied and populated within the facility model imported from Revit MEP in MicroStation to generate the tool layout. During the import process using the DWG format only the 3 dimensional geometric model of the tool and the facility were imported into MicroStation. All the intelligence attached to the SEMI E6 and SEMI E51 was lost during the import process. The figure below shows a screenshot of the tool layout design in MicroStation.
Figure 31. Tool Layout Design (Enlarged image attached as Appendix D)
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Bentley Openplant, PlantSpace and AutoPLANT suite of products are popular solutions used by the process industry for plant design and engineering. The Bentley Open Plant Modeler V8i is a Microstation V8i based 3D modeling software that is built upon the ISO15926 as its core data model and is used for the design of process plants and associated disciplines. The Open Plant Modeler is open and can be used to produce iRING models that can be used by other applications that use the ISO 15926 data standard. However most design software for the process industry such as PlantSpace and AutoPLANT do not import or export IFC formats.
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4. RESULTS 4.1 Scenario – 1 Export of the Tool Information Model to Facility Owner/Designer
Scenario 1 Tool Information Model SEMI E6 Tool Manufacturer (Autodesk Inventor)
Building Information Model SEMI E51 Facility Owner/Designer (Revit MEP)
Figure 32. Scenario 1 Information transfer between Tool Manufacturer and Facility Owner/Designer Various formats that Autodesk Inventor provided to export the generic intelligent tool block into REVIT MEP were explored. Since Autodesk Inventor did not provide the option of exporting an IFC file, other export options had to be considered. Autodesk Inventor provided the following export options; DWF , DWFx, PDF , BMP, GIF, IGES, JPEG, JT, PNG, SAT, STEP, STL, TIFF, CATIA V5 (.CATProduct), Parasolid Binary (.xb), Parasolid Text (.xt), Pro/ENGINEER Granite (.g), Pro/ENGINEER Neutral (.neu) and DWG format. Through the AEC exchange environment Inventor also provided the proprietary Adsk format to facilitate exchange of AEC information like MEP connectors to Revit MEP and Revit Architecture. Table 3 below shows that most of the above formats are either images (raster) formats or 2D vector formats or 3D surface and shape formats that just transfer geometric information. Some of the formats facilitate transfer of information to 85
specific software programs like Catia or Pro E. One of the formats, STEP is a product model data format that carries object properties and relations between objects apart from geometry information. While the ISO-STEP has several application protocols for various industries and domains, it does not have one for industrial facilities (AP241 for industrial facilities has been proposed but under consideration by the committee) (Eastman et al. 2008). Hence the proprietary Adsk format had to be used to export the model to Revit MEP and Architecture. Revit MEP imported the Adsk tool model. Even though the Adsk was AutoCADs own proprietary format to facilitate AEC exchange, the connectors on the tool were successfully imported but the E6 information added as custom parameters were not imported.
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Table 5. Summary of the most common exchange formats in the AEC area (Eastman et al. 2008).
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4.2 Scenario 2 - Import of the Building Information Model from Facility Owner to Tool Manufacturer
Tool Information Model SEMI E6 Tool Manufacturer (Autodesk Inventor)
Scenario 2
Building Information Model SEMI E51 Facility Owner/Designer (Revit MEP)
Figure 33. Scenario 2 Information transfer from Facility Owner/Designer to Tool Manufacturer Autodesk Inventor imports the following file types; Alias (wire), Catia V5 files CATPart (part), CATProduct (assembly), JT, Pro E files prt (part) (up to version 4.0),asm (assembly) (up to version 4.0), g (Granite) (up to version 5.0), neu (Neutral), Parasolid files x_t (text), x_b (binary), SolidWorks prt, sldprt (part), sldasm (assembly), UGS NX prt (part), prt (assembly), DWG, STEP, IGES and DWG. While many of the import options are from specific software such as Catia, ProE and Solidworks. Inventor offers imports in the generic STEP, IGES, DWF and DWG. While IGES and DWF are just 3D Surface and shape formats and DWG is a 2D vector format, STEP did not have any application protocols for industrial plants. Various export mechanisms for the export of an intelligent data model from Revit MEP were also explored. Revit exports its files in various formats such as DWG, DWF, PDF, BMP, JPEG, IFC, STEP and IGES. Most of these formats are 2d vector image formats or 3D object formats that export only geometry and not intelligence. Of the formats that could export 3D object 88
information, the IFC option could be used to export facility information to the tool supplier (Inventor). Inventor however did not have the capability to import IFC files. DWG format was used to bring in geometric information regarding facility into Inventor. This imported model did not carry any intelligence regarding the facility termination points or requirements.
4.3 Scenario 3 and 4 - Import Tool Information Model and Building Information Model for Tool Layout Design
Tool Information Model SEMI E6 Tool Manufacturer (Autodesk Inventor)
Building Information Model SEMI E51 Facility Owner/Designer (Revit MEP) Scenario 3
Scenario 4
Tool Layout Design Tool Layout Designer (MicroStation)
Figure 34. Scenario 3 and 4 Information transfer from Tool Manufacturer and Facility Owner/Designer to Tool Layout Designer In order to import the Tool Information Model from Autodesk Inventor into MicroStation for tool layout design the common formats of export from Autodesk Inventor and MicroStation were explored. The common formats included PDF, BMP, IGES, JPEG, PNG, STEP, TIFF and DWG format. Similarly most of these formats are 2d vector image formats or 3D object formats that export only geometry and not intelligence. 89
In order to import the Building Information Model from Revit MEP into MicroStation for tool layout design the common formats of export from Revit MEP and MicroStation were explored. The common formats include DWG, DWF, PDF, BMP, JPEG, IFC, STEP and IGES. Again most of these formats are 2d vector image formats or 3D object formats that export only geometry and not intelligence. The DWG format was chosen to import the Tool Information Model and Building Information Model into MicroStation. This imported model did not carry any intelligence regarding the facility termination points.
4.4 Scenario 5 and 6 - Export Tool Layout Design to Tool Manufacturer and Facility Owner/Designer
Tool Information Model SEMI E6 Tool Manufacturer (Autodesk Inventor)
Scenario 5
Building Information Model SEMI E51 Facility Owner/Designer (Revit MEP)
Tool Layout Design Tool Layout Designer (MicroStation)
Scenario 6
Figure 35. Scenario 5 and 6 Information transfer from Tool Layout Designer to Tool Manufacturer and Facility Owner/Designer In order to export the optimized Tool Information Model from the Tool Layout Designer and import it to the Tool Manufacturer the common export and import formats of MicroStation and Autodesk Inventor were studied. The common 90
formats included DGN, DWG, DXF, IGES and ParaSolids. Most of these formats are 2d vector image formats or 3D object formats that export only geometry and not intelligence. The DWG format was chosen to export the Tool Information Model to Autodesk Inventor.
In order to export the optimized Building Information Model from the Tool Layout Designer and import it to the Facility Owner/Designer the common export and import formats of MicroStation and Revit MEP were studied. The common formats included DGN, DWG, DXF and IGES. Similarly most of these formats are 2D vector image formats or 3D object formats that export only geometry and not intelligence. The DWG format was chosen to export the Building Information Model to Revit MEP.
4.5 Limited Adoption of Industry Standards IFC /ISO 15926 Through the experimental modeling of tool and facility information in various software platforms it can be understood that not all software products have adopted industry standardized export import formats. The Tool Information Model that was built in Autodesk Inventor could not be exported or imported in an IFC or ISO 15926 exchange formats. The Building Information Model that was built in Revit MEP could only be exported and imported IFC format and not the ISO 15926 thereby creating a one way flow of information. Complete information pertaining to the tool and the facility could not be imported into 91
Bentley MicroStation because it did not have provisions to import the Autodesk proprietary Adsk format that Autodesk Inventor exported AEC exchange information to and it did not have provisions to import the IFC files of the Building Information Model.
Limited adoption of open industry standards causes the data to be recreated in each application for every iteration. Recreating the data several times not just takes additional time and money but also leads to costly errors and omissions. Software providers must adopt open industry standards to facilitate data exchange.
4.6 Alignment in the Adoption of Industry standards IFC /ISO 15926 A close look at the import/export formats of the software products reveals that most of the products are largely aligned with the open industry standard that pertains to the industry that the product serves. The Autodesk Inventor suite of products primarily targeted at the product design and manufacturing industry aligns with CAD/CAM standards such as STEP and IGES. Even though oftentimes there is transfer of information from and to product and process applications such as Revit MEP and Bentley MicroStation, they have not adopted any open data transfer standards that can facilitate this exchange. It is noted that Revit MEP that is a part of the Autodesk Suite of products exports and imports IFC formats which supports product models predominantly for the building 92
industry. Bentley‘s MicroStation is a parametric modeling software which is exports and imports predominantly 2D and 3D formats. Other popular Bentley software for process industry design and engineering such as AutoPLANT, PlantSpace and the OpenPlant Modeler are either moving towards using the ISO 15926 as the core data model or provide for project management software that can convert data to ISO 15926. The semiconductor manufacturing facility model is unique in that it is a combination of both process and product model. It comprises of process systems organized within a building which is a product model. The process of tool layout design requires flow of information between the tool supplier, facility designer and the tool layout designer. For this to happen the process tool information which can be represented comprehensively through the ISO 15926 data standard needs to be interoperable with the facility information which can be represented more robustly by the IFC data standard. This can be achieved either by the adoption of both the standards by the software application involved or creating a universal translator between the ISO 15926 standard and IFC. One of the first steps in creating a universal translator between the IFC and ISO 15926 is to create a mapping between the IFC and ISO 15926. The mapping matches similar classes between the IFC and ISO 15926 so that information from the IFC can be read by ISO 15926 and vice versa. The SEMI E6 and the E51 can be used as a baseline with respect to transfer of information between Tool Information Model and Building Information Model. This can be done manually by seeing which schemas in both the standards correspond to each other. In some 93
cases there might be a one on one mapping between the IFC and 15926 entities, while in some there might be a one to many and in others one to none mapping. The mapping can then be implemented through a translator between the two standards. Mapping would expose deficiencies in both the standards thereby requiring addition of new properties or entities to the IFCs and ISO 15926. An example of mapping of temperature property SEMI E51 data in IFC to corresponding placeholder in ISO 15926 is shown below.
Table 6. Mapping IFC and ISO15926 IFC IFC Thermodynamic Temperature Measure
ISO 15926 TEMPERATURE
Figure 36. Description of Temperature in IFC (MSG 2010) 94
Figure 37 - Description of Temperature in ISO 15926 (IDS-ADI 2011) 4.7 Robustness of Industry Standards IFC/ISO 15926 IFC export of SEMI E51 information modeled in Revit MEP when imported into REVIT Architecture showed a loss in certain types of information. It is possible that SEMI E51 data modeled did not get transferred from one model to the next due to unavailability of place holders for the data. There might be entities from the IFC model from Revit MEP that are not a part of Revit Architecture. It is also possible that the IFC model may or may not support all of the model related information that was created in Revit. To understand the robustness of the IFC in supporting the SEMI E51 facility data, a class search was undertaken. The categories of water services and their properties described in the SEMI E51 were used as a basis for searching the IFC. The most current version of the IFC is the 2X4 RC2 (Release Candidate 2). It was published on September 28, 2010 for review and prototype work. The 95
specification can be viewed online at the IAI‘s website http://www.iaitech.org/downloads/ifc. Upon reviewing the IFC specification, it was understood that the IFC addresses transfer of information regarding points of connection through the concept of ports (IFCPort).
IFCPort is associated with IFCElement and it acts as a means to connect one element to other elements. IFCPort is a supertype of IFCDistributionPort. The IFC 2x4 specification defines an IFCDistributionPort as an inlet or outlet of a product through which a particular substance may flow. The substance may be solid, liquid, gas or electricity for power or communications. Ports may not have any visible geometry but be captured in the shape representation that indicate position, orientation or cross section of the connection (MSG 2010)
The type of distribution port is described using the IFCDistributionSystemEnum. This enumeration identifies the different types of building services. Some examples of service enumerations specified in the IFC are chilled water, compressed air and fire protection. This list of enumerations does not contain some of the water services specified in SEMI E51 water services data sheet. The water services that need to be added to the IFCDistributionSystemEnum include Non Potable Water, Ultra-Pure Water, De-ionized water, Hot Ultra-Pure Water and Process Cooling Water.
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Property sets have been created for different types of DistributionPorts such as air-conditioning, domestic hot water and cold water and fire protection. The SEMI E51 data sheet for water services describes other types of water typically used in Semiconductor manufacturing facilities such as Non Potable Water, UltraPure Water, De-ionized water, Hot Ultra-Pure Water and Process Cooling Water. These additional types of water services need to be described in the IFC and the Property Sets describing them need to be created.
For example the set of properties used to describe the distribution port type fireprotection (PSet_DistributionPortTypeFireProtection) are Connection Type, Connection Subtype, Nominal Diameter, Inner Diameter, Outer Diameter, Volumetric flow rate, Mass flow rate, Flow Condition, Velocity, Pressure and IsDesignPoint. The SEMI E51 requires the Fire Protection Water be additionally described using Filtration and POC Material. Some of these additional properties such as POC material exist in the IFC (IFCMaterial) and can be added to the fire protection distribution port property set. Other attributes such as Filtration need to be added to the IFC. The following table shows the SEMI E51 Water Services data sheet with the water services and their properties and their corresponding IFC Classes. It also highlights the water service distribution system, enumeration property sets and properties that need to be created in the IFC to facilitate the transfer of information during IFC data model export and import. Analysis of all the other data sheets in the SEMI E51 against the IFC would provide an understanding of the existing gaps. Updating the IFC with SEMI E51 information 97
particular to semiconductor manufacturing facilities would provide a more robust way for information to be interoperable through the IFCs without loss of intelligence.
Table 7. : Gap Analysis of SEMI E51 Water Services Data Sheet against the IFC
Water Service
Entity
Described using
Status
Non Potable Water
IFCDistributionPort
IFC DistributionSystemEnum Non Potable Water
Add
Ultra Pure Water
IFCDistributionPort
IFC DistributionSystemEnum Ultra Pure Water
Add
Deionized Water
IFCDistributionPort
IFC DistributionSystemEnum Deionized Water
Add
Hot Ultra Pure Water
IFCDistributionPort
IFC DistributionSystemEnum Hot Ultra Pure Water
Add
Fire Protection
IFCDistributionPort
IFC DistributionSystemEnum Fire Protection
Existing
Process Cooling Water
IFCDistributionPort
IFC DistributionSystemEnum Process Cooling Water
Add
Supply Temperature
IFC Thermodynamic Temperature Measure
IFCFlowDirectionEnum Source
Existing
Supply Pressure
IFCPressureMeasure
IFCFlowDirectionEnum Source
Existing
Filtration
IFCFiltrationMeasure
Add
IFCMaterial
Existing
Properties
Specification POC Material
POC Fitting
IfcProperty Enumerated Value / IfcLabel
PEnum_PipeEndStyleTreatment: BRAZED, COMPRESSION, FLANGED, GROOVED, OUTSIDESLEEVE, SOLDERED, SWEDGE, THREADED, WELDED, OTHER, NONE, UNSET
Notes
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Existing
Modeling of the tool information based on SEMI E6 in Bentley OpenPlant Modeler and exporting it to ISO 15926 format might also result in loss of information if the information in SEMI E6 does not exist in the ISO 15926 data standard. To understand the robustness of the ISO 15926 in supporting the SEMI E6 Tool data a gap analysis was undertaken. Information regarding water services required for a tool described in the SEMI E6 was used as a basis for searching the ISO 15926. The classes in ISO 15926 can be browsed through the RDS/WIP (Reference Data System/ Work in Progress) published on the web at http://rdswip.ids-adi.org/presentation/overview/index.html. The RDS/WIP is developed and maintained by the IDS-ADI group of FIATECH. Table 8 below shows the various terms used to describe the water service in SEMI E6 and their corresponding classes in ISO 15926. Table 8 - Gap Analysis of SEMI E6 Water Services Data Sheet against the ISO 15926 SEMI E6 Data
ISO 15926 Terminology
Status
Equipment component
Equipment Component Class
Existing
Water Connection Number
Add
Connection Label on
Service line identifier, line
Equipment
label
Utility Type Line Source
Existing
Add Source
Existing
Purity Requirements
Add
Contaminants
Add
Minimum Pressure
Lower Limit Pressure
Existing
Maximum Pressure
Upper Limit Pressure
Existing
Maximum Pressure
Upper Limit Differential
Existing
Fluctuation
Pressure
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Minimum Pressure
Lower Limit Differential
Differential
Pressure
Existing
Idle Average Flow
Add
Process Average Flow
Add
Maximum Flow
Add
Maximum Temperature
Upper Limit Operating
Existing
Temperature Minimum Temperature
Lower Limit Operating
Existing
Temperature Equipment Component Fitting Size Equipment Component Fitting Material Equipment Component Fitting Type Drawing Reference Water Comments
The ISO 15926 supports several terms used in the water services data sheet of the SEMI E6 (see Table 8). For example terms such as equipment component, line source, minimum pressure, maximum pressure, maximum pressure fluctuation, minimum pressure differential, maximum temperature and minimum temperature are described in the ISO 15926. However terms that describe water services required for semiconductor tools such as purity requirements, contaminants, idle average flow and process average flow need to be added to the ISO 15926. A similar exercise can be undertaken for all the other data sheets in the SEMI E6. The terms identified through the gap analysis can be added to the ISO15926. The resulting ISO15926 standard will then provide a basis for exchanging process tool information without loss of data. 100
5. FUTURE DIRECTION
Interoperability plays a vital role in the successful implementation of Building Information Modeling for semiconductor manufacturing facilities. It helps in the transfer of information between the various stakeholders throughout the lifecycle of the facility. Developing industry standards that facilitate interoperability would benefit all the participants in the design, construction and maintenance of these facilities. Advancing the state of industry standards such as the IFCs and ISO 15926 requires involvement at both the industry level and organizational level.
At the industry level all the stakeholders in the lifecycle of the facility need to come together, share their knowledge and experience and invest their time and energy to develop open interoperable industry standards. Semiconductor industry consortia such as SEMI have been developing standards and need to consider understanding, supporting and integrating with other industry standards such as IFC and ISO 15926.
At the organizational level it is important to understand the various parts of the organization that Building Information Modeling affects. Mapping the flow of information between the various stakeholders can help understand the various functions that the BIM supports. The semiconductor manufacturing facility is unique in a way that it consists of the base build and tool install part; in modeling terms it is a process model within a building model. Different data standards are 101
being developed for data exchange; IFC for the building industry and ISO15926 for the process industry. At an organizational level it is important to understand and define what parts of the design and construction of semiconductor manufacturing facilities are better described in the product or building standards and what parts are better described in process standards. It is also important to understand the various data standards that affect the lifecycle of the facility such as programming and operations and maintenance.
5.1 IFC for Semiconductor Manufacturing Facilities The IFCs are an important building industry data standard that can help in creating an interoperable Building Information Model for the semiconductor manufacturing facility. It can be inferred from the above research that the IFCs need to be developed to support information transfers for the semiconductor manufacturing facility. For this information transfer to take place three components need to be in place. The format for information exchange (digital storage), a specification of which information to exchange and when to exchange the information (process) and a standardized understanding of what the information exchanged actually is (terminology). The buildingSMART alliance supports these three factors through the IFC (Industry Foundation Classes), IDM (Information Delivery Manual) and IFD (International Framework for dictionaries).
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Developing the standards would involve developing business process mapping of all the functions and areas in the lifecycle of the facility that will be impacted by the building information model. Figure 26 showing the flow of information between the tool supplier, facility designer and tool layout designer in the methodology section of this research is a representation of a process map. The IDM provides detailed specification of the Business Process Modeling Notation used to create process maps. Creating these process maps would provide an understanding of the discrete sets of information that need to be exchanged throughout the process. This business process as well as the sets of information that need to be exchanged should to be added to the IDM.
In order for the IFC exchange format to be able to transfer information between applications, it is important for the standard to contain a description and placeholder for the information to be transferred. A gap analysis of the IFC needs to be performed against validated information standards for the semiconductor manufacturing industry such as the SEMI standards. An example of this gap analysis is shown in the results section (Page 99) of this research. These gaps need to be filled by adding the missing information classes to the IFC. The IFC currently stores the definition of the information classes. In the future the IFD being the dictionary will take on this role of defining the information and the IFC will provide the data model (digital storage). The figure below shows a schematic of the various steps to be taken to advance the IFC, IFD and IDM to support the
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flow of information in a building information model for a semiconductor manufacturing facility.
Figure 38. IFC for Semiconductor Manufacturing Facilities 5.2 ISO 15926 for Semiconductor Manufacturing Facilities The ISO 15926 is an important process industry data standard that can be used to create an interoperable tool/process industry model. The ISO 15926 standard needs to be developed to support information transfers for the semiconductor manufacturing industry. Similar to the IFCs the ISO 15926 supports information 104
transfer by providing the format for information exchange (digital storage) through Part 2 – Data Model, a specification of which and what information to exchange (process) through the Part 7 (templates) and AEX Project of FIATECH and a standardized understanding of what the information exchanged actually is through Part – 4 RDS WIP.
For the ISO 15926 to facilitate the transfer of process information between different applications it should have the necessary place holders to carry the information. The classes that describe data for the semiconductor manufacturing facilities need to be added to Part-4 Reference Data Library, templates of data sheets need to be created in Part 7 and the corresponding data model needs to be developed in Part 2.
The figure below outlines a schematic of the various steps to be taken to advance the Part 2, Part 4 and Part 7 of the ISO 15926 to support the flow of information in a process/tool information model for a semiconductor manufacturing facility.
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Gap Analysis – SEMI E6 versus ISO 15926
SEMI E6 Data Sheet
Add Classes
Create Template
Develop Data Model
Figure 39. ISO 15926 for Semiconductor Manufacturing Facilities 5.3 Translator for IFC and ISO 15926 A semiconductor manufacturing facility model is unique in that it is a combination of the process and building model. It comprises of process systems organized within a building model. Information is continually transferred between the process and building model throughout the lifecycle of the facility. For this to happen the process information which can be represented comprehensively through the ISO 15926 data standard needs to be interoperable with the facility 106
information which can be represented more robustly by the IFC data standard. This can be achieved by creating a universal translator between the ISO 15926 standard and IFC. A prototype of a translator was demonstrated at a FIATECH conference and needs to be made available for business use.
One of the first steps in creating a universal translator between the IFC and ISO 15926 is to create a mapping between the IFC and ISO 15926. The mapping matches similar classes between the IFC and ISO 15926 so that information from the IFC can be read by ISO 15926 and vice versa. An example of a mapping is shown in the results section of this research (page 94) and can be extended to cover all the information that needs to be exchanged between the two models. A research project has been undertaken by FIATECH to map the IFC and ISO 15926 with a focus on information exchange for oil and gas facilities. A similar mapping exercise that maps information exchanged between IFC and ISO15926 needs to be undertaken for semiconductor manufacturing facilities.
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APPENDIX A SEMI DRAFT DOCUMENT 3287 - REVISION TO E6, GUIDE FOR SEMICONDUCTOR EQUIPMENT INSTALLATION DOCUMENTATION. REPUBLISHED WITH PERMISSION FROM SEMICONDUCTOR EQUIPMENT AND MATERIALS INTERNATIONAL INC. SEMI © 2011
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APPENDIX B SEMI E51-0200 GUIDE FOR TYPICAL FACILITIES SERVICES AND TERMINATION MATRIX. REPUBLISHED WITH PERMISSION FROM SEMICONDUCTOR EQUIPMENT AND MATERIALS INTERNATIONAL, INC. SEMI © 2011.
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APPENDIX C SEMI PERMISSION TO PUBLISH PORTIONS OF SEMI E6 0303 AND SEMI E51 0200
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APPENDIX D TOOL LAYOUT DESIGN (FIGURE 31)
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