World class quality-using design of experiments to make ... - IEEE Xplore

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ous I.i ulcctrolytc compositioris, trails- pirc lit conducti vc filnis, ... matcrials such as ii;iiiostrwtiires, silicon quantuui dots .... May/Juno 2000 -Vol, 16, No. 3. 35 ...
rrarrspnrr and storagc of fluids, altcrnative scparacion processes, and clicinical reactions. New inform:ition has also h e e n included in thc physical and clicmical data sections. Sotiic uprhtcd areas that may hu ol inrcrcst to o u r rcaclei:~iiiclude the latest infnriii2ition 011 cnndenscrs, relmilcrs, evaporators, niiilri-coiiipoiieiit distillatitrn, aiid cxti'ncrive iiicthods. ( h m i c a l n n d proccss ciiginecrs 3s wcll as chemists and iiiiitcrial scientists W ~ I L fitid I I ~ this authoritative and c o n prchciisive handbook tu hc :I very vdiiable r CSOLIrce.

Materials in Space-Science, Technology and Exploration, Vol. 551 A.F. Hcpp, J.M. l'rdil, T.G. [kith, S.G. lhilcy, md J.lL Fowler, Eds. Marcrids Research Sociel y 506 Keyscoric Drive W;ir.rcnrlale, P A 'I 5086 ISEN# '1-55899-4.57-2 + 1 724 779 3003 Fax fl 724 779 83.13 llttp://www. 1111s.org 32.5 pp, $7'1.OO i1icmhm, $82 .OO non-iiierribcrs (Hnrcicovcr), I999 T h c papers contained in rhis proceedings were taken froiii thc syiupo siiiiii ciititlrd "Materials in S p ~ c t Scicncc, Techiitr/cigy aiic! Explolation," held at die 1998 MRS 1:all iticeting i i i Uoston, M A . 'l'liis volumc, o~:gnnizcdinto scveii sectiolis, consist of invited papcrs, rcgulnr calks, and poster presciitatioris mainly pertaining to imtcrials usecl in spiicc arid tlie cffccts OC spacc coiidi tioiis on rtie ctinrac. tcristics of inateriais iriadc in space. Part 1 has live papcrs oii spncc cxplo ration some of which entail mnterids frw sliicldiiig asti-oiiauts t'i.om radiation, abrasion test from thc M x s I'atlifiridei: cxpcriinent, and iunrerials for tlierinal control. Part 11 invcdves spacc photovoltaics thai: maitily consisted d high efficiency atid GiiAs stilnr. cell hhticatirm, and ctiermal pliotcivoltaics. F,nergp cnnvcrsioii a n c l storagc materials, scctioii 111, ct)iisisted of ail iiitcrcsting thin fi1m hattcry fabrication using various I.i ulcctrolytc compositioris, trailspirc lit conducti vc filnis, scl ectivc May/Juno 2000 - Vol, 16, No. 3

properties. Each database contains propcrtics like physical, iriecliaiiical, IV aud V coiitaiii papcrs 011 advanced electrical, atid thcnnal for each polymatcrials such as ii;iiiostrwtiires, silicon meric material listctl. 'l'lie gcticral quantuui dots, rcflectivc atid surfncc pi-cipcrties datiibasc coiitains a listiiig coticlu ctivc poly i 111 icle films, d of parameters like electrical resistivity microgravity materials proccssiug. One ( i f metals, tlicrmxl cxpmsions, tlierinnl paper of particular intcresl: showud tlie conductivity, strciigth, clongatiori, and different: rcsultitig morplicilogy of thin hardncss among others for iiieials, cefilm pcilynieric ntid colloidnl inaterials rnmics, 11i I 11-inerais, and polyrue 1's. that results wheii thcsc iiiateri,d I s WCI-c l'hc value iii iisirig this sol~wnrcthat triadc in spaw, us comparctl to bcing allows oiie CO estimate polymer properiiincle OH cnrth. There are also additinrial ties i s 1)I'rrjpcrties can bu cstiniateil tliat niicmgravity materials pIncessirig iu- are lint easily availalile iti thc literatiirc; volving iiiernl alloys, aiid zccrlitu crysrals 2) I'roperties can he cstiriiatccl that hivc in I'nrt VI. Tlic fin31 section contains fur- not hecti cxpei:iiiieiitally mensurd; 3) ther matcrials for spnce applications, "What if" sccnnrios c:m he made; 4) soiiic cif which i iiclude I~o~on-ctint3i1iingProperry changes Irecausc of chaiigiiig polyitiiiiles, vapor gi-own carhon fihci- t h c niolcailar arcliitecLurc c m he i.isud for rcinfoi-cerl ahminuin composites, to draw inferences I-cgardiug thc striicniid a vcty elegant iricthotl for produciiig turd itifhielice of thc polyiner ailcl 5) A cioscd cel I 111ctnl hone ycmtnli stnictii rcs ccntral datahnsc for estimating poiyiiier properties froin group crmtributioiis coiltailling polyIiicrs. aids iri iiiakiiig vnlirl coiiiparisons hctwecn polyiiieric itiatcrials. Relating Materials Properties to Structure ' 1 ' 1 ~ tcxtbook t h t coiiics with the D.J. David and A. Misra softwire is ~1 excelknt tnuiidatioii lor Tcchiioinic Publisliitig Co., IIIC. ti n dcrst a iit li 11g g e tier3 I poly nit:ric 111a85:l N W H o l l a ~ Ave. ~d ceria1 properties. It also explaiiis how Box 353.5 to usc the software. l'hc coniprehenI.;iricastcr, Pi\ 3 7604 sivc riiuge n F topics covcrccl includc: ISRN # '1-56676-797-0 backgroiiiid on w h y iiiatcrinls differ, + 1 800 233 9936 morphology, molecular frirces, cdoriFnx +'I 717 195 4538 tnctric propcrties, solubility, elcctrical, I1 t tp:/lwww. techpub.com optical, maytictic, niecliaiiical, ~ I I J 7 17 pager;, $ 149.9s (Snficover), I999 acoirstic prupcrtics of po1ymcr.s. Also 'I'he iinique featiirc cif this book i s iii covcrcd are tlic rhcologicd prripertics the softwarc program h i t conics with 06 polymers, fnriiinrioii/deconiposittic book. 'I'lie software nllows riiic: to titiii, theritioplnstic processing, iniscic;ilculnre, with some siiriplifyiiig AS- hility of m e t a l s ccramics rind polyiricrs, suinptions, material propcrties for var- alii1 coinposite propertics. ions po1yiiicr.s. Calculatiiig t t i c Anyone working with polyiners, csiiiiscibility of various polyincrs, espe- pecially those in tlic al'ens of polyincr cially coiiibiiiatiot~siiot a v d a b l c in ilcvelopniciiraiid Eorinulatinn, will find any rcfereiiccs, rcally shows the mefill- this book and solrwarc w r y useful. iicss oi this program. Hnwever, the ;ICcuracy c;in depcticl o i i the c o i i i l ~ i i i ~ ~ i u World ii Class Quality-Using of tnatcrids cliuscn, Lii addition t u the Design of Experiments to niiscihility program, this easy to se, Make i t Happen powerful WiriJows-l)nsed softwnre 2"" I'clition progratii also ctintaiiis fivc morc scpa- K.R. I3liote and A.K. nhotc rate but relnced nnorlules, consisting ok AM ACOM Books A polytner property dntnlme, ill1 clas3 601 I3roaclway toiiicr databasc, :I gcncixl iiiatcrials Ncw York, NY 'I0019 propertics ilatabasc, a snliibility diita- + I 2.12 903 8316 212 90.3 8083 txw, and an ~ s t i m n t o rfor polymer Fax: -1-1 ciuitrcrs, thin film solar. cell, and large arun cadrri iii m SUI fide dcposirioii. Parts

35

ONE OF THESE IS A LICHTENBERG FIGURE AND THE OTHER A SEA URCHIN

0 YOU KNOW THE DIFFERENCE? 11’ not, Scuba Diving is riot ~+ecoiiiinendcrl until you have joiticcl the IEEE Dieleclrics and Elecwic Insulwtioti Sociery. l o r i n f o r m a t h i on m e m b e r s h i p (Student, Member, Scnior Menibel or Affiliate) coiilacl:

Dr. J.K. Nelson, Department of Electric 1”wr hgineerkg, liensselacr Polytechnic Insti tutc, DOY, NY 12180-3590

Tel: + I 518 276 6329 Fax: +1518 276 6226 I h a i l : [email protected]

ISBN: 0-8 144-0427-8 www.~~llanct.~~l$ 5 13 pages, $34.95, Harclcovcr, 1999 World Class Q!ucility i s ;I book devoted to t e ~ l i i n gIiow to usc tlcsigri of ex 13 c r i nr c t i t s (D0 F ) tc c 11iii q 11es i n order to improve the quality oE a process or prtiduct.. The b o r ~ kbcgins b y i h s t r n t i n g the beliefits o f iicing DOE fitid tlic resrllts obtaincd hy v;iriotis coinpatiies, siicli ‘is Motorola. ‘I’lic atithors show aii interestiiig coinpnrison hctwccn vaciotis quality sysrenis atirl thcir strengths a n d wcdkncsses. Thcsc include [SO 9000, ‘1’ot;il Quality Mntiageiri cn I‘, QS-0000, Mal coliii h l d r i g c , idle Europcan Q u d i t y Awiird, s i x-sigmi, 21 tic1 t Iic 11 I ti mate six-sigma. The koolc shows t h a t by fnllnwirig t h e DOE rncthods outlined i n t l i c easy-to-wad wxt, conipanies c ~ i solve i qilality problems t h a t otlicr qufility systctns could not stilvc. lOE techniquus rnngcti f r o m rcrlucirig tinaccuptahly high defect / c v c l s gradually to x r o defect‘s, to incthods in coacliing einployccs to uitderstancl and accept the higticr qii;lliiy system, t h u s incre;isiiig beiictits for all io thc long ruii. I t also explains t h a t statistical process control (SI’(:) i s n o t a prohlcrir solving cool, hut r a t h e r B nionitoriug and mainicnniice tool. It shows how CO iise tliesc DOI; techniqiics to improve the protliict qu:ility in t h e design stagcs, rxdier thaii in tlic field, where q~i:ility iinprnvemenrs arc m u c h more costly. A rechiiic~uci s also decnilecl to iniprove product i d i n b i l i t y . This second cdition reiulorccs tho ceclitiiqucs ~ i w t in l tht. first editioii; i i i addit.iou, it p r t w i d e s cxaiiiplcs o f problcin solviiig siicccss stnries, ;is well a s failiircs; it also rlescrilm adclitional DOE tcchniqi~es,: ~ n dt l i c i d i ability teclmiquc. Aiiyoiie who nianngcs a product linc, qiiality cuutrol cngirieers, procluution cngi ticers, process cnginecrs, iiimagecs, and cornp:my cxccutives will find this h o o k cxti-ciriely infrirmativc niid useCu1 CO tlitir orgnnis;~tioii. %

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