Chapter 1. VLSI Design Methods. Jin-Fu Li. Advanced Reliable Systems (ARES)
Laboratory. Department of Electrical Engineering. National Central University.
VLSI Design Flow, MOS Layers, Stick Diagrams, Design Rules and Layout, ...
Kamran Eshraghian, Eshraghian Dougles and A. Pucknell, Essentials of VLSI.
Chapter 6 VLSI Testing. Jin-Fu Li. Advanced Reliable Systems (ARES)
Laboratory. Department of Electrical Engineering. National Central University.
Jungli ...
Basic design controls serve as the foundation for establishing the physical form,
... This chapter illustrates these basic design controls and their influence on the ...
and MOS Sequential Logic Circuits CMOS, Dynamic Logic Circuit and. Digital
Subsystem Design. C. Subject Code: 040160103. Subject: Basic VLSI Design.
marked on the keyboard are color coded to help you find the one you need ... to
input an alphabetic character, the keyboard ... (ALGEBRA FX 2.0 PLUS only).
Basic design controls serve as the foundation for establishing the physical ... This
chapter illustrates these basic design controls and their influence on.
Syllabus of the M.Tech course in VLSI Design prepared by the Committee. Vide
paper ... The Dean, Faculty of Engineering vide paper read as 4th above,
recommended for .... Pucknell and K. Eshragian., “Basic VLSI Design” 3rd Edition
. PHI, ... circui
Die size, chip yield, and design productivity have so far .... Measure steady-state electrical characteristics ... produced in a manufacturing process is called.
labs in which you will use the Electric VLSI Design System to design the 8-bit
MIPS microprocessor described in the CMOS VLSI Design book. The labs will ...
1. EE366 – CMOS VLSI Design. Hardware Description Languages. Basic
Reference for VHDL. • Reference book: – VHDL by Example by Douglas Perry ...
Engineering) Read Online Douglas A. Pucknell ... Design Silicon systems engineering seriesor read online for free Buy Ba
Benefits of Testing. â¡ Quality and economy are two major benefits of testing .... Powerful 32-bit digital ...... Combine scan with PRSG & signature analysis. MODE.
cmpe222_03process_ppt.ppt. 1. VLSI Digital Systems ... wafers = 300 mm. • Si
crystal structure = diamond ... Silicon dioxide (gate insulator). • SiN = Silicon ...
Basic Concepts in VLSI Physical. Design Automation ... VLSI Design Cycle (contd
.) 1. System specification. 2. ... 28. Static CMOS Design :: General Rule ...
architectures are proposed for computing the integer modulo operation X mod m when m is ... generators that involve arithmetic modulo operations [6]-[8].
VLSI SYSTEM DESIGN for affiliated Engineering Colleges2009-10 .... Sung-Mo
Kang & Yusuf Leblebici, “CMOS Digital Integrated Circuits - Analysis & Design”,.
Principles of CMOS VLSI Design: A Systems Perspective,. 2nd Ed.,. N. H. E.
Weste and K. ... International symposium on Low-Power Electronics & Design.
Textbook: Design of High-Performance Microprocessor Circuits, A.
Chandrakasan, W. ... CMOS Analog Circuit Design, Allen and Holberg, Oxford
University.
Technical Report ECE 95-2. Dept of Electrical ... VLSI chip that computes X mod m where X is a 16-bit number and m = 3;5;6;7;9 and. 10 has been ... The RNS is a carry-free number system that has the fundamental ability to .... can be constructed usin
JAWAHARLAL NEHRU TECHNOLOGICAL UNIVERSITY HYDERABAD. M.Tech.
VLSI SYSTEM DESIGN. COURSE STRUCTURE AND SYLLABUS. I YEAR - I ...
December 31, 2007 Dr. Lynn Fuller. Rochester Institute of Technology.
Microelectronic Engineering. CMOS VLSI DESIGN. Page 1. ROCHESTER
INSTITUTE OF ...
Jul 15, 2011 ... Fullcustom Analog and Mixed Signal Circuit Design. ▫ Sensor circuits ... System
concept, ADC architecture, mismatch analysis,. Design ADC ... Slide 10. Design.
Implementation. P o w e r M a n a g e m e n. P o w e r M a n a g e.
CHAPTER 1. Basic VLSI Design. +. DRAIN. Vdd. - n Type. Silicon. SOURCE.
Figure 1.1: The beginning of the n-channel JFET ...
CHAPTER 1 Basic VLSI Design
+ DRAIN
Vdd -
n Type Silicon SOURCE
Figure 1.1: The beginning of the n-channel JFET
Figure 1.2
Figure 1.3 : p-channel JFET
Fig.1.4 Schematic Symbols . Polysilicon Gate
SiO2 Insulator
D
L W Drain
Source p+
channel
G
G
SB
p+
S
n substrate
substrate connected to V DD
p transistor
Polysilicon Gate
SiO2 Insulator
D
L
D
W Drain
Source n+
channel
G
SB G
n+
S
p substrate
n transistor Figure 1.5 Physical structure of MOS transistors and their schematic icons
S substrate connected to GND
D
N
G
D
G
S
S
Figure 1.6(a): NMOS-transistor
D
P
G
D
G
S
S
Figure 1.6(b): P-transistor
. -G
D
C
G Figure 1.6 (c ): C-switch
.
S
.
VDD
In
Out
Gnd Inverter
Figure 1.7: Transistor schematic of a static complementary inverter.
vdd a
b
vdd a a
o/p
o/p
b
b vss
a
b vss
Fig 1.8 NOR gate schematic
Fig. 19. NAND gate schematic
F1
Q1
D
Cg F Figure 1.10: A dynamic latch circuit.
. Wire segments
Figure 1.11(a): Wires and wire segments.
n-type
p-type
Figure 1.11(b): Schematic symbols for transistors
VDD VDD Pullup Network (p-transistors) Inputs
Out
In
Out
Pulldown Network (n-transistors) Gnd Gnd
Inverter
Figure 1.12: General CMOS Layout structure, Circuit and the Layout diagram of CMOS Inverter.
VDD
In
Out
VSS Figure 1.13: Stick diagram
Metal p-diff n-diff poly Figure 1.14: Stick diagram symbols
Table 1.1 Rules for possible interactions between layers.
VDD
Input voltage In CL
t Gnd Inverter
Figure 1.15: The inverter circuit used for delay analysis
VDD
In CL
t Gnd Inverter
Figure 1.16: Circuit used for power consumption analysis VDD Id,p IL Id,n
a
output CL
b Gnd
Figure 1.17: A pseudo-nMOS NOR gate
VDD
t1
b
t2
a
Figure 1.18: A circuit model for stuck-open faults.
CL
W1 i1 i2
A D
i3 i4
B
i5 i6 i7 i8
C
W2
F
O1
G
O2
E
Figure1.19: Testing for combinational faults.
Row-based
Symmetrical Array
Interconnect Interconnect
Logic Block
Logic Block
Interconnect Overlayed on Logic Blocks
Interconnect
Sea-of-Gates
Hierarchical PLD
Fig. 1.20 Commercially available FPGA architectures 1 PO
2 PO
4 PI
3 PO
5 PI
8 PI
6
9PI
10PI
7
11PI
Fig 1.21 Initial 3-restricted DAG 1
2
3
4
5
10 11
8
9
Fig. 1.22 Mapping of the 3-restricted DAG by four 3-LUTs connection between wire segments in x and y axes and also vias.
Fig.1.23
3-D FPGA architecture
CHAPTER 2 VLSI CAD BEHAVIOR
System
STRUCTURAL
Register transfer
Processors, Memories
Algorithms, flowcharts
Logic
Registers, flipflops, MUX Gates
Register Transfer
Circuit
Boolean expression Transfer function
Transistors
Cell layout
Modules
Boards PHYSICAL
Figure 2.1: Y-chart
CHAPTER 3 Partitioning in High Level Synthesis A_PORT
B_PORT
START CLK M_OUT
DONE
Entity MULT is Port (A_PORT, B_PORT: in bit _ vector(3 down to 0); M_PORT: out bit _vector (7 down to 0); CLK: in BIT START: in BIT DONE: out BIT; ); end MULT;
Architecture SHIFT_MULT of MULT is begin begin process variable A,B,M: BIT_VECTOR variable COUNT: INTEGER begin wait until (START =1) A:= A_PORT; COUNT :=0; B:=B_PORT; DONE
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