DE215 Technical Data Sheet

DE215 Technical Data Sheet Jul.2008

DE215 Technical Data Sheet Product Description

Typical Properties of Cured Material

DE215 is halogen-free (with RHos standards) epoxy

Cured for 30 minutes @150℃

adhesive which used for surface mount device, especially

Physical Properties:

for kinds of syringe dot device(25,000~50,000PH).

Density,g/cm3

＞1.2

According to the demand of which social effects of pollution

Glass Transition Temperature, Tg,

≥90℃

it is designed for use in Pb-Free soldering which require

Coefficient of Thermal Expansion,

high temperature.

ASTM D696,K-1

40-110

Typical Usage Put SMT chip printed on circuit board prior to wave soldering. It is especially suite the hot sensitive chips which require low temperature to cure.

Typical Properties of Uncured Material Chemical Type

Epoxy

Appearance

Red Paste

Specific Gravity @25℃

1.25-1.45

Viscosity,5rpm,Pa.s @25℃

450

Thixo ratio

≥6.5

Particle Size,μm

≤80

Electrical Properties: Dielectric Constant / Loss, ASTMD 150 Dielectric Constant

Recommended Curing Condition

Loss

100Hz

2.69

0.006

100kHz

2.63

0.009

150℃,60Secs. (After the temperature of the base over 100 ℃). Rate of cure and final strength will depend on the

Volume Resistivity, ASTM D257, Ω.cm

≥2.1 x 1015

residence time at the cure temperature and the degree of

Surface Resistivity, ASTM D257，Ω

≥2.0 x 1015

the hot compensated to chip.

Electrolytic Strength, kV/mm

≥30

Recommended Curing Temperature Graph The following graph shows the rate of torque strength

Performance of Cured Material

developed with time at different temperatures. These times

Cured for 30minutes @150℃

are defined from the moment the adhesive reaches cure

Shear Strength on grid Blasted Mild Steel,

temperature. In practice, total oven time may be longer to

CMT6104

allow for heat up period.

≥2500

Chip Type

Dispensing Quality

Adhesive Sterngth

0603C

0.15mg

1.80kg

0603R

0.15mg

1.91kg

0805C

0.20mg

1.92kg

0805R

0.20mg

2.25kg

1206

0.25mg

2.85kg

Bond strength achieved in practice will vary considerably depending on the SMT chip type, adhesive dot size and shape, and the degree of cure and the type of the solder Document Number：DE-WI-R-048

Edition：1.0 Page 1 of 2

DE215 Technical Data Sheet Jul.2008

DE215 Technical Data Sheet cross contamination with other epoxy or acrylic adhesive by

resist.

ensuring dispense nozzles, adapters etc are thoroughly cleaned. Do not leave dirty nozzles on dispensing

Typical Environmental Resistance

equipment while not in use or soaking in solvents for long

Test method:

CMT6104

periods of time. The quantity of adhesive depending on the

Base material:

GEMS sheared sample

dispense pressure, time, nozzle size and temperature.

Cure method:

Cured for 30minutes @150℃

These parameters will vary depending on the type of dispensing system use and should be optimized accordingly. Dispensing temperature should ideally be controlled at a

HOT Strength

value between 30-38℃ for optimum results, and higher dispense temperatures are not recommended.

Storage Product shall be ideally stored in a cool, dry location in unopened containers at a temperature between 2°C to 10°C unless otherwise labeled. Adhesive stored in refrigerator must be come back to room temperature before it is used. To prevent contamination of unused product, do not return

Aged under temperature indicated

any material to its original container.

Resistance to Hot Solder Dip

If additional information is required, please contact Dover

In accordance with IPO SM817 (2.4.42.1) standard, DE215

Technical Service Center.

passed the hot solder dip test and it is qualified.

Note General Information

All data accounted herein are for your reference only and are

This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be selected as a

believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user's responsibility to determine

sealant for chlorine or other strong oxidizing materials. For safe handling information on this product, consult the

suitability for the user's purpose of any production methods mentioned herein and to adopt such precautions as may be

Material Safety Data Sheet (MSDS).

advisable for the protection of property and of persons against any hazards that may be involved in the handling

Usage Manual

and use thereof.

DE215 is supplied de-aerated in a range of ready- to-use syringes which fit straight into a variety of air pressure/time dispensing system commonly available. After storage in a refrigerator the adhesive must be allowed to equilibrate to room temperature before use, typically 24 hours. Avoid NOT FOR PRODUCT SPECIFICATIONS THE TECHNICAL INFORMATION CONTAINED HEREIN IS INTENDED AS REFERENCE ONLY Document Number：DE-WI-R-048

Edition：1.0 Page 2 of 2